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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Mo | TSMC's Bold Pivot: Kumamoto Fab 2 Reportedly Leaps from 6nm to 2nm amid JASM Losses | ||
| Mo | DNP Advances TGV Glass Substrates, Eyes Early-2026 Sample Shipments, FY2028 Mass Production | ||
| Mo | GF, onsemi Join Forces to Co-Develop GaN Power Devices, Accelerating Ambitions with Samples Due 1H26 | ||
| 19.12. | SK hynix Reportedly Expands U.S. Footprint with New Seattle Office Near NVIDIA and Amazon | ||
| 19.12. | Samsung Unveils Exynos 2600: Industry-First 2nm GAA AP With 113% AI Performance Uplift | ||
| 19.12. | Analog Devices Reportedly Plans 10-30% Price Hike from Feb. 2026, Following TI's Lead | ||
| 19.12. | U.S. Council: NVIDIA-Huawei AI Chip Gap Could Reach 17× by 2H27, Yet H200 Exports Risk Aiding China | ||
| 19.12. | China's Chipmaking Tool Giant AMEC Eyes Sizone Acquisition to Broaden CMP Equipment Reach | ||
| 19.12. | Chinese GPU Makers Pick up Pace in Going Public | ||
| 19.12. | China's EDA Firm Empyrean Commits RMB 100M to Investment Fund, Takes 7.78% Stake in S2C | ||
| 18.12. | TSMC Reportedly Accelerates Arizona 2nd Fab, Eyes 3Q26 Tool Install, 2027 3nm Production | ||
| 18.12. | Micron Reveals Three Culprits Behind Memory Crunch-and Why It Won't Ease Soon | ||
| 18.12. | SOCAMM2 War Heats Up: Samsung Reportedly Delivers Samples to NVIDIA, Ramping Early 2026 | ||
| 18.12. | China Reportedly Builds EUV Prototype Using Older ASML Components, Eyes 2028 Chipmaking | ||
| 18.12. | Micron Hikes CapEx to $20B with 2026 HBM Supply Fully Booked; HBM4 Ramps 2Q26 | ||
| 18.12. | Apple Reportedly to Bring WMCM Packaging to A20 Series, Boosting iPhone 18 Thermal Efficiency | ||
| 18.12. | Meta Reportedly Taps Korea's Sapien Semiconductors for Micro LED AR Glasses Backplanes | ||
| 17.12. | Murata Reportedly to Mass Produce AI Server Power Modules in 2026, Targets ¥50B by FY27 | ||
| 17.12. | Rapidus Reportedly to Unveil Glass Substrate Interposer Prototype, Eyes 2028 Production | ||
| 17.12. | Apple Reportedly Pushes In-House AI Chip, Eyes 2027 Server Deployment; Foxconn to Gain | ||
| 17.12. | Kingston Warns NAND Prices Have Surged 246% Since Early 2025, Signals More Price Hikes Ahead | ||
| 17.12. | European Commission Approves EUR 623M in German State Aid to Support Construction of Two Chip Fabs | ||
| 17.12. | Samsung Unveils Sub-10nm DRAM Breakthrough with InGaO, Reportedly Eyes 0a/0b Adoption | ||
| 16.12. | Intel Completes First 2nd-Gen High-NA EUV Acceptance Testing; ASML Eyes 2027-28 Mass Production | ||
| 16.12. | Samsung Reportedly Denies Plans to Halt Consumer SATA III SSDs Amid Tight NAND Supply |
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