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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | Rapidus Scales Up Advanced Packaging, Targets 8-Reticle Interposers With 600mm Panels by 2030 | ||
| Fr | STMicroelectronics Plans Third 2026 Price Hike for August 23; Power Device Lead Times Reportedly Hit 52 Weeks | ||
| Fr | From Pricing War to Pricing Power: Behind Samsung Foundry's Reported up to 15% Price Hikes | ||
| Fr | Intel and Memory: A History of Exits, and a New Bid to Return | ||
| Fr | Chip Packaging Experts Flag Heat as AI's Biggest Bottleneck; AI-Driven Design, CPO and STCO May Help | ||
| 20.08. | Samsung to Break Ground on KRW 6T Onyang HBM Fab in Sept., P5 Eyes Triple-Fab Shift as Expansion Accelerates | ||
| 20.08. | SK hynix Unveils CPO Roadmap, Looks Beyond HBM to AI Infrastructure | ||
| 20.08. | Intel May Tap TSMC N2X for Some Razor Lake Chips in 2027, Depending on 18A-P Performance | ||
| 20.08. | Marvell, AMD Reportedly Shake Up Google TPU Race, Putting Broadcom, MediaTek Under Pressure | ||
| 20.08. | Lam Research, PSK Clash Over Bevel Etcher Patent as Korea Patent Suits Mount | ||
| 20.08. | Japan's Socionext Adds Intel's 18A-P to Foundry Mix Alongside TSMC | ||
| 19.08. | SK hynix Reportedly Builds Silicon Valley HBM Team to Boost Customer Co-Design With U.S. Big Tech | ||
| 19.08. | Korea's Next-Gen OLED Push Gains Steam With LG FLiPP, Samsung Wide View Debuts | ||
| 19.08. | [Insights] Memory Spot Price Update: 3Q DRAM Spot Volumes Seen Staying Low; DDR4 Prices Up 0.67% This Week | ||
| 19.08. | Intel EMIB-T Push Gains Momentum as TSMC CoWoS Crunch Drives Spillover; Unimicron, ASE Stand to Benefit | ||
| 19.08. | Chip Equipment Crunch Reportedly Pushes Lead Times to 24 Months, Giving China's Toolmakers a Boost | ||
| 19.08. | Fujian to Build IC and Optoelectronics Industry Clusters in 15th Five-Year Plan, Targeting RMB 300 Billion in Total Output Value | ||
| 19.08. | ZHITAI Launches Ti600s SSD with YMTC's Xtacking 4.0 QLC NAND, Random Write Performance Up 114% | ||
| 18.08. | Samsung Reportedly Eyes Another Wide Fold for 2027 After Fold8 Success; Memory Costs Still Weigh on Mobile | ||
| 18.08. | CXMT DDR5 Reportedly Tops 9,000 MT/s on AMD Platform, Narrowing Performance Gap With Global Leaders | ||
| 18.08. | MLCC Lead Times Diverge as High-End Products Stretch to 5-10 Months; Tightness May Extend Into 2027 | ||
| 18.08. | NVIDIA Vera Rubin Spillover from HBM to NAND: CMX Fuels TLC Spot Price Rebound from June Dip | ||
| 18.08. | The Second Half of the AR Glasses Race Begins | ||
| 18.08. | Glass Substrate War Heats up: Shinko Electric Advances 22-Layer Product; Samsung Reportedly Faces Ramp-Up Uncertainty | ||
| 17.08. | Samsung, SK hynix 1H26 Chip Facility Investment Up 35%; NVIDIA Not Among Samsung's Top Five Customers |
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