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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | Applied Materials and GlobalFoundries Achieved Strategic Collaboration | ||
| Di | Panasonic Reportedly Offering Early Retirement in Consumer Electronics in Oct.; Battery Unit Safe | ||
| Mo | Breaking the Memory Wall: HBM Basics and the Rise of HBM4 in AI | ||
| Mo | Will the Investment Pay Off? Trillions Poured Into AI, Yet Chips Reportedly Last Only 3-5 Years | ||
| 26.09. | TSMC Arizona Names 5nm Veteran Ray Chuang as CEO to Accelerate U.S. Expansion | ||
| 26.09. | U.S. Reportedly Weighs 1:1 Rule on Domestic vs. Imported Chips, Favoring TSMC, GF and Micron | ||
| 26.09. | Intel Reportedly Explores TSMC Investment, Raising Fears of Tech Outflow | ||
| 26.09. | China's NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and Huawei | ||
| 26.09. | China's "Big Fund III" Invested RMB 450 Million in Semiconductor Equipment | ||
| 26.09. | Qualcomm Launches Snapdragon 8 Elite Gen 5, May Plan Samsung Galaxy-Exclusive Version | ||
| 25.09. | TSMC 1.4nm Fab in Central Taiwan Science Park Reportedly to Break Ground in 4Q25 | ||
| 25.09. | Intel Reportedly Explores Investment Talks With Apple, Foundry Seen as Key | ||
| 25.09. | AI Boom Pushes Global Hectocorns Estimated Combined Valuation to $1.4T; OpenAI Leads | ||
| 25.09. | SK hynix Reportedly Doubling EUV Fleet by 2027, Potentially Set to Rank Third Globally | ||
| 24.09. | [Insights] Memory Spot Price Update: DDR4 Drives DRAM Price Rally, Mainstream Chips Surge 6.88% This Week | ||
| 24.09. | Micron Counters HBM4 Speed Doubts with 11+ Gbps, Custom HBM4E Due 2027 with Higher Margins | ||
| 24.09. | Apple's Foldable iPhone Trial Still Unsettled, Taiwan's Taoyuan Free Trade Zone Seen as Likely Site | ||
| 24.09. | NVIDIA's OpenAI Mega-Deal: AI Boom Proof or Customer Bailout Amid Antitrust and Conflict Concerns? | ||
| 24.09. | AMEC Co-Founds RMB 1.5B VC Fund, Contributing RMB 735M amid China's Semiconductor Push | ||
| 24.09. | Micron's 2026 HBM Not Sold Out Yet-But Will Reportedly Be Within Months as Pricing Deals Lock | ||
| 24.09. | Taiwan-Backed Photonics Chip Startups Target Cloud Giants with 2026 Launch | ||
| 24.09. | Huawei Released SiC Thermal Management Technology Patents | ||
| 23.09. | OpenAI Reportedly Partners with Apple Supplier Luxshare for AI Hardware, Launch Slated for 2026-2027 | ||
| 23.09. | TSMC Reportedly Raising N3P Prices 20% Ahead of 2nm Era, Pressuring Qualcomm and MediaTek | ||
| 23.09. | MediaTek Reportedly Eyes U.S. Production with TSMC; Dimensity 9500 Targets Apple A19 Pro |
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