| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Do | ElementUSA and Colorado School of Mines awarded $67m by DOE for construction of rare-earth processing plant | ||
| Do | Mitsubishi Electric to ship 5th-generation trench SiC MOSFET bare die samples | ||
| Do | RTX's Raytheon awarded $515m contract for GaN-based SPY-6 family of radars | ||
| Do | AI data-center expansion to drive monthly capacity of EML and CW-DFB lasers to 50.7 million in 2026 | ||
| Do | ROHM's 750V SiC MOSFET adopted in battery backup unit for AI servers | ||
| Do | Indium Corp and Ames National Lab team to establish US gallium supply chain | ||
| Mi | EPC targets high-density motion systems with GaN ePower Stage technology | ||
| Mi | Navitas collaborates with NVIDIA MGX Ecosystem to accelerate 800VDC AI infrastructure | ||
| Mi | From road to rack: 800V EV innovations redefining AI data-center power architecture | ||
| Mi | Ayar Labs joins NVIDIA NVLink Fusion ecosystem to bring CPO to rack-scale AI infrastructure | ||
| Mi | University of Texas at Dallas and Attolight launch new demo lab for wide-bandgap R&D | ||
| Di | Cree LED launches XLamp XE-B LEDs for directional lighting | ||
| Di | Sivers and GlobalFoundries to develop silicon photonics for AI infrastructure | ||
| Di | Wise Integration unveiling digital control roadmap for next-gen power conversion at PCIM | ||
| Di | EPC supporting NVIDIA MGX-based AI infrastructure with 800V-to-12.5V power conversion | ||
| Di | Aixtron's CCS R&D system to be centerpiece of Penn State's new semiconductor lab | ||
| Di | Power Integrations unveils space-saving, ultra-slim auxiliary PSU reference designs for NVIDIA Kyber 800VDC AI data center | ||
| Mo | Wolfspeed launches data-center solutions team in Silicon Valley | ||
| Mo | QPT opens customer demos of MicroDyno test platform | ||
| Mo | BluGlass executes $1m option shortfall agreement, plus potential extra $500,000 | ||
| Mo | Latest issue of Semiconductor Today now available | ||
| 29.05. | Infineon joins NVIDIA's MGX AI Factory ecosystem | ||
| 29.05. | Infineon introduces first silicon carbide power module operating at 205°C | ||
| 29.05. | IQE's full-year 2025 revenue falls 17.6%, as 40% drop in wireless outweighs 15% growth in photonics | ||
| 28.05. | Purdue and Taiwan's GCCS partner to scale silicon carbide substrates to 8- and 12-inches |