- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 02.06. | Aixtron's CCS R&D system to be centerpiece of Penn State's new semiconductor lab | ||
| 02.06. | Power Integrations unveils space-saving, ultra-slim auxiliary PSU reference designs for NVIDIA Kyber 800VDC AI data center | ||
| 01.06. | Wolfspeed launches data-center solutions team in Silicon Valley | ||
| 01.06. | QPT opens customer demos of MicroDyno test platform | ||
| 01.06. | BluGlass executes $1m option shortfall agreement, plus potential extra $500,000 | ||
| 01.06. | Latest issue of Semiconductor Today now available | ||
| 29.05. | Infineon joins NVIDIA's MGX AI Factory ecosystem | ||
| 29.05. | Infineon introduces first silicon carbide power module operating at 205°C | ||
| 29.05. | IQE's full-year 2025 revenue falls 17.6%, as 40% drop in wireless outweighs 15% growth in photonics | ||
| 28.05. | Purdue and Taiwan's GCCS partner to scale silicon carbide substrates to 8- and 12-inches | ||
| 28.05. | RFMW to distribution RFHIC's GaN RF and microwave solutions worldwide | ||
| 28.05. | IQE completes £81m fundraising | ||
| 27.05. | Microchip launches 3.3kV HV D3 mSiC power modules to enable solid-state transformers for AI data centers | ||
| 27.05. | ST adds 700V PowerGaN devices to STPOWER portfolio | ||
| 26.05. | Altum RF showcasing products and expertise at IMS 2026 | ||
| 26.05. | Infineon presenting at PCIM Europe 2026 | ||
| 26.05. | ROHM exhibiting at PCIM Europe | ||
| 22.05. | Aeluma's CEO Jonathan Klamkin to receive IPRM Award | ||
| 22.05. | Navitas showcasing GaN and SiC-based solutions for AI data-center, energy and grid infrastructure, and industrial electrification at PCIM | ||
| 22.05. | EPC showcasing GaN power solutions at PCIM | ||
| 22.05. | Infineon adds devices to CoolGaN BDS 40V G3 family | ||
| 22.05. | Nanopillar GaN LED arrays for VR and AR | ||
| 22.05. | Texas Tech receives $4.5m TSIF grant for wide/ultrawide-bandgap R&D | ||
| 22.05. | Wolfspeed introduces 3.3kV SiC power modules in two industry-standard footprints | ||
| 22.05. | Toshiba starts test-sample shipments of 1200V trench-gate SiC MOSFET for AI data centers |
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