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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | Huawei, Baidu and Industry Partners Launch China's First NPO Optical Interconnect Multi-Source Agreement | ||
| Di | China's Yuanjiwei Eyes 5nm-Equivalent Chips Without EUV by 2029, Debuts World's 1st 2D Semiconductor Pilot Line | ||
| Mo | Samsung Reportedly Completes Tesla AI5 Tape-out, Paving the Way for 2nm Ramp at Taylor Fab | ||
| Mo | China Curbs Helium Exports Amid Global Supply Risks; Critical for EUV and Advanced Chipmaking | ||
| Mo | TSMC's June Revenue Hits Record NT$442.7 Billion, Q2 Sales Reach Guidance High End: Earnings Call Preview | ||
| Mo | TSMC Reportedly Advises IC Designers of Mature-Node Price Hikes Effective Jan. 2027; Single-Digit Increase Expected | ||
| Mo | SK hynix Chair Dismisses HBM Slowdown Talk, Reportedly Says Clients Want Memory Capacity Up 5-6x | ||
| Mo | Sumitomo Electric to Raise InP Substrate Expansion Scale With JPY 18 Billion | ||
| Mo | LG Innotek Files 30 Foldable Backplate Patents, Reportedly Eyeing Apple's Future Devices | ||
| 10.07. | PrismML Reportedly Shrinks Alibaba's Qwen 3.6 to Run on iPhone 17 Pro, Drawing Apple's Interest | ||
| 10.07. | DRAM Rally Lifts Nanya Tech's 2Q Gross Margin to Nearly 80%, Closing in on Global Memory Leaders | ||
| 10.07. | Korea's POSTECH Develops Tech for Stable 10+ Layer Chip Stacking, Achieving 4× the Density of 12-Hi HBM | ||
| 10.07. | Samsung Reportedly Developing 4nm GAIA AI PC Chip; Mass Production Targeted as Early as 2027 | ||
| 10.07. | Micron Raises U.S. Investment Target to $250B Through 2035, Begins Concrete Work on New York Fab | ||
| 10.07. | Meta Commits USD 10 Billion to Canadian AI Data Center, Plans Dedicated Power Plant | ||
| 10.07. | SK hynix Reportedly Revives Dalian Plant 2 Expansion in 2H26, Adding New V8 NAND Capacity | ||
| 09.07. | China's PCB Makers Post Record-High Investment on AI Demand; Victory Giant Lifts 1Q26 Capex Nearly 5× YoY | ||
| 09.07. | SK Group Chairman Attends Nasdaq ADR Ceremony; Samsung Reportedly Pursues Big Tech Foundry Orders at Sun Valley | ||
| 09.07. | NVIDIA Next-Gen Rosa CPU May Adopt TSMC A16 with Back-Side Power Delivery, Eyes 2028 Launch | ||
| 09.07. | Japan's Rapidus Takes on TSMC With Aggressive 2nm Pricing, Reportedly Targeting up to ¥3.5M per Wafer | ||
| 09.07. | China Reportedly to Allow NVIDIA H200 Imports, but Approvals May Fall Below 200K Chips | ||
| 09.07. | BOE Forms Dedicated Teams for Micro LED Optical Interconnect and Glass Core Substrate CPO Technologies | ||
| 09.07. | imec Roadmap Extends to A3 by 2038; Chip Density Gains Shift Beyond Traditional Transistor Scaling | ||
| 08.07. | Wolfspeed Sues Navitas Over GaN, SiC Patents, Reportedly Seeks U.S. Sales Ban | ||
| 08.07. | Intel Patent Reveals XBM Matching HBM4 Footprint Without Interposers; Commercialization Seen After 2030 |
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