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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 29.09. | Samsung Sees HBM Taking Nearly 30% of Industry DRAM Capacity in 2027, Up From 20% Currently | ||
| 29.09. | China Unveils 15th Five-Year Battery Plan, Targets Initial Large-Scale All-Solid-State Battery Deployment by 2030 | ||
| 29.09. | TSMC Reportedly Eyes Texas Expansion That Could Top US$265B; VIS-NXP Mulls Second Singapore Fab | ||
| 28.09. | Micro LED Optical Interconnects Take Center Stage at CIOE 2026 | ||
| 28.09. | China State-owned Enterprise Restructuring Fund Makes Strategic Investment in Hyper Photonix | ||
| 25.09. | 12-inch Wafer Price Hikes Loom for 2027 as AI Demand Tightens Supply, with LTAs Reportedly Up 15-40%+ | ||
| 25.09. | Rare Earths in Focus Ahead of Trump-Xi Talks as U.S. Dependence on China Could Last Into 2030s | ||
| 24.09. | CXMT, YMTC Ramp Memory Capacity, but China's AI, Cloud Boom Could Soak Up New Supply Through 2027 | ||
| 24.09. | Meta to Launch Charm Device for Muse AI in December, Unveils New VR and Ray-Ban Glasses | ||
| 24.09. | Micron Reportedly Ends 2GB GDDR7, Narrowing Supply Options for NVIDIA's RTX 50 Series | ||
| 24.09. | Ligent Technologies Goes Public on HKEX, Raising $723M to Scale Optical Transceiver and Chip Capacity | ||
| 24.09. | Qualcomm Says Announced 2nm Chips Will Use TSMC, Keeps Door Open to Samsung Foundry | ||
| 23.09. | [Insights] Memory Spot Price Update: DRAM Spot Prices Hold Cautious Tone; DDR4 2Gx8 Drops 3.6% | ||
| 23.09. | German Court Reportedly Finds Micron Infringed Two YMTC NAND Patents, Grants Injunctions | ||
| 23.09. | Samsung's LPDDR6 Passes Industry-First Snapdragon Validation; Galaxy S27 May Split Memory Tiers | ||
| 23.09. | DeepSeek Reportedly Expands Huawei Chips to AI Training; New Supply Could Arrive in 4Q26 | ||
| 23.09. | BOE Joins Glass Substrate Race as Samsung Electro-Mechanics, SKC, LG Eye 2027-2028 Ramp | ||
| 23.09. | China's A-Share Semiconductor Profit Jumps 607% YoY in 1H26; CXMT Tops Both Revenue and Profit Rankings | ||
| 23.09. | [Breaking] Intel EMIB Substrate Yields Reportedly Hit 45%, Suppliers Eye 60% by 1Q27 | ||
| 22.09. | Korea's HBM-Related Exports to Malaysia Soar 5.7-Fold in One Year as AI Packaging Demand Rises | ||
| 22.09. | Alibaba Unveils AI Chip Zhenwu V900 for 1Q27 Mass Production, Maps Out New Server CPUs for 3Q27 | ||
| 22.09. | Meta's Muse Highlights AI Agents' Higher CPU-to-GPU Needs, Could Benefit Intel, AMD, and Arm | ||
| 22.09. | TSMC's A14 Race Heats Up: Pilot Run Reportedly Pulled Forward to 1Q27, Closing In on Intel's 14A | ||
| 22.09. | Intel Unveils Micro-LED-Based Glass Substrate Packaging Technology Patent | ||
| 22.09. | Micron Earnings Preview: Can the Margin Boom Last? HBM4 Ramp and Long-term Contracts in Focus |
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