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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 06.03. | "China's ASML" by 2030? SMIC, Naura and Other Chip Leaders Call for National Effort | ||
| 06.03. | Industry Weigh 825-900 µm HBM Thickness for 20-High Stacks, Potentially Slowing Hybrid Bonding | ||
| 06.03. | [Insights] Early March Panel Prices: TV Strength Continues; MNT Turns Up While NB Weakness Moderates | ||
| 06.03. | Apple Reportedly Uses A18 Pro with 8GB RAM in MacBook Neo Amid TSMC Supply Constraints | ||
| 06.03. | U.S. Reportedly Mulls Tiered AI Chip Export Rules, 200K+ Units Need Investment, Official Assurances | ||
| 06.03. | Tiny "Mouse Bites" in Transistors Mapped by Cornell, ASM & TSMC Using Electron Microscopy | ||
| 06.03. | Nanya Tech Reportedly Starts Custom AI Memory Trial, Progress Set to Show in H2 2026 | ||
| 05.03. | NVIDIA Reportedly Halts H200 Production Amid China Sales Uncertainty, Shifts TSMC Capacity to Vera Rubin | ||
| 05.03. | U.S. Plans to Ban Select Chinese Chips in Federal Procurement from Dec. 2027, Lifting Korean Chipmakers | ||
| 05.03. | Intel Reportedly Reconsiders 18A for External Use, Hinting EMIB Could Generate Billions by 2H26 | ||
| 05.03. | Broadcom Reportedly Eyes $100B AI Chip Revenue in 2027, Backed by 6 Key Clients Like Google | ||
| 05.03. | Nanya Tech: DRAM Up Month by Month in 1Q, Sharp 2Q Jump Ahead, Shortage Through 2028 | ||
| 05.03. | SK Hynix Commits Additional USD 15 Billion, Escalating Fab Expansion Race among Memory Giants | ||
| 05.03. | South Korea Steps Up Push for Next-Generation Power Semiconductors | ||
| 04.03. | [Insights] Memory Spot Price Update: DRAM Spots Top Contracts, Sentiment Cautious Ahead of Q2 Negotiations | ||
| 04.03. | Tesla Reportedly Weighs Doubling AI6 Output, May Add Samsung Orders Ahead of Executive Talks | ||
| 04.03. | Middle East Escalation Hits Tech: NVIDIA Shuts Dubai Office, AWS Data Center Strike Raises Concerns | ||
| 04.03. | Asia's Chipmakers Reportedly Eye $136B Spend in 2026, Up 25% YoY, Spanning Foundry and Memory | ||
| 04.03. | Intel Appoints Former Qualcomm and Google Executive Craig H. Barratt as Chairman, Effective May | ||
| 04.03. | SOCAMM War Heats up: Micron Ships 256GB SOCAMM2 Samples, Topping Industry Capacity | ||
| 04.03. | Wafer Capacity Set to Surge: A New Phase for the SiC Industry in 2026 | ||
| 04.03. | Inside Look at Micron's Newly Opened Sanand Plant: 10% of Global Output, Key Products and Clients | ||
| 03.03. | SK hynix Reportedly Explores New HBM4 Packaging, Boosting Performance via Tight DRAM Gaps | ||
| 03.03. | SKC Reportedly Channels Over Half of Won 1T Capital Increase Into Absolics to Fast-Track Glass Substrates | ||
| 03.03. | Delay at Samsung's Taylor Reportedly Slips Mass Production to 2027, Raising Concerns for Tesla |
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