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| PR Newswire · Aktuelle PR Newswire Nachrichten · Archiv< zurück < · Druckversion |
| 31.10.2006 14:13 |
Surfect Holdings, Inc. Announces Participation in the International Wafer-Level Packaging Conference |
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ALBUQUERQUE, N.M., Oct. 31 /PRNewswire-FirstCall/ -- Surfect Holdings, Inc. (BULLETIN BOARD: SUFH) , announced today that its subsidiary, Surfect Technologies, Inc., a design and manufacturing company offering an innovative single cell electroplating tool and process for the semiconductor industry will present at this years International Wafer-Level Packaging Conference in San Jose, CA on November 2, 2006. The objective of this conference is to bring new scientific and technical developments to light in semiconductor wafer-level packaging. Surfect Technologies, Inc. is taking an aggressive position in the marketplace with the introduction of their new product offerings. Surfect Technologies' innovative single-cell electro-deposition process and tool capabilities enable low cost manufacturing of bumps on wafers (200mm or 300mm) at high speeds. The Surfect machine Models; Ascent 200mm, and Leapfrog 300mm, provide customers with the high utilization rates needed to meet the demanding production needs of wafer bumping and through-hole via plating. Commenting on the IWLPC Conference, Mr. Steve Anderson (CEO) stated "We are very excited to have this opportunity to present at this year's event in San Jose, CA. We believe that our new tool and process technology will add significant value to the conference's discussion covering wafer-level bumping and wafer scale packaging developments. The IWLPC conference is a perfect forum for Surfect Technologies and other companies to present the latest developments critical for the advancement of wafer level interconnect", said Mr. Anderson. "We believe that packaging interconnect development at the wafer level is a key enabler for continued miniaturization and innovation required for the growth of consumer electronics. This IWLPC conference is focused on wafer level interconnect as well as advanced 3D packaging and we look forward to supporting these technologies. We feel it is important to support industry events such as the IWLPC conference and look forward to future forums with industry experts." About Surfect Holdings, Inc. Surfect Holdings, through its operating subsidiary Surfect Technologies, Inc., is a design and manufacturing company offering an innovative single cell electroplating tool and process that utilizes the industry first, programmable Plating Computer(TM) to fabricate high performance, low-cost interconnects, providing immediate solutions to the back-end of the semiconductor manufacturing process. Additional information is available on the Surfect Technologies website at http://www.surfect.com/ Safe Harbor Certain statements contained in this press release are "forward-looking statements" within the meaning of applicable federal securities laws, including, without limitation, anything relating or referring to future financial results and plans for future business development activities, and are thus prospective. Forward-looking statements are inherently subject to risks and uncertainties some of which cannot be predicted or quantified based on current expectations. Such risks and uncertainties include, without limitation, the risks and uncertainties set forth from time to time in reports filed by the company with the Securities and Exchange Commission. Although the company believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Consequently, future events and actual results could differ materially from those set forth in, contemplated by, or underlying the forward the forward-looking statements contained herein. The company undertakes no obligation to publicly release statements made to reflect events or circumstances after the date hereof. © 2010 PR Newswire |
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