- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 28.08. | Apple Foldable Screen Repair Could Top $1,155, Nearly Twice Galaxy Z Fold 8 | ||
| 28.08. | Micron Taiwan Strike Vote Possible in Sept. as ~80% Union Back Action Over Bonus Gap With Samsung, SK hynix | ||
| 28.08. | Trump Reportedly Eyes Broad Chip Tariffs on End Products; Consumer Demand Could Face Further Pressure | ||
| 28.08. | SK hynix Breaks Ground on Indiana Packaging Plant, Eyes HBM4E by 3Q29; CEO Sees Tight Supply Through 2030 | ||
| 28.08. | TSMC-Linked VIS' Fab 3 Fire Puts Further Pressure on Tight 8-Inch Capacity | ||
| 28.08. | HBF Promises Massive Capacity but Could Reportedly Cost More Than HBM, With Bandwidth at Just ~60% of HBM | ||
| 28.08. | YMTC Deepens Supplier Ties as 17 IC Firms Commit RMB 6B in Wuhan, With AMEC Among Key Players | ||
| 27.08. | Qualcomm Reportedly Enlists Samsung, SK hynix as HBC Memory Partners; TSMC Eyes Packaging Role | ||
| 27.08. | Apple's First Ternus-Era Launch Event Set for Sept. 9, Foldable May Debut; Standard iPhone 18 Eyed for 2027 | ||
| 27.08. | Kioxia Reportedly Plans JPY 1T+ NAND Fab in Japan, Operations Eyed for 2029 or Later | ||
| 27.08. | NVIDIA's Supply Commitments Soar to $279B as Memory Costs Surge; New NVHBM Boosts Bandwidth 30% | ||
| 27.08. | Apple Suppliers Diverge in 1H26: Lens Profit Halves on Rising Memory Costs, Luxshare Revenue Jumps 40% | ||
| 27.08. | Samsung Electro-Mechanics, LG Innotek Ramp Up AI Substrate Capacity as 1H Utilization Reportedly Nears 90% | ||
| 26.08. | Samsung's 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027 | ||
| 26.08. | South Korea's DRAM Prices Reportedly Soar 12.5-Fold in 3 Years, Outpacing Gold | ||
| 26.08. | Apple Unveils M6, Its First 2nm Chip Built by TSMC, With 30% AI GPU Compute Boost vs. M5 | ||
| 26.08. | OpenAI Debuts Jalapeño AI Inference Chip, with Samsung Reportedly Supplying HBM4 | ||
| 26.08. | Mercedes-Benz Expands Micro LED Headlamps to C-Class Lineup | ||
| 26.08. | China Flash Unveils 28nm NOR Flash with 2Gb Capacity, Reportedly Reaching Industry's Most Advanced Node | ||
| 25.08. | U.S. May Push Near-Total ASML China Ban on DUV Sales and Servicing Amid China Domestic Lithography Push | ||
| 25.08. | Intel Unveils Three AI Architectures at Hot Chips 2026, Diamond Rapids Taps In-House 18A-P and Advanced Packaging | ||
| 25.08. | Xiaomi XRING O3 Reportedly Features CXMT LPDDR6, TSMC 3nm, May Expand TSMC Ties to AI and Auto Chips | ||
| 25.08. | NVIDIA's Reported 15% Server Hike Boosts Samsung, SK hynix, With HBM Prices Potentially Up 50%+ in 2027 | ||
| 25.08. | [Insights] Tantalum Prices Nearly Triple on AI Demand, Supply Disruptions; EV Capacitor Lead Times Reportedly Top 1 Year | ||
| 25.08. | Micron Warns AI Memory Wall Worsens; Cites HBM in 17% of Meta Llama 3 Training Interruptions |
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