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Research and Markets - Global Front End of the Line Semiconductor Equipment Market CAGR Growth of 1.78% by 2020 - Trends, Technologies & Opportunities Report 2016-2020 - Key Vendors: Nikon, Tokyo Electron, KLA-Tencor

DUBLIN, September 6, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "Global Front End of the Line Semiconductor Equipment Market 2016-2020" report to their offering.

The global front-end-of-the-line (FEOL) semiconductor equipment market is forecast to grow at a CAGR of 1.78% during the period 2016-2020.

Commenting on the report, an analyst from the research team said that proliferation of automotive electronics is one of the trends spurring growth for the market. The automotive market is going through a lot of changes with electronics such as advanced driver assistance systems (ADAS), connected vehicles, and electric energy, having good growth potential. In the future, most of the automobile buying decisions will be made based on the electronics content of the vehicles and the associated services. In 2015, 70 million units of cars were sold globally, and 73.54 million units will be sold in 2016. The semiconductor content will increase in vehicles during the forecast period.

According to the report, increase in number of fabs worldwide is a key driver aiding to the growth of this market. Financial services are one of the most data-intensive industries. The semiconductor market will see a high demand for semiconductor chips and memory devices from 2017 onward due to the growing adoption of IoT, high demand for connected devices, and increased vehicle automation. Semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment for new facilities will be for the development of memory and logic ICs due to their high demand.

Further, the report states that high cost of equipment is challenge the market is facing. Semiconductor manufacturing equipment is expensive. The cost of constructing a semiconductor fab is between $3 and $4 billion, with equipment accounting for the majority of this cost. By 2020, a semiconductor fab will cost around $20 billion. This is because of the growing adoption of 3D packaging solutions like TSV, stacked packaging, flip chip packaging, and MEMS packaging, which require upgraded equipment. The price of equipment varies widely, depending on its function.

Questions Answered:

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

Companies Mentioned:

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron
  • Dainippon Screen Manufacturing
  • Hitachi High-Technologies
  • Nikon
  • Hitachi Kokusai Electric

Report Structure:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Technology landscape

PART 06: Market landscape

PART 07: Market segmentation by product

PART 08: Market segmentation by end-user

PART 09: Geographical segmentation

PART 10: Key leading countries

PART 11: Market drivers

PART 12: Impact of drivers

PART 13: Market challenges

PART 14: Impact of drivers and challenges

PART 15: Market trends

PART 16: Vendor landscape

PART 17: About the Author

For more information about this report visit http://www.researchandmarkets.com/research/2dwtpt/global_front_end

Related Topics: Semiconductor

Media Contact:

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com

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