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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Di | SK hynix, SanDisk Debut HBF Standard to Challenge AI Memory Bottlenecks with Google, Tenstorrent Support | ||
| Di | Across-the-Board 30% Price Hike: MLCC Price Surge Intensifies | ||
| Di | Kioxia Steps Up AI NAND Competition With South Korean Rivals, Eyes PCIe 6.0 and UFS 5.0 Mass Production | ||
| Mo | Samsung Foundry Eyes 2H26 Full Utilization as HBM4 Base Dies and U.S. Orders Fuel Turnaround Hopes | ||
| Mo | AMEC Targets 60% High-End Market Coverage Within Five Years as China's Chip Equipment Ambitions Grow | ||
| Mo | TSMC 3nm Monthly Wafer Starts to Hit 180K by Early 4Q26 on Strong Demand, 2-3 Months Ahead of Expectations | ||
| Mo | MediaTek Advances 400G SerDes on 2nm, Targeting Google TPU v10 and Meta AI ASIC Orders | ||
| Mo | ZJ Innolight Debuts on HKEX in Record IPO as InP Substrate Bottleneck Intensifies | ||
| Mo | Kumamoto Fab Restart Update: TEL, Sony Resume Operations; TSMC's JASM Fab 1 Under Inspection after M7.1 Quake | ||
| 31.07. | Kioxia 1QFY26 Gross Margin Hits 80%; Reaffirms 50% LTA Target for 2028 | ||
| 31.07. | DDR5 MRDIMMs Gain Momentum; Renesas Unveils 16,000 MT/s Chipset as AMD Reportedly Eyes Adoption | ||
| 31.07. | NAND's 2026 Playbook: Samsung, SK hynix Chase Upgrades and SSD Mix Over Volume | ||
| 31.07. | ASE Again Raises 2026 CapEx to Record US$10.5B; Eyes 2x Leading-Edge Advanced Packaging Revenue by 2027 | ||
| 31.07. | TSMC Reportedly Develops EMIB-like Packaging with Kinsus to Prevent Potential Customer Shift to Intel | ||
| 31.07. | Israel Reportedly Withdraws $425M Intel Grant as Kiryat Gat Expansion Remains Uncertain | ||
| 31.07. | Samsung to Start Taylor Fab 2 Build by End-2026, Targets 2030 Mass Production; Eyes 1.4nm Expansion | ||
| 30.07. | Ahead of Cook's Final Apple Earnings Call: Rising Memory Costs and Potential Sep. iPhone Price Hike in Focus | ||
| 30.07. | Samsung Targets 60-70% Capacity Under LTAs; Five Key Customers Reportedly Include AWS, Microsoft, Google | ||
| 30.07. | TSMC's 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028 | ||
| 30.07. | Samsung's DS Unit Delivers 99.7% of Q2 Profit amid Memory Boom; HBM4 Revenue Reportedly to Triple in Q3 | ||
| 30.07. | Mass Production and Capacity Expansion Accelerate, Reshaping the Foundry Landscape in Silicon Photonics | ||
| 30.07. | Intel Reportedly to Cut 103 Jobs in Mid-August After DCAI Layoff News Emerges | ||
| 29.07. | Samsung Electro-Mechanics Lifts MLCC Prices 30% Starting Aug. 1; Taiyo Yuden Reportedly Eyes Sept. 1 Hike | ||
| 29.07. | [Insights] Memory Spot Price Update: DRAM Spot Prices Rise Slightly as DDR3, DDR4 and DDR5 Inquiries Pick Up | ||
| 29.07. | U.S. Unveils Bans Targeting Chinese Robots, Power Inverters; Unitree, Sungrow Poised to Be Hit |
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