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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Mo | UMC, VIS, PSMC Reportedly Eye Mature-Node Price Hikes Up to 10% From Apr.; IC Costs May Rise | ||
| Mo | NVIDIA GTC Could Spotlight CPUs for Agent AI with Intel Partnership and CPU Racks Highlighted | ||
| Mo | China Completed the World's First 35-micron Ultra-Thin Wafer Process and Packaging & Testing Production Line | ||
| Mo | Iran Conflict Threatens Helium for Chip: China's Domestic Supply Push in Focus | ||
| Fr | Intel Reportedly Says CPU Supply Tightness Is Affecting All Customers; Chromebooks Hit Hard | ||
| Fr | Hybrid Bonding Leader BESI Reportedly Draws Takeover Interest; Lam, Applied Materials Rumored | ||
| Fr | China's No.3 Foundry Nexchip to Hike Prices 10% from June, Following SMIC, Hua Hong | ||
| Fr | Samsung and NVIDIA Team Up on Ferroelectric NAND R&D, Key Step Toward 1000-Layer NAND | ||
| Fr | Samsung Reportedly Asks Execs to Fly Economy as Mobile Risks Worst-Ever Q1 on Memory Costs | ||
| Fr | Micron Reportedly Schedules March 26 Tool Move-In at PSMC Tongluo Fab, Signaling Next Deal Phase | ||
| Fr | NVIDIA May Offer First Look at Feynman at GTC 2026, TSMC A16 and Taiwan Supply Chain in Focus | ||
| Fr | SerDes Wars Heat Up: Broadcom, Marvell, MediaTek Battle for AI Interconnect Supremacy | ||
| 12.03. | India Reportedly Eyes Smartphone Export Incentives as Apple Said to Make Quarter of iPhones There | ||
| 12.03. | Google Makes First Appearance in Samsung's Top Five Clients in 2025 amid Soaring TPU Demand | ||
| 12.03. | Chip Price Hike Wave: NXP Reportedly Sets Apr. 1 Increase as Texas Instruments, Infineon Also Raise Prices | ||
| 12.03. | UMC, HyperLight Team up to Mass-Produce TFLN Chiplets, Targeting 1.6T Data Center Bandwidth | ||
| 12.03. | Meta's In-House AI Chip Push: Four New Accelerators Gear Up Amid Memory Crunch by 2027 | ||
| 12.03. | Chinese Scientists Advances Lithium Tantalate-Silicon Nitride Heterogeneous Integrated Photonic Chips | ||
| 12.03. | Peric Special Gases Drives China's Tungsten Gas Push Amid Memory Boom and Rival Price Hikes | ||
| 11.03. | Sony Reportedly Maintains 2027-2028 PS6 Launch Despite Memory Costs as TSMC 3nm Booked | ||
| 11.03. | China IC Exports Hit 304.7B Yuan in Jan-Feb 2026, Up Nearly 70% as AI Lifts Mature-Node | ||
| 11.03. | NVIDIA Reportedly May Revive RTX 3060 on Samsung 8nm Amid China Curbs, TSMC Constraints | ||
| 11.03. | Applied Materials Teams Up with Micron, SK hynix for Next-Gen DRAM, HBM and NAND Development | ||
| 11.03. | Micro LED CPO Goes Viral and Several LED Companies Reveal Development Progresses | ||
| 11.03. | China's Lisuan to Launch 6nm Gaming GPU on March 12, Targeting NVIDIA RTX |
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