| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 20.10. | Huawei-linked SiCarrier Says Tools Adopted by Multiple Fabs; Adds New Photomask, Wafer Inspection Tools | ||
| 20.10. | CXMT's Earnings Boom Faces Test as 3Q Profit Growth Slows to 1-4% QoQ: What's Behind the Slowdown? | ||
| 20.10. | China's NAURA Targets Hybrid Bonding With RMB 405M Deal as Domestic Equipment Push Accelerates | ||
| 20.10. | Intel Claims Industry's Only High-Volume 300mm InP Silicon Photonics Capability as CPO Gains Momentum | ||
| 19.10. | Micron Develops Edge Inference Memory, 2H28 Production Seen as HBM Potential Grows in Humanoids | ||
| 19.10. | NVIDIA Chooses Monolithic Die Over Chiplets for Vera CPU, Claims 2× x86 Performance in Agentic AI | ||
| 19.10. | MediaTek's Google TPU v9 Shipments May Slip to 1Q28; ASIC Race Heats Up as Taiwan Firms Eye Opportunities | ||
| 19.10. | NVIDIA Reportedly Pushes TSMC 3nm NVHBM Base Dies for Samsung, SK hynix, Micron, Uniting Foundry Rivals | ||
| 19.10. | Huawei Scientist: EDA Tools Pose Biggest Challenge to Tau Scaling Law | ||
| 19.10. | Chinese Phone Makers Eye Salvaged Memory as Chip Prices Reportedly Rise by Up to RMB 500 per Unit | ||
| 16.10. | After TSMC's 3Q26 Earnings: Key Brokerage Takeaways as 2028 Capex Forecasts Reach US$105B | ||
| 16.10. | Apple Reportedly Skips High-End M6 Chips for M7 Lineup; Partners With Meta to Run Muse AI on Mac Studio | ||
| 16.10. | Korean Chip Engineer Accuses Tesla of Pressuring Samsung on AI5/AI6 Pricing, Poaching Talent for Terafab | ||
| 16.10. | SK hynix Unveils H-TPU SSD Processor That Slashes Power Consumption, Eyes HBF Applications | ||
| 16.10. | Samsung May End UMC's Galaxy DDI Exclusivity by Adding GlobalFoundries as Mature-Node Capacity Tightens | ||
| 15.10. | TSMC Touts Unmatched 5x Reticle-Size Packaging Prowess and High Yields, Ready to Step In if Rivals Fall Short | ||
| 15.10. | TSMC Sends Team to Assess Texas Fab Expansion, Confirms Terafab Talks but Insists on Operating Control | ||
| 15.10. | TSMC Lifts 2026 Growth Forecast to 44%, Eyes Record 4Q Revenue of Up to US$54.3B, Up 14% QoQ | ||
| 15.10. | SK hynix Reportedly Seeks U.S. Chip Tool Approval for China Expansion to Fund Potential U.S. NAND Fab | ||
| 15.10. | TSMC 3Q26 Net Profit Surges 68.7% to Record NT$763B, EPS Hits NT$29.43; 2nm Sales Share Climbs to 8% | ||
| 15.10. | China Unveils 90%-Domestic EUV Light Source Prototype, Mass Production Reportedly 3-5 Years Away | ||
| 15.10. | GF Eyes Two New York Fabs with Japan's $21B Investment, Apple, Renesas Reportedly as Initial Customers | ||
| 15.10. | Intel CEO Lip-Bu Tan Calls DeepSeek, Kimi, GLM Good Enough, Notes Low Token Costs and Fast Adoption | ||
| 15.10. | Chinese Firms Reportedly Buy Over 1M NVIDIA Gaming, Workstation Chips as Domestic AI Supply Falls Short | ||
| 14.10. | [OCP in Focus] Arm Targets $300B CPU Market by 2030 as Agentic AI Redefines Data Center Architectures |