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Aktuelle News von Semiconductor Today

  • 24 h
  • letzte 200 News
ZeitAktuelle Nachrichten
10:42EPC adds 3-phase BLDC motor drive inverter evaluation board for humanoid robot joint applications
DiUV LED prices rising by 5% in Q1 due to increased material and labor costs
DiCompound semiconductor materials market growing at 14% CAGR to almost $5.2bn by 2031
DiAyar Labs names Sankara Venkateswaran as VP of engineering
DiBluGlass secures A$190,000 order from TOPTICA for custom GaN visible lasers
DoUltraviolet superluminescent diodes
DoLuminus leverages APC partnership to enhance energy-efficient LED lighting solutions
DoPhoton Bridge demos >30mW laser output per color at wafer scale on silicon photonics
18.02.SemiQ debuting SiC power solutions for AI data centers and high-power infrastructure at APEC
18.02.Fraunhofer ISE achieves record efficiencies for tandem photovoltaic modules
17.02.Wolfspeed adds VP of sales for EMEA
17.02.Tower and Scintil announce availability of first heterogeneously integrated DWDM lasers for AI infrastructure
17.02.ams OSRAM and Meizhi settle patent disputes over LEDs used in Spider Farmer luminaires
17.02.SDI buys PRP Optoelectronics for £9.3m
16.02.SemiQ partners with distributor NAC Semi across North America
16.02.Nitride Global, USLLC and Axiom Space awarded NASA SBIR grant
16.02.Wolfspeed's soft demand for EV application offset by 50% quarterly revenue growth for AI data-center application
13.02.NUBURU activates Q1 production ramp for 40 high-power blue laser systems
13.02.Navitas unveils fifth-generation SiC Trench-Assisted Planar MOSFET technology
12.02.UK-Bulgaria collaboration developing Green Silicon Carbide wafer factory
11.02.Wolfspeed accelerates AI-powered manufacturing and operations with Snowflake
11.02.HexaTech launches 3"-diameter aluminium nitride substrate
11.02.NUBURU completes first tranche of preferred equity restructuring
11.02.Renesas licenses EPC's low-voltage eGaN technology to complement its 650V+ portfolio
10.02.Violumas launches new 255nm, 265nm and 275nm LEDs in mid-power, high-power, and high-density packages