- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | Samsung Reportedly Weighs Carbon Fiber in Next-Gen Foldable Amid China Supply Risks | ||
| Do | Tsinghua University Breaks Ground on EUV Photoresist in China's Semiconductor Push | ||
| Do | Intel Earnings Call Preview: 14A Strategy, Foundry Challenges, and More | ||
| Do | Trump's AI Action Plan Launches, But Key Details Like Chip Location Verification Remain Unclear | ||
| Do | AMD CEO Says TSMC Arizona Chips Cost Up to 20% More Than Taiwan's but Are Worth It | ||
| Do | SK hynix Posts Record Q2 Profit: Plans Bigger 2025 Capex; SOCAMM Shipments by Year-End | ||
| Do | Alibaba Reportedly to Unveil First Self-Developed AI Glasses This Week, Entering China's Tech Showdown | ||
| Do | Foxconn's AirPods Production in India Reportedly Hit by Rare Earth Shortage Amid China Export Curbs | ||
| 23.07. | Amazon Reportedly Shuts Down Shanghai AI Lab as Tech Giants Scale Back in China | ||
| 23.07. | What to Expect from Trump's Upcoming AI Action Plan: Three Key Focuses Unveiled | ||
| 23.07. | [Insights] Memory Spot Price Update: DDR4 Slide Slows as Korean Memory Makers Trigger Major Price Hikes | ||
| 23.07. | NVIDIA and MediaTek Reportedly Delay N1X Processor Launch from Second Half of 2025 to Q1 2026 | ||
| 23.07. | DDR6 Set for 2027 Mass Adoption as Memory Giants Reportedly Finalize Prototype Designs | ||
| 23.07. | South Korea's FuriosaAI Lands LG Deal After Turning Down Meta's Acquisition Offer | ||
| 23.07. | SOCAMM Ignites a New Memory War After HBM - Samsung and SK hynix Join the Race | ||
| 22.07. | HBM4 Reportedly Set to End SK hynix's Exclusive Run with NVIDIA as Market Diversifies by 2026 | ||
| 22.07. | Apple Reportedly to Debut Foldable in 2026, Prompting Korean Component Makers to Expand | ||
| 22.07. | TSMC's Q2 AI Revenue Reportedly Exceeds USD 10B, with Share Expected to Reach Nearly 50% | ||
| 22.07. | BT Substrate, Fiberglass Prices Reportedly Eye 20% Hike amid AI Boom and Supply Shortage | ||
| 22.07. | World's First Electron-Photon-Quantum Integrated Chip System Unveiled | ||
| 22.07. | Samsung Display Rumored to Add New IT Sales Team for G8.6 OLED Business | ||
| 21.07. | TSMC Reportedly Planning Drone Rollout Starting in Arizona, with Suppliers to Be Confirmed in 4Q25 | ||
| 21.07. | NVIDIA's H20 Production Faces Challenges? Inventory Reportedly Holds Amid Full TSMC N4 Capacity | ||
| 21.07. | Huawei to Unveil CloudMatrix 384, Rumored to Deliver 2× NVIDIA GB200 NVL72 Throughput | ||
| 21.07. | Nikon Unveils DSP-100 System for Panel-Level Packaging, Supporting 600mm Panels with 9x Throughput |
Sie erhalten auf FinanzNachrichten.de kostenlose Realtime-Aktienkurse von und .