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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | MediaTek and Qualcomm Race for Bigger AI Roles Through NVIDIA N1X, ASICs, and Dragonfly | ||
| Di | Samsung Accelerates U.S. Expansion as Taylor Fab Targets 2027 Start, HQ Reportedly Moves to Texas in 2026 | ||
| Di | [Sponsored Content] When AI Is No Longer Just a Model: Advantech and Spingence Build a Practical "Closed-Loop Path" for AI Deployment | ||
| Di | Samsung Display's Pilot Line for Micro LED Smartwatch Displays Under Construction | ||
| Di | Nexperia China Says MOSFET, Logic IC Supply Chains Complete as Independent Operations Largely in Place | ||
| 01.06. | U.S. Moves to Block AI Chip Exports to Overseas Chinese Units as Loophole May Have Fueled Large Shipments | ||
| 01.06. | NVIDIA Enters PC Market with RTX Spark Featuring MediaTek-Co-Designed N1X CPU on TSMC 3nm | ||
| 01.06. | Intel Advances Glass Substrate Push with 3DGS, US$3.3 Billion India Plant Set for Five-to-Six-Year Buildout | ||
| 01.06. | Vera Rubin Buildout: NVIDIA Reportedly Pushes TSMC Above 20% Revenue Share, Power, Cooling Suppliers Benefit | ||
| 01.06. | COMPUTEX 2026 Preview: From Intel Budget AI CPUs to CPO Momentum Fueled by NVIDIA Vera Rubin | ||
| 01.06. | UNISOC and SmartSens Announce Strategic Push into Micro LED Optical Interconnects | ||
| 01.06. | Japan-U.S. NAND Alliance Steps Up Investment as Kioxia-SanDisk Capex Reportedly Rises 40% YoY | ||
| 29.05. | From 800 VDC to GPU Core: Innoscience All-GaN Technology Provides Key Solutions to High-Density AI Power Delivery for the NVIDIA MGX Ecosystem | ||
| 29.05. | TSMC Says Energy Efficiency Is Emerging as a Higher Priority Than Computing Power in AI Chip Design | ||
| 29.05. | MediaTek CEO Reaffirms TSMC as Key Long-Term Partner amid Samsung's Reported Push for Foundry Orders | ||
| 29.05. | NVIDIA Jensen Huang Calls Huawei's Tau Scaling Law a Breakthrough, But Sees No Challenge to TSMC | ||
| 29.05. | Samsung Starts Shipping Industry-First HBM4E Samples 3 Months After HBM4 Ramp; Performance Up 20%+ | ||
| 29.05. | AIXTRON Received Multiple Orders from Lumentum Due to AI Optical Communication Boom | ||
| 29.05. | Chinese Researchers Produced SiC Epitaxial Film over 300µm in Thickness | ||
| 28.05. | ByteDance Reportedly Develops In-House CPUs Amid Supply Tightness; Explores Both Arm and RISC-V | ||
| 28.05. | Broadcom Partners With FuriosaAI on 2nm AI Chip Reportedly Made by TSMC; Sampling Expected in 1H28 | ||
| 28.05. | Intel Reportedly to Adopt Silicon Capacitors in 2027 to Improve EMIB Power Stability for Google's v8e | ||
| 28.05. | Peking Univ. Unveils EDA for Huawei LogicFolding; Kirin 2026 Reportedly Eyes 3nm-Class Performance | ||
| 28.05. | Foldable iPhone Case Leak: Early Design Hints at Key Hardware Specs - Dual Cameras and Slim Profile | ||
| 28.05. | US AI Firm Fabric.AI to Demonstrate Micro LED Optical Interconnect Platform by Late 2026 |
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