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Zeit	Aktuelle Nachrichten
17:21	Power module packaging materials market growing at 8.2% CAGR to $1.9bn in 2023
14:21	Seoul Semiconductor wins LED bulb patent litigation against Philcor
Do	DSFP transceiver MSA releases Hardware Specification Rev. 1.0
Do	Finisar presenting at ECOC
Do	Oclaro to demo 100-200G coherent CFP2-DCO at ECOC
Do	100G Lambda MSA announces progress towards 100Gb/s optical technology product maturity
Do	Source Photonics and Ixia to demo maturity of 400G-LR8 platform at ECOC, enabling migration to higher data rates
Do	II-VI presenting at ECOC Market Focus on optics in cloud computing and at Special Workshop on 3D sensing
Do	Oclaro showcasing portfolio of high-speed lasers for access and wireless networks at ECOC
Do	Skyworks launches LTE universal front-end module for IoT applications
Mi	Leti-led EU project REDFINCH to develop PIC-based mid-IR portable sensors for chemical detection in gases and liquids
Mi	GaN Systems appoints Arrow Electronics as distributor in EMEA
Mi	Delta uses Transphorm's high-voltage GaN FETs to shrink power supply by 25%
Mi	Osram launches its first VCSEL
Mi	Osram launches compact broadband infrared LED for integrating spectroscopy into smartphones
Mi	Plessey orders Aixtron AIX G5+ C MOCVD system for GaN-on-Si monolithic micro-LEDs
Mi	Anokiwave joins 5G O-RAN alliance as contributing member
Di	5G GaN2 project developing 28GHz, 38GHz and 80GHz demonstrators for 5G cellular network base stations
Di	US Air Force's GaN technology to be transferred to BAE Systems' Advanced Microwave Products Center
Di	QSFP-DD MSA Group releases updated 4.0 Hardware Specification and Common Management Interface Specification
Di	Teledyne e2v HiRel launches highest-voltage 650V/60A bottom-side-cooled GaN FET
Di	Skyworks' launches family of FEMs for LPWAN IoT and industrial applications
Mo	Thermco Systems expands global operations with acquisition of CSD Epitaxy
Mo	SemiGen boosts contract manufacturing capability
Mo	Lumentum to participate in nine tradeshows in next four months

Zeit

Aktuelle Nachrichten

17:21

Power module packaging materials market growing at 8.2% CAGR to $1.9bn in 2023

14:21

Seoul Semiconductor wins LED bulb patent litigation against Philcor

DSFP transceiver MSA releases Hardware Specification Rev. 1.0

Finisar presenting at ECOC

Oclaro to demo 100-200G coherent CFP2-DCO at ECOC

100G Lambda MSA announces progress towards 100Gb/s optical technology product maturity

Source Photonics and Ixia to demo maturity of 400G-LR8 platform at ECOC, enabling migration to higher data rates

II-VI presenting at ECOC Market Focus on optics in cloud computing and at Special Workshop on 3D sensing

Oclaro showcasing portfolio of high-speed lasers for access and wireless networks at ECOC

Skyworks launches LTE universal front-end module for IoT applications

Leti-led EU project REDFINCH to develop PIC-based mid-IR portable sensors for chemical detection in gases and liquids

GaN Systems appoints Arrow Electronics as distributor in EMEA

Delta uses Transphorm's high-voltage GaN FETs to shrink power supply by 25%

Osram launches its first VCSEL

Osram launches compact broadband infrared LED for integrating spectroscopy into smartphones

Plessey orders Aixtron AIX G5+ C MOCVD system for GaN-on-Si monolithic micro-LEDs

Anokiwave joins 5G O-RAN alliance as contributing member

5G GaN2 project developing 28GHz, 38GHz and 80GHz demonstrators for 5G cellular network base stations

US Air Force's GaN technology to be transferred to BAE Systems' Advanced Microwave Products Center

QSFP-DD MSA Group releases updated 4.0 Hardware Specification and Common Management Interface Specification

Teledyne e2v HiRel launches highest-voltage 650V/60A bottom-side-cooled GaN FET

Skyworks' launches family of FEMs for LPWAN IoT and industrial applications

Thermco Systems expands global operations with acquisition of CSD Epitaxy

SemiGen boosts contract manufacturing capability

Lumentum to participate in nine tradeshows in next four months

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