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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 10:43 | Navitas files further patent infringement lawsuit against Renesas | ||
| Do | Polar Light signs first optical interconnect agreement leveraging micro-LED technology platform | ||
| Do | Aeluma selects Aixtron G10-AsP to expand photodetector and laser manufacturing capacity | ||
| Mi | Aixtron's revenue grow 60% in Q3, driven by opto demand for AI data centers | ||
| Mi | JX and OXIDE enter into capital and business alliance agreement | ||
| Mi | Visteon, SHINRY and Infineon collaborate on single-stage onboard charger with GaN BDS technology | ||
| Mi | WT to distribute Sivers' InP lasers and wireless solutions | ||
| Mi | Nexperia expands SiC portfolio with 750V trench MOSFETs for high-efficiency power conversion | ||
| Mi | Diamond Foundry unveils first 200mm single-crystal diamond | ||
| Di | Cree LED launches XLamp X21 Multi-Color LEDs | ||
| Di | CGD partners with Ricardo on developing traction inverters for Nissan-led venture | ||
| Di | Nexperia adds ultra-low-resistance GaN FETs for next-gen power density and efficiency | ||
| Di | Staera emerges from stealth with $4.6m in pre-seed funding | ||
| Di | Mitsubishi Electric suppresses frequency dispersion in GaN transistors using GaN substrates | ||
| Di | onsemi introduces EliteSiC M4 fourth-gen silicon carbide platform, with up to 30% higher power density and 35% lower losses | ||
| Mo | Infineon presents first functional power devices on 300mm SiC wafers | ||
| Mo | EPIGAP OSA launches multi-wavelength, high-power LED module, operating from visible to near-infrared | ||
| Mo | onsemi and Czech Republic agree to conclude SiC expansion project, but reaffirm partnership | ||
| Mo | Plasmability's IceMaker CVD diamond growth system now offered through LattiSpec | ||
| 06.11. | AOI announces equity grants under Inducement Plan | ||
| 06.11. | Guerrilla RF enhances corporate governance by appointing David Bell as chairman | ||
| 06.11. | Wide-bandgap materials and devices market to grow at 10.5% CAGR from $11.24bn in 2026 to $16.75bn by 2030 | ||
| 05.11. | AOI agrees new credit facility providing $30m in revolving commitments and $170m in initial term loan commitments | ||
| 05.11. | GaNrich providing 40-1200V GaN power device portfolio | ||
| 05.11. | Infineon and SOLUM strengthen collaboration on HVDC power solutions for AI data centers |
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