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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | Samsung Confirms First Tri-Fold Phone by Year-End, Initial Shipments May Be Limited | ||
| Di | China's YMTC Launches $3B Wuhan Phase III Venture, Signaling NAND Expansion Ambitions | ||
| Di | Intel's Former Interim Co-CEO Michelle Johnston Holthaus to Depart Amid Leadership Shakeup | ||
| Di | Silicon Photonics in the Spotlight: TSMC Lifts the Curtain on COUPE at SEMICON Taiwan | ||
| Di | AMD May Return to GPU Arena with the Launch of 2.5D/3.5D Chiplet-Based GPU | ||
| Di | TSMC Eyes Breakthroughs in SiC Thermal Management | ||
| 08.09. | U.S. Reportedly Mulls Annual Site License on Exports to Samsung, SK hynix China Fabs | ||
| 08.09. | Qualcomm Questions Intel's Adequacy, Undermining Team Blue's Foundry Ambitions | ||
| 08.09. | NVIDIA Reportedly Taps Samsung to Double GDDR7 Supply for China-Targeted RTX PRO 6000D | ||
| 08.09. | Tesla Reportedly Advances In-House Chip Plans as Musk Hails AI5 Design Review | ||
| 08.09. | Apple Watch Ultra Reportedly Chooses Taiwan's MediaTek for 5G Modems in Landmark Supply Win | ||
| 08.09. | [Insights] Panel Prices in Early September: TV Expected to Hold Steady Amid Year-End Demand Prep | ||
| 08.09. | SK hynix May Secure NVIDIA HBM4 Deal by Sep., Samsung Reportedly Trails in Testing | ||
| 05.09. | China's Chip Tool Maker SiCarrier Reportedly Hits RMB65B Valuation, Secures Billion-Yuan Orders | ||
| 05.09. | Intel Reportedly Sets 2026 as Key Test for 14A, But Might Rely on TSMC "Forever" | ||
| 05.09. | NVIDIA-MediaTek GB10 Collaboration Fuels $73B Acquisition Rumor-Why It May Not Happen | ||
| 05.09. | Apple Reportedly Plans iPhone 17 Price Hike, Potentially Cutting Entry-Level Pro | ||
| 05.09. | Broadcom Reportedly Secures $10B Custom AI Chip Order from New Client, Lifts 2026 AI Sales Forecast | ||
| 05.09. | TSMC to Implement a Significant Price Hike | ||
| 05.09. | Huawei's Bold Return: Mate XTs Debuts Kirin 9020 After Four Years of Chip Silence | ||
| 04.09. | Chinese Cloud Giants Reportedly Pursue NVIDIA's H20 Despite Pressure, Eye B30A as Good Deal | ||
| 04.09. | Xiaomi Reportedly Plans XRING O2 for 2026, Staying With TSMC's 3nm Rather Than 2nm | ||
| 04.09. | Resonac Teams up with Applied Materials, TEL and Other Chip Giants on Panel-level Interposers | ||
| 04.09. | Google Reportedly Courts Smaller CSPs to Host TPUs, Taking Aim at NVIDIA | ||
| 04.09. | Samsung Reportedly Plans Exynos 2600 in Galaxy S26 Models, Reducing Qualcomm Reliance |
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