Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
Do | Northeast Microelectronics Coalition awards $1.43m to 19 firms through PROPEL Operations Program | ||
Do | ROHM adds high-power-density 4-in-1 and 6-in-1 SiC power modules in HSDIP20 package | ||
Do | SemiLEDs' quarterly revenue growth boosted by buy-sell purchase orders of equipment | ||
Do | NS Nanotech boosts power of far-UVC disinfection light source by over 60% | ||
Mi | Navitas showcasing advances in GaN and SiC technologies at PCIM, including first production-released 650V bi-directional GaNFast ICs | ||
Mi | Infineon showcasing power device solutions at PCIM | ||
Mi | EPC launches laser driver evaluation board for indirect time-of-flight applications | ||
Di | OIF releases 800LR Implementation Agreement defining single-wavelength 800G coherent line interface | ||
Di | NUBURU secures funding to eliminate $3.4m in outstanding accounts payables | ||
Di | Lumentum earns EcoVadis Platinum Medal for third consecutive year | ||
17.04. | RISC processor based on 2D semiconductor FETs | ||
17.04. | Navitas' new 1200V SiCPAK power modules enable high reliability and efficient high-temperature performance | ||
17.04. | ROHM highlighting e-mobility and industrial applications at PCIM 2025 | ||
17.04. | UIUC reports record switching performance in intrinsic diamond photoconductive semiconductor switches | ||
17.04. | CSA Catapult's head of advanced packaging technology appointed visiting professor at UK's universities of Bristol and Strathclyde | ||
16.04. | Polar to license Renesas' GaN-on-Si technology and onshore commercial fabrication of 650V-class devices on 200mm wafers | ||
16.04. | SEMI Silicon Photonics Industry Alliance launches three Special Interest Groups to set out technology roadmap | ||
16.04. | Navitas gains automotive qualification of high-power GaNSafe ICs | ||
16.04. | Toshiba showcasing wide-bandgap technology at PCIM | ||
16.04. | Diodes Inc adds 650V SiC Schottky diodes with low figure-of-merit | ||
16.04. | NUBURU announces strategic corporate update focused on defense & security, advanced technologies, and growth initiatives | ||
15.04. | ST reshaping manufacturing footprint to invest in 300mm silicon, 200mm SiC, and technology R&D | ||
15.04. | Mitsubishi Electric to ship samples of full-SiC and hybrid-SiC SLIMDIP modules | ||
15.04. | ams OSRAM launches 20% brighter 1.2mm x 1.0mm x 0.6mm Chip LED delivering 14mW | ||
15.04. | Qorvo appoints two independent directors as David H. Y. Ho retires from board |