Gothenburg, 2 April 2026: Gapwaves has received an order from Gotmic AB, a Swedish supplier of chipsets for microwave frequencies. The order concerns the design and development of waveguide packaging intended for high-power amplifier modules. The initial order value amounts to approximately MSEK1,5 and is expected to be delivered during 2026. When Gotmic subsequently launches the product, Gapwaves will supply waveguide packaging to Gotmic at an estimated value of approximately MSEK 10 over the following 3 years.
The collaboration aims to jointly develop high-power amplifier modules, known as HPA. This type of solution is used in a range of demanding applications at millimetre-wave frequencies, such as radar sensors, satellite communications and telecommunications.
Gapwaves' patented Multi-Layer Waveguide technology (MLW) enables waveguide packaging of Gotmic's chips with very low losses. The metallic structure of the MLW technology enables heat dissipation, which high-power applications require. Gapwaves' waveguide technology also ensures a compact size and minimal signal loss - characteristics that are critical in efficient and compact high-power applications.
"Together, Gotmic and Gapwaves form a strong technical and strategic partnership - where Gotmic's leading chipsets are combined with Gapwaves' patented waveguide technology, enabling HPA modules with performance, compactness and reliability that cannot be achieved with conventional solutions. Our first customer is an American defence group." says Magnus Elovsson, CEO of Gotmic.
Commercial order in a new market segment - NASCENT paved the way
The collaboration is a direct result of joint participation in NASCENT, a Vinnova-funded research project that started in 2024 and runs until October 2026. The project aims to develop an innovative and cost-effective HPA to enable 6G infrastructure at higher frequencies. Within the framework of NASCENT, Gapwaves and Gotmic have together explored the possibilities of combining their respective technologies - work that has laid the foundation for the technical validation and trust that has now been converted into a commercial collaboration and agreement.
"This agreement is concrete proof that our MLW technology delivers real value beyond the automotive industry, in an exciting and - for us - new market segment with significant commercial potential. The fact that a Vinnova-funded research collaboration with a technology leader like Gotmic has now resulted in a commercial order in such a short time is exactly the type of industrial product development and application we are targeting in our expansion into new market segments." says Jonas Ehinger, CEO of Gapwaves.
For more information, please visit www.gapwaves.com or contact:
Jonas Ehinger, CEO?Gapwaves?AB?(publ)
Phone number:?+46?733 44 01 52
E-mail:?jonas.ehinger@gapwaves.com
Gapwaves?Certified Adviser is G&W?Fondkommission?AB?
www.gwkapital.se
About Gapwaves AB (publ)
Gapwaves AB (publ) develops wireless solutions based on unique and patented waveguide technology for millimetre-wave applications. Our products are primarily used in antennas for radar systems enabling autonomous driving and advanced safety solutions within the automotive industry. Through collaborations with leading players in the sector, we contribute to the development of safer and more efficient transport systems. The technology is cost-efficient, combines high performance with a compact design and is also suitable for industrial automation, telecommunications, smart cities, and civil-military applications - areas where precision and reliability are crucial. Gapwaves was founded in 2011 from research at Chalmers University of Technology and is listed on Nasdaq First North Growth Market Stockholm (GAPW B).
About Gotmic
Gotmic AB is a Gothenburg-based Swedish company that develops and delivers advanced millimetre-wave chips for the world's most demanding applications across defence, radar, space, telecommunications, and test and measurement. Combining deep MMIC expertise with system-level understanding, Gotmic guides customers from initial concept through to deployable hardware - faster and with lower risk.
