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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 02.09. | Samsung Reportedly Plans Big September Reveal: Tri-Fold Phone, XR Headset, AI Smart Glasses | ||
| 02.09. | Applied Materials Reportedly Flags Minimal Effect of U.S. Incentives, Offers Nuanced View on China | ||
| 02.09. | TSMC Partners with Technical University of Munich to Establish AI Chip R&D Center in Bavaria | ||
| 02.09. | Alibaba Reportedly Unveils AI Chip Rivaling NVIDIA's H20, Boosting Taiwan's Server ODM Inventec | ||
| 02.09. | Samsung, SK hynix Reportedly Delay Phase-out to 2026 as DDR4 Becomes Unexpected Cash Cow | ||
| 02.09. | Ennostar Expands into Robotics, Unveils Mini/Micro LED Human-Machine Interface Displays | ||
| 02.09. | Memory Giant, Fragile Link: Korea's Reliance on Japan in HBM Supply Chain | ||
| 01.09. | NVIDIA's Jensen Huang to Join APEC in Oct., Raising Hopes for US-Korea Chip Push | ||
| 01.09. | Samsung Reportedly Restarts Taylor Equipment Orders, Appoints New Head to Lead Operations | ||
| 01.09. | Huawei's R&D Hits Record 22.7% of 1H25 Sales, Dragging Profits Amid Chip Drive | ||
| 01.09. | Rapidus 2HP Reportedly Surpasses Intel 18A Logic Density Impacted by BSPDN, Rivals TSMC | ||
| 01.09. | U.S. Revokes China Chipmaking Tool Licenses for Samsung, SK hynix: Decoding Market Impact | ||
| 01.09. | UltraRAM Reportedly Nears Commercialization: DRAM Speed, NAND Durability, 1K-Year Data Life | ||
| 01.09. | HBM Evolution Outpaces JEDEC Standards as Generation Cycles Reportedly Shrink to 2.5 Years | ||
| 29.08. | Memory Giants Diverge on HBM Base Die: Micron Reportedly Delays Foundry Shift, Risks Losing Edge | ||
| 29.08. | NVIDIA's Top 2 Customers Jump to 39% of Sales from 25% Last Year, Raising Client Dependence Concerns | ||
| 29.08. | SMIC 1H25 Net Profit Rises 35.6%, 7nm Capacity Reportedly to Double in 2026 | ||
| 29.08. | Intel CFO Says Trump Deal Prevents It From Selling Its Loss-Making Foundry | ||
| 29.08. | Broadcom Reportedly Boosts 2026 CoWoS Orders with Foundries on Strong ASIC Demand | ||
| 29.08. | GlobalFoundries Reportedly Cuts U.S. Jobs, Says CHIPS Act Funding Involves No Equity | ||
| 29.08. | SK hynix Launches Industry-First High-K EMC Mobile DRAM with 3.5x Higher Thermal Conductivity | ||
| 28.08. | Intel Faces Another Executive Exodus: Advanced Packaging Director Leaves for Analog Devices | ||
| 28.08. | Samsung Reportedly Weighs Intel Packaging Investment, Glass Substrate Tie-Up to Challenge TSMC | ||
| 28.08. | TSMC's 2nm Leak Update: 3 Engineers Indicted for Stealing Core Tech, Facing Up to 14 Years | ||
| 28.08. | China Reportedly to Triple AI Chip Output Next Year With Fabs Serving Huawei, Cutting NVIDIA Reliance |
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