SAN JOSE, Calif., April 25, 2012 /PRNewswire/ -- GainSpan® Corporation, a leader in low power embedded Wi-Fi and Wi-Fi connectivity for the Internet of Things, today introduced reference design code for Texas Instruments' MSP430 that significantly reduces the development time to add Wi-Fi connectivity to embedded systems based upon this microcontroller (MCU). This new code makes it possible for designers to rapidly develop their application on the MSP430 and easily communicate with a GainSpan Wi-Fi module of choice through a serial interface, using straightforward AT commands, with the GainSpan Wi-Fi module providing all Wi-Fi and networking functionalities.
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Now, customers developing MSP430-based products can quickly and easily add GainSpan low power Wi-Fi connectivity and take advantage of advanced networking features and capabilities not readily available with other Wi-Fi modules including enterprise security, embedded DHCP, DNS and HTTP (S) servers, wireless provisioning, and over the air firmware upgrades.
As with similar reference design code provided by GainSpan for other MCUs, the new reference design code running on the MSP430 includes both SPI and UART drivers, a hardware adaptation layer (HAL), and an MCU-independent application layer that includes the AT library.The Application code includes UDP, TCP and HTTP traffic, supports multiple concurrent sockets and AP functionality. This code is easily portable to other host microcontrollers.
With its small RAM and ROM (Flash) footprint, the MSP430 reference code can run on the most memory constrained MCUs. Even when including the drivers, UDP, TCP and multiple sockets, it uses less than 8 Kbytes of flash and 2 Kbytes of RAM and can be used with the IAR Embedded Workbench Kickstart Edition.
"In addition to our strong partnerships with microcontroller leaders like Freescale and Renesas, and associated Wi-Fi boards and software solutions we provide to our joint customers, we provide Reference Design code in support of other popular MCU's in response to the needs of our customers," said Bernard Aboussouan, vice president of marketing at GainSpan.
GainSpan offers a wide range of low-power Wi-Fi connectorized or pin compatible soldered down modules, with output power ranging from 9 to 18 dBm with options for built-in trace or external antenna through a U.FL connector. Most operate over an industrial operating temperature range of -40 to 85 degrees Celsius and are certified or pre-certified for all major regulatory requirements including FCC, IC and ETSI.
Customers can easily select host interfaces, security, provisioning methods, Wi-Fi and networking features running on the modules, and build a customized binary for their embedded devices, without the need of an expensive compiler. The SDK-Builder, a low cost, web-based tool, provides a baseline default configuration (essential wireless stack features, WPA/WPA-2 personal security and networking services) and lets developers choose software features and functionalities via a menu.
Availability
The new MSP430 reference design code is available now and can be downloaded from GainSpan's website.
About GainSpan Corporation
GainSpan is the leading semiconductor solutions company in low power Wi-Fi and Wi-Fi connectivity for the Internet of Things. Its easy-to-use system-on-chip (SoC), modules and software, let customers leverage the large installed base of Wi-Fi access points and smartphones to create connected products for healthcare, smart energy and control/monitoring in industrial, commercial and residential markets. The solutions feature an ultra low power SoC that consumes just a few uA of standby current and goes from standby to active mode in a few ms, ideal for battery operated devices requiring long life. The Wi-Fi chiphandles all Wi-Fi functionalities, networking and security stacks, offloading when required the host MCU and accelerating wireless development cycles. www.gainspan.com.
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Media Contact:
Carol Felton, Communications & PR
GainSpan Corporation
T | 408-807-3780
carol.felton@gainspan.com
SOURCE GainSpan Corporation
