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Zeit	Aktuelle Nachrichten
Do	NREL outlines where thin-film solar technologies can be flexible
Do	Skyworks reports record quarterly revenue of $1.008bn, and ninth consecutive record year
Mi	ON Semiconductor partners with Keysight for power device EDA
Mi	EVG and Plessey partner on GaN-on-Si monolithic micro-LED technology for AR applications
Mi	Skyworks ramps LoRa-based modules for high-growth IoT applications
Mi	3-5 Power Electronics secures financing from Sturm Family Office
Mi	ROHM unveils 1700V SiC power module with high reliability in extreme environments
Mi	Edwards opens new service & support facility in Arizona
Di	IQE reduces 2018 Photonics wafer revenue guidance from 35-50% to 11% after VCSEL-making customer cuts guidance
Di	Qorvo reduces December-quarter revenue, gross margin and earnings guidance
Di	MIRPHAB offering firms design, production and business planning for developing mid-IR devices for chemical sensing and spectroscopy
Di	Sofradir elected to Photonics21 board of stakeholders
Di	EpiGaN orders Aixtron AIX G5+C MOCVD system to expand large-diameter GaN-on-Si and GaN-on-SiC epi production
Di	Skyworks deploys 5G infrastructure solutions enabling high-capacity small-cell and massive MIMO platforms
Di	Lextar launches its first VCSEL products for 3D depth-sensing
Di	Lumentum reduces December-quarter revenue, operating margin and earnings guidance
Mo	Protecting 'Made in America' ingenuity
Mo	CSC to participate in UK Industrial Strategy Challenge Fund program KAIROS to develop and commercialize quantum technologies
Mo	IHP and EVG co-developing low-temperature covalent wafer bonding for next-gen wireless and broadband communication devices
Mo	POET receives first orders for Optical Interposer Solutions
Mo	Exagan extends range of G-FET and G-DRIVE power-conversion products for multi-kilowatt server and automotive applications
Mo	Infineon acquires wafering technology firm Siltectra
Mo	Lumentum's quarterly revenue rises 45.6% year-on-year to $354.1m, driven by telecom and fiber-laser demand
Mo	MRSI announces HVM3 die bonding demonstration capability in Shenzhen
Mo	Arrow Electronics expands distribution agreement with Cree's Wolfspeed Division to include Power & RF products

Zeit

Aktuelle Nachrichten

NREL outlines where thin-film solar technologies can be flexible

Skyworks reports record quarterly revenue of $1.008bn, and ninth consecutive record year

ON Semiconductor partners with Keysight for power device EDA

EVG and Plessey partner on GaN-on-Si monolithic micro-LED technology for AR applications

Skyworks ramps LoRa-based modules for high-growth IoT applications

3-5 Power Electronics secures financing from Sturm Family Office

ROHM unveils 1700V SiC power module with high reliability in extreme environments

Edwards opens new service & support facility in Arizona

IQE reduces 2018 Photonics wafer revenue guidance from 35-50% to 11% after VCSEL-making customer cuts guidance

Qorvo reduces December-quarter revenue, gross margin and earnings guidance

MIRPHAB offering firms design, production and business planning for developing mid-IR devices for chemical sensing and spectroscopy

Sofradir elected to Photonics21 board of stakeholders

EpiGaN orders Aixtron AIX G5+C MOCVD system to expand large-diameter GaN-on-Si and GaN-on-SiC epi production

Skyworks deploys 5G infrastructure solutions enabling high-capacity small-cell and massive MIMO platforms

Lextar launches its first VCSEL products for 3D depth-sensing

Lumentum reduces December-quarter revenue, operating margin and earnings guidance

Protecting 'Made in America' ingenuity

CSC to participate in UK Industrial Strategy Challenge Fund program KAIROS to develop and commercialize quantum technologies

IHP and EVG co-developing low-temperature covalent wafer bonding for next-gen wireless and broadband communication devices

POET receives first orders for Optical Interposer Solutions

Exagan extends range of G-FET and G-DRIVE power-conversion products for multi-kilowatt server and automotive applications

Infineon acquires wafering technology firm Siltectra

Lumentum's quarterly revenue rises 45.6% year-on-year to $354.1m, driven by telecom and fiber-laser demand

MRSI announces HVM3 die bonding demonstration capability in Shenzhen

Arrow Electronics expands distribution agreement with Cree's Wolfspeed Division to include Power & RF products

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