| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 01.04. | [Insights] Memory Spot Price Update: DDR3 Strength Contrasts Weak DDR4/ DDR5 Amid High Prices, Soft Demand | ||
| 01.04. | Huawei 2025 R&D Spending Reaches Record 192.3B Yuan, 22% of Revenue; Cloud Revenue Slips | ||
| 01.04. | NVIDIA's Rubin Ultra Seen Sticking to Dual-Die Design on Packaging Constraints; TSMC 3nm Demand Intact | ||
| 01.04. | Oracle Reportedly Slashes Thousands of Jobs as AI Spending Surges | ||
| 01.04. | Silicon Photonics Race Intensifies as TSMC Targets 2026 COUPE Production, Samsung Eyes 2029 CPO Turnkey | ||
| 01.04. | JEDEC Reportedly Plans to Relax HBM Height Specs to ~900µm, Potentially Slowing Hybrid Bonding Adoption | ||
| 01.04. | "Father of HBM" Predicts Memory-Centric AI Shift as HBF Emerges, Reshaping GPUs' Role | ||
| 31.03. | Kioxia Reportedly Exits 2D NAND Market, Phasing Out Floating Gate and BiCS FLASH Gen 3 in 2028 | ||
| 31.03. | Micron Reportedly Pursues Stacked GDDR for AI Inference, Prototype Expected in 2027 | ||
| 31.03. | Samsung Pushes Advanced Nodes, Reportedly Targets 1nm by 2030; 2nm Yields Top 60% | ||
| 31.03. | DDR5 Retail Prices Pullback Amid Market Correction, but Industry Players Cite Stable Contract Trends | ||
| 31.03. | Silai Semicon Achieves Scaled Delivery of 12-Inch SiC Laser Lift-Off Production Systems | ||
| 31.03. | China Reportedly Targets 80% Chip Self-Sufficiency by 2030, Eyes Domestic 7nm Line and 14nm Production Stability | ||
| 30.03. | Rapidus Accelerates 1nm Push, Reportedly Targets Six-Month Gap with TSMC | ||
| 30.03. | Samsung Reportedly Advances Xi'an to 236-Layer NAND; SK hynix Eyes Dalian Upgrade Amid Tight Supply | ||
| 30.03. | Samsung Labor May Strike from May 21, Potentially Lifting DDIC and PMIC Prices Amid Tight Mature-Node Supply | ||
| 30.03. | Select DDR5 Kits Reportedly Slide Over 20% in U.S. Retail Amid Google's TurboQuant Debate | ||
| 30.03. | Chinese Semiconductor Equipment Manufacturers Draw in New Investment | ||
| 30.03. | SMIC 2026 Action Plan Points to Above-Industry Growth, Capex Held in Line with 2025 | ||
| 27.03. | Inside Mitsubishi Electric, Rohm, Toshiba Talks and Denso's Move: Japan's Power Chip Consolidation Push | ||
| 27.03. | Apple Reportedly Deploys $200K-$400K Four-Year Bonuses to Defend Against OpenAI Talent Raids | ||
| 27.03. | Micron Reportedly Eyes JDI's Mobara Plant for Chip Assembly and Testing Expansion in Japan | ||
| 27.03. | Iran Conflict Reportedly Drives 50%+ Helium Spot Price Surge; Samsung, SK hynix on High Alert | ||
| 27.03. | GlobalFoundries Sues Tower Semiconductor Over 11 Patents, Seeks Profit Damages and Import Ban | ||
| 27.03. | Samsung Reportedly Eyes 2026 Tape-Out for 2nm Exynos 2800; 1.4nm Shift Delayed |