- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Mo | ASML, TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors | ||
| Mo | Monolithic all-GaN 2T1C-µLED-photodetector integration | ||
| Mo | IVWorks' reGaN technology enables first 742GHz GaN HEMT | ||
| Mo | Purifying red InGaN micro-LED spectra | ||
| Mo | Monolithic bidirectional diamond switch | ||
| Fr | Munich District Court rules in favour of Infineon in patent infringement cases against Innoscience | ||
| Do | Nanjing-based Casela to buy $25.4m of InP wafers from AXT's Tongmei during 2027 | ||
| Do | Elethron and ATMOS complete engineering collaboration on microgravity R&D and in-space production for advanced materials | ||
| Do | Aehr receives follow-on production order from silicon photonics customer | ||
| Mi | Coherent to receive $50m US CHIPS Act funding to expand Sherman 6-inch InP fab | ||
| Mi | Phlux announces beta-sample availability of Apex 200µm Noiseless InGaAs APD receiver modules for ultra-low-light detection | ||
| Mi | CSA Catapult appoints head of quantum | ||
| Mi | JX expanding InP substrate production capacity again to meet data-center optical communications demand | ||
| 16.06. | Enkris unveils high-speed, low-power micro-LED optical interconnect product | ||
| 16.06. | Element Six and Orbray accelerate wafer-scale single-crystal diamond for volume production | ||
| 16.06. | PicoJool introduces 200G VCSELs for scale-up AI data centers | ||
| 15.06. | CGD and NXP collaborate to accelerate time to market | ||
| 15.06. | Wolfspeed appoints Daniel Whalen as VP of investor relations | ||
| 15.06. | IQE and Tower announce multi-year InP epiwafer supply agreement | ||
| 15.06. | NUBURU agrees Lyocon-led alliance with SunCubes | ||
| 15.06. | KnowMade highlights scaling of GaN-based architectures for strategic markets | ||
| 15.06. | China's Supreme Court upholds injunction against Infineon, says Innoscience | ||
| 15.06. | Fraunhofer ISE raises its solar module efficiency record to 34.4% | ||
| 12.06. | Micro-LED transfer via electrochemical etch | ||
| 12.06. | Photon Design adds silicon modulator design capability to its HAROLD laser simulation tool |
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