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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Mo | Micron Earnings Preview: Four Key Areas in Focus - HBM Progress, Capex and More | ||
| Mo | MIT Announced Breakthrough in GaN-on-Single-Crystal Diamond Thermal Management Technology | ||
| 19.06. | World's Smallest Semiconductor Nanotube Achieved at 1 Nanometer | ||
| 19.06. | Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up | ||
| 19.06. | World's First Mass-Produced GaN-on-Silicon RF Chip for Smart Terminals Surpasses 5 Million Units Shipped | ||
| 18.06. | Marvell Says It Is in Talks with TSMC on A14 for Next-Gen AI Connectivity Chips, Joining Early-Adopter Ranks | ||
| 18.06. | World's No. 2 Aluminum Capacitor Supplier Nichicon Hikes Prices; Taiwan Peers Set to Follow in June-July | ||
| 18.06. | Tim Cook Signals Apple Price Hikes; Ready to Use Cash Reserves to Compete for Memory Supply | ||
| 18.06. | SK hynix Ships 12-High HBM4E Samples, Boosts Bandwidth to 16Gbps and Power Efficiency by Over 20% | ||
| 18.06. | San'an and its Partners Achieved Breakthrough in Gallium Oxide Epitaxy | ||
| 18.06. | Kioxia Adopts Cautious Capex Strategy Despite NAND Upcycle: Reportedly 10% Below FY23 Peak, Key Concerns in Focus | ||
| 17.06. | Samsung Foundry Reportedly in Talks with AMD for 2028 CPU Production as BYD, Google Consider Its Services | ||
| 17.06. | [Insights] Memory Spot Price Update: DDR3 Strengthens While DDR4 Faces Constraints and Spec Downgrading | ||
| 17.06. | TSMC, Amkor Sign 10-Year Arizona Advanced Packaging Pact to Complete the U.S. Chip Supply Chain | ||
| 17.06. | Apple A22 Pro May Adopt 1.4nm in 2028; TSMC Remains Primary Supplier, Intel Reportedly Considered | ||
| 17.06. | Intel 18A-P Enters Risk Production, Targets 9% Performance Gain With Potentially Shortened Ramp | ||
| 17.06. | DeepSeek Completes First Funding Round, Raises Over CNY 50 Billion at Valuation Above CNY 330 Billion | ||
| 17.06. | Nikon Develops Photo Assist Patterning to Simplify Glass Substrate Plating, Sample Work Reportedly Available on Request | ||
| 16.06. | JX Advanced Metals to Invest JPY 120B Through FY2030, Expand InP Capacity Up to 10x on CPO Demand | ||
| 16.06. | AMD Acquires MEXT to Address AI Memory Bottlenecks with Tech That Makes NAND Act Like DRAM | ||
| 16.06. | Samsung Reportedly Plans MPW Expansion to 2nm in 2027, Unveils 18-Run Program Across Nodes | ||
| 16.06. | Huawei, Xiaomi Reportedly Plan HBM-Inspired LLW DRAM for 2H27 to Boost On-Device AI in Smartphones | ||
| 16.06. | TSMC Reportedly Runs Dual-Track Evaluation on CoPoS Pilot Line, Sparking Global, Local Vendor Competition | ||
| 16.06. | Ferrari and HP Unveil Co-Branded AI PC, Limited to 4,999 Units Worldwide | ||
| 16.06. | MTC and Changelight Forge Strategic Partnerships to Advance Micro LED Optical Interconnect Technologies |
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