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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | Micron to Build a New Memory Chip Plant in Japan with USD 9.6B | ||
| Di | Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC | ||
| Mo | Intel Reportedly Taps Amkor's Songdo Facility for EMIB Packaging in First-Ever Outsourcing Move | ||
| Mo | TSMC Unveils Custom C-HBM4E Details: N3P Logic Dies Reportedly Target 2× Efficiency Gain | ||
| Mo | TechFuture Awards 2025 Winners Announced -Driving Innovation and Shaping Intelligent Future | ||
| Mo | Samsung Reportedly Supplies 60%+ of Google TPU HBM3E, Set to Remain Primary Supplier in 2026 | ||
| Mo | Intel Gains Momentum: 18A Eyes Apple, EMIB Reportedly Tapped for Google-MediaTek TPUs | ||
| Mo | Gold and CCL Price Surge Squeezes Substrate Makers as AI Fuels Demand for High-Value PCBs | ||
| Mo | Onsemi to Receive €450M Government Grant for Advanced SiC Power Device Fab in Czech Republic | ||
| 28.11. | Nittobo Expands Glass-Fiber Output with Nan Ya; Nan Ya to Handle 20% by 2027 Amid AI Surge | ||
| 28.11. | NVIDIA Might Stop Bundling VRAM with GPUs amid Memory Crunch, Squeezing Smaller Board Partners | ||
| 28.11. | Korean Researcher Says HBM9 Could Arrive in 2040, With Performance Said to Reach 60× HBM4 | ||
| 28.11. | Tantalum Capacitor Rally on AI: Panasonic Reportedly Hikes 15-30%, Yageo Rides Wave | ||
| 28.11. | Baidu Reportedly Launches Its Biggest Layoffs in Years as It Overhauls Its AI Business | ||
| 28.11. | U.S., Japan Rumored Mulling Joint NAND Fab, with Kioxia, SanDisk Likely In | ||
| 28.11. | Hong Kong Reportedly Joins Silicon Race with RISC-V Data Center Chip, Eyes 1Q26 Mass Production | ||
| 28.11. | Samsung Reportedly Unveils NAND Tech to Cut Power by 96% amid Research Unit Shake-Up | ||
| 27.11. | China Presses EU to Step In on Nexperia, Reiterates Discontent with the Dutch | ||
| 27.11. | China's Zhonghao Xinying Claims TPU 1.5× Faster than NVIDIA A100 Amid Google TPU Buzz | ||
| 27.11. | Samsung Reportedly Targets HBM4 Price Parity with SK hynix Amid Strong NVIDIA Demand | ||
| 27.11. | AI Memory Showdown: SK hynix Unveils 48 Gb/s GDDR7 and LPDDR6; Samsung Showcases HBM4 | ||
| 27.11. | Intel Stands Firm on Lo Hire Amid TSMC Trade Secret Dispute: CEO Vows Support, Dismisses Claims | ||
| 27.11. | GlobalFoundries Moves on GaN: TSMC and Navitas Ties Position U.S. as New GaN Production Hub | ||
| 27.11. | 64GB DDR5 RAM Reportedly Now Pricier Than a PlayStation 5 Amid Soaring Memory Costs | ||
| 26.11. | Beyond Ex-VP Lo, Intel Is Reportedly Poaching TSMC Arizona Engineers With 20-30% Higher Salaries |
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