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Aktuelle News von TrendForce

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  • letzte 200 News
ZeitAktuelle Nachrichten
FrContinental Establishes Semiconductor Division, a Step for in-House Chip Development
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26.06.China's New Rare Earth Rules Reportedly Target Experts, Curb Overseas Travel to Prevent Leaks
26.06.Samsung Nears Qualcomm 2nm Deal as Foundry Recovery Gains Momentum
26.06.Micron Scales Up HBM to Four Major GPU/ASIC Clients; Targets 24% Market Share by Year-End
26.06.NVIDIA and Foxconn in Talks to Deploy Humanoid Robots in Houston, Production Expected Next Year
26.06.Xiaomi Makes Waves Again: XRING O2 Trademark Reportedly Filed, AI Smart Glasses Coming Soon
25.06.Samsung Reportedly Prioritizes 2nm/4nm Improvements, with 1.4nm Unlikely Before 2028-29
25.06.[Insights] Memory Spot Price Update: DDR4 Module Prices Overtake DDR5; Tariff Fears May Trigger Panic Buying
25.06.Samsung Pushes for 2nm Breakthrough as Industry Bets on TSMC's 3nm FinFET
25.06.Intel Reportedly Braces for Major Layoffs on July 15, Closes Automotive Unit
25.06.Intel Panther Lake Preview: Is 18A the Long-Awaited Game-Changer?
25.06.[Insights] China's Rare Earth Export Restrictions Sound Alarm for Global Tech Industry
24.06.OpenAI and Jony Ive's First AI Device Leaked: Reportedly No Wearables, Launch No Earlier Than 2026
24.06.Japan Reportedly Develops Tech to Cut Heavy Rare Earth Use Amid Dependence on China
24.06.Fujitsu Taps TSMC for 2nm CPU, But Flags Rapidus as Key to Supply Chain Diversification
24.06.Historic DDR4 Spot Price Rally Reportedly Doubles DDR5, Propelling Nanya Tech's Inventory Windfall
24.06.NVIDIA Ramps up Investment in AI Startups at Full Speed
24.06.Samsung Reportedly Resumes Cleanroom Work at Taylor in Q2; 2nm Tool Move-In Targeted for 2026
23.06.If US Revokes Chip Tool Exemptions: Unpacking TSMC, Samsung, and SK hynix's China Operations
23.06.Wolfspeed Nears Bankruptcy as Renesas Warns of JPY 250 Billion Loss
23.06.TSMC Q2 Margins Reportedly Under Pressure as U.S. Eyes Waiver Revocation, NTD Surge
23.06.CellWise Sold the Controlling Stake in its Overseas Foundry at SEK 2.37B
23.06.ASML's High-NA EUV May Play a Smaller Role in Future Chipmaking, Intel Director Reportedly Claims
20.06.UMC Reportedly Eyes Southern Taiwan Facility for Advanced Packaging Expansion Beyond Singapore