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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 12.05. | Samsung Reportedly Plans Galaxy S26 Tactical Military Phone Later This Year; Apple Also Eyes Entry | ||
| 12.05. | TI Reportedly Raises Power Component Prices 5-15% in July; De-China Shift Fuels Upcycle Momentum | ||
| 12.05. | MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push | ||
| 12.05. | China Memory Module Maker POWEV Advances DDR5 Push as 64GB RDIMM Reportedly Enters Volume Production | ||
| 12.05. | [Sponsored Content] From Single-Task to Multi-Functional: Advantech Empowers ADATA in Developing Multi-Robot Collaborative AI AMRs | ||
| 12.05. | Huawei's Chip Fundamental Technology Research Lab Featured on CCTV News Broadcast | ||
| 12.05. | TSMC Flags Four Key Challenges in Arizona Buildout Even as U.S. Fab Beats Expectations | ||
| 11.05. | SK hynix Reportedly Tests Intel EMIB 2.5D Packaging With HBM Amid TSMC CoWoS Tightness | ||
| 11.05. | SMIC Founder Says China May Gain Edge in Niche Chips as 80% of Demand Lies Outside Advanced Nodes | ||
| 11.05. | Chip Price Hike Wave Builds as NXP, TI Reportedly Prepare Their Second Increases This Year for June and July | ||
| 11.05. | Intel CEO Lip-Bu Tan Hints at Exciting New Products With NVIDIA as Foundry Collaboration Rumors Grow | ||
| 11.05. | Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals | ||
| 11.05. | [Insights] What to Watch at COMPUTEX: Intel May Debut Gaming Handheld Chip, NVIDIA First Consumer PC SoC in Focus | ||
| 11.05. | ARM CEO Says Agentic AI May Drive CPU Core Counts to 512 as GPU-CPU Ratios Become Less Relevant | ||
| 08.05. | TSMC, Sony to Form JV for Image Sensors, Including New Production Lines for AI and Automotive Use | ||
| 08.05. | Baidu Chip Unit Kunlunxin Reportedly Launches STAR Market IPO Process; HK Listing Valuation Seen Near HK$100B | ||
| 08.05. | Ajinomoto Boosts Chip Materials Business With ¥1.2B Land Buy for 2032 Plant; ABF Margins Top 50% on AI Boom | ||
| 08.05. | Big Tech Reportedly Moves In on SK hynix With Production, EUV Funding Offers to Secure Memory Supply | ||
| 08.05. | SKC Said to Speed Glass Substrate Mass Production by Year-End; Advances New Non-Embedding Tech for U.S. Client | ||
| 08.05. | [Insights] Early May Panel Prices: TV Gains Slow; MNT Hike Momentum Moderates, NB Flat | ||
| 08.05. | Samsung Electronics Announced Suspension of Home Appliance Sales in China | ||
| 07.05. | GlobalFoundries Reportedly Sees Silicon Photonics Revenue Doubling in 2026, Passing $1B by 2028 | ||
| 07.05. | SK hynix 10% Profit-Sharing Turns Double-Edged on Record Earnings: KRW 600M Payouts Signal Cost Pressure | ||
| 07.05. | TSMC Hints at Potential Further U.S. Expansion; Industry Sources Reportedly See Up to US$250B Investment | ||
| 07.05. | Intel 18A-P and TSMC A16 Set for VLSI Showdown in Advanced Node Push: 18% Power Savings vs SPR Debut |
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