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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | NVIDIA Reportedly Develops China-Focused Blackwell AI Chip, with Test Samples Possibly in Sep. | ||
| Di | TEL President Reportedly Set for September Taiwan Visit to Meet TSMC Execs After 2nm Data Leak | ||
| Di | NVIDIA's Rubin Ultra Seen Driving Immersion Cooling Boom by 2027-28 | ||
| Di | Arm Reportedly Taps Amazon AI Chip Director to Drive In-House Chip Plans | ||
| Di | Intel Gets Twin Lifelines: SoftBank's $2B Backing and Potential 10% Stake from U.S. Government | ||
| Di | GoerTek to Invest USD 100M in Micro LED Company Plessey | ||
| Di | Empyrean Reportedly Unveils China's First Full-Process EDA Platform for Memory Chip Production | ||
| 18.08. | Samsung Reportedly to Supply 8-Inch OLEDs to Tesla in 2027, Possibly for Optimus Robots | ||
| 18.08. | NVIDIA Reportedly Drives 27% of SK hynix Revenue in 1H25, Cementing AI Chip Partnership | ||
| 18.08. | Hua Hong Seeks Controlling Stake in HLMC in Major China Foundry Consolidation Push | ||
| 18.08. | TSMC Arizona Delivers 2Q25 Investment Income; as Kumamoto Fab Struggles with Losses | ||
| 18.08. | NVIDIA Reportedly Eyes Small-Scale HBM Base Die Production in 2027: Rattling Memory, Chip Markets | ||
| 18.08. | LG Electronics Reportedly Develops 130-Inch MicroLED Signage Using LTPS TFT Glass | ||
| 18.08. | China Unveiled its First Commercial Electron Beam Lithography Machine | ||
| 15.08. | China's Rare Earth Gamble: Why Export Controls Might Ultimately Lose its Edge | ||
| 15.08. | Samsung's DRAM Market Share Reportedly Plunges to 33% in H1, Bets on HBM and DDR5 Recovery | ||
| 15.08. | Altera, Spun Off From Intel Earlier This Year, Reportedly Cutting Nearly 100 Jobs | ||
| 15.08. | Trump Administration Reportedly Mulling a Stake in Intel Amid U.S. Manufacturing Push | ||
| 15.08. | Applied Materials Warns of Q4 Revenue Drop on China Slowdown, Tariff Worries | ||
| 15.08. | China Claims No. 2 Globally in Computing Power, Holds 60% of AI Patents | ||
| 15.08. | China's Beijing E-town Files $13.9M Suit Against Applied Materials Over Alleged Plasma Tech Theft | ||
| 14.08. | DeepSeek R2 Model Launch Reportedly Delayed Amid Huawei Ascend Chip Hurdles | ||
| 14.08. | Japan's Kanto Denka Fire Threatens NF3 Supply, Alerts Chipmakers Like TSMC, Samsung and Rapidus | ||
| 14.08. | Intel Rolls Out "USAI" Web Page Showcasing Commitment to U.S. Manufacturing | ||
| 14.08. | Samsung Reportedly Plans $170M Chip Packaging R&D Center in Yokohama, Opening 2027 |
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