Qimonda AG and Nanya Technology Corporation today
announced the successful qualification of the 75nm DRAM Trench
technology, and of the first 75nm product they are each offering to
the market, a 512Mb DDR2 memory chip. This next generation technology
platform features minimum structure sizes down to 70nm. The technology
and 512Mb DDR2 product have been jointly developed at Qimonda's
Development Centers in Dresden and Munich, Germany. Volume production
in the new DRAM technology generation has been started at Qimonda's
300mm production line in Dresden.
"With the qualification of our 75nm DRAM Trench technology and the first product we have reached an important milestone on our technology roadmap," said Thomas Seifert, Member of the Management Board, Market and Operations at Qimonda. "The 75nm technology platform satisfies the performance requirements of upcoming high speed interfaces such as used for DDR3 and graphics products."
"This new product features leading edge technologies with minimum geometries as small as 70nm," said Dr. Pei Lin Pai, Vice President of Global Sales & Marketing and Spokesman of Nanya Technology Corporation. "The advanced technologies enable us for high performance and high density, such as 1Gb / 2Gb DRAM, with competitive cost structure."
The 512Mb DDR2 product in the 75nm technology that has now been qualified meets the performance requirements at the maximum JEDEC defined DDR2 speed for high end server and computing applications and demonstrate the capability of the company's 75nm technology for future high speed DRAM products. The introduction of the 75nm technology is not only important for next generation performance requirements but also a further step to improve Qimonda's and Nanya's cost position. Process structures of 75nm further reduce chip size compared to the previous 90nm technology thereby increasing potential chip output per wafer by about 40 percent.
About Nanya Technology
Nanya Technology Corporation, a member of the Formosa Plastics Group, is a global leader in advanced memory semiconductors, focusing on research and development, designing, manufacturing, and sales of DRAM products. The company currently owns two 200mm fabs in NanKan, Taoyuan and Linko city. The company's Fab-3 (300mm), located in Taishan, Taipei, is under construction and planned to be in production in 4Q, 2007. Nanya has launched joint development programs for the 90nm, 70nm and 60nm DRAM technology generations and a 300mm joint venture (Inotera Memories, Inc.) with Infineon Technologies AG from December 2002 to remain competitive in the upcoming "nanometer" era. Nanya Technology Corporation leads the DRAM industry, with advanced technologies, right products, a strong customer base, and a world-class management team. Further information is available at www.nanya.com.
About Qimonda
Qimonda AG, which was carved out from Infineon Technologies AG on May 1st, 2006, and went public at the New York Stock Exchange on August 9th, 2006, is a leading global producer of DRAM memory products. Qimonda was the second largest DRAM supplier by revenue in the first half of the calendar year 2006 (according to the industry research firm Gartner Dataquest). Qimonda generated net sales of EUR 2.8 billion in its 2005 financial year and has approximately 12,000 employees worldwide. The company has access to five 300mm manufacturing sites on three continents and operates five major R&D facilities, including its lead R&D center in Dresden. The company is a leading supplier of DRAM products to PC and server manufacturers and is increasingly focusing on products for graphics, mobile and consumer applications as well using its power saving trench technology. Further information is available at www.qimonda.com.
Disclaimer
This press release may contain forward-looking statements. Statements that are not historical facts, including statements about our beliefs and expectations, are forward-looking statements. These statements are based on current plans, estimates and projections, and you should not place too much reliance on them. These forward-looking statements speak only as of the date they are made, and we undertake no obligation to update any of them in light of new information or future events. These forward-looking statements involve inherent risks and are subject to a number of uncertainties, including trends in demand and prices for semiconductors generally and for our products in particular, the success of our development efforts, both alone and with our partners, the success of our efforts to introduce new production processes at our facilities and the actions of our competitors, the availability of funds for planned expansion efforts, the outcome of antitrust investigations and litigation matters, as well as other factors. We caution you that these and a number of other important factors could cause actual results or outcomes to differ materially from those expressed in any forward-looking statement. These factors include those identified under the heading 'Risk Factors' in our initial public offering prospectus on Form F-1.
"With the qualification of our 75nm DRAM Trench technology and the first product we have reached an important milestone on our technology roadmap," said Thomas Seifert, Member of the Management Board, Market and Operations at Qimonda. "The 75nm technology platform satisfies the performance requirements of upcoming high speed interfaces such as used for DDR3 and graphics products."
"This new product features leading edge technologies with minimum geometries as small as 70nm," said Dr. Pei Lin Pai, Vice President of Global Sales & Marketing and Spokesman of Nanya Technology Corporation. "The advanced technologies enable us for high performance and high density, such as 1Gb / 2Gb DRAM, with competitive cost structure."
The 512Mb DDR2 product in the 75nm technology that has now been qualified meets the performance requirements at the maximum JEDEC defined DDR2 speed for high end server and computing applications and demonstrate the capability of the company's 75nm technology for future high speed DRAM products. The introduction of the 75nm technology is not only important for next generation performance requirements but also a further step to improve Qimonda's and Nanya's cost position. Process structures of 75nm further reduce chip size compared to the previous 90nm technology thereby increasing potential chip output per wafer by about 40 percent.
About Nanya Technology
Nanya Technology Corporation, a member of the Formosa Plastics Group, is a global leader in advanced memory semiconductors, focusing on research and development, designing, manufacturing, and sales of DRAM products. The company currently owns two 200mm fabs in NanKan, Taoyuan and Linko city. The company's Fab-3 (300mm), located in Taishan, Taipei, is under construction and planned to be in production in 4Q, 2007. Nanya has launched joint development programs for the 90nm, 70nm and 60nm DRAM technology generations and a 300mm joint venture (Inotera Memories, Inc.) with Infineon Technologies AG from December 2002 to remain competitive in the upcoming "nanometer" era. Nanya Technology Corporation leads the DRAM industry, with advanced technologies, right products, a strong customer base, and a world-class management team. Further information is available at www.nanya.com.
About Qimonda
Qimonda AG, which was carved out from Infineon Technologies AG on May 1st, 2006, and went public at the New York Stock Exchange on August 9th, 2006, is a leading global producer of DRAM memory products. Qimonda was the second largest DRAM supplier by revenue in the first half of the calendar year 2006 (according to the industry research firm Gartner Dataquest). Qimonda generated net sales of EUR 2.8 billion in its 2005 financial year and has approximately 12,000 employees worldwide. The company has access to five 300mm manufacturing sites on three continents and operates five major R&D facilities, including its lead R&D center in Dresden. The company is a leading supplier of DRAM products to PC and server manufacturers and is increasingly focusing on products for graphics, mobile and consumer applications as well using its power saving trench technology. Further information is available at www.qimonda.com.
Disclaimer
This press release may contain forward-looking statements. Statements that are not historical facts, including statements about our beliefs and expectations, are forward-looking statements. These statements are based on current plans, estimates and projections, and you should not place too much reliance on them. These forward-looking statements speak only as of the date they are made, and we undertake no obligation to update any of them in light of new information or future events. These forward-looking statements involve inherent risks and are subject to a number of uncertainties, including trends in demand and prices for semiconductors generally and for our products in particular, the success of our development efforts, both alone and with our partners, the success of our efforts to introduce new production processes at our facilities and the actions of our competitors, the availability of funds for planned expansion efforts, the outcome of antitrust investigations and litigation matters, as well as other factors. We caution you that these and a number of other important factors could cause actual results or outcomes to differ materially from those expressed in any forward-looking statement. These factors include those identified under the heading 'Risk Factors' in our initial public offering prospectus on Form F-1.
© 2006 Business Wire
