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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 26.05. | SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction | ||
| 26.05. | Japan's Adhesive Tape Firm Lintec Targets EUV Pellicles, Reportedly Plans ¥7B Investment and 2026 Production | ||
| 26.05. | Huawei Unveils New Semiconductor Principle - Tau (t) Scaling Law | ||
| 25.05. | Samsung Reportedly Begins V9 NAND Cleanroom Build-Out in Xi'an Following V8 Ramp-Up and V6 Phase-Out | ||
| 25.05. | Intel Roadmap Leak Hints at NVIDIA GPUs in 2028 Titan Lake-B/BX; Hammer Lake May Revive Hyperthreading | ||
| 25.05. | South Korea-Netherlands Chip Ties May Go Beyond ASML; Silicon Photonics Seen as a Key Opportunity | ||
| 25.05. | AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech's FOPLP Packaging Said to Be Under Evaluation | ||
| 25.05. | Industry Reportedly Eyes Separating HBM From GPUs to Expand Memory Capacity; Optical Links May Be Key | ||
| 25.05. | [Insights] As COMPUTEX Nears, Has x86 Already Won the PC Battle Against Arm? | ||
| 22.05. | Micron Turns More Upbeat on Outlook, Reportedly Sets 2027 HBM4E Ramp with TSMC for Standard and Custom Logic Dies | ||
| 22.05. | Huawei Reportedly Builds 122TB SSDs With New Packaging Tech Despite Limited 100+ Layer 3D NAND Access | ||
| 22.05. | SMIC, Hua Hong Reportedly Lift Prices Amid AI-Driven Capacity Shifts; Hua Hong Expects More 12-Inch Hikes in 2026 | ||
| 22.05. | PSMC Joins Intel, SAIMEMORY to Demo 9-Layer Via-in-One Architecture for High Bandwidth 3D Memory | ||
| 22.05. | Huawei Takes Stake in InP Optical Chip Firm Milphoton Semiconductor | ||
| 22.05. | Samsung Reportedly Shifts GaN Strategy to Foundry on Customer Growth; Operations May Start in July | ||
| 21.05. | AMD's Lisa Su Reportedly to Visit TSMC for 2nm Capacity; Announces US$10B Taiwan AI Packaging Investment | ||
| 21.05. | DDR4 Shortage Reportedly Limits Nanya Tech's DDR5 Shift; GM Says DRAM Margins Across Segments Top HBM | ||
| 21.05. | Micron Reportedly Expands Korea HBM Hiring Amid Samsung Labor Tensions; Annual Pay Reaches KRW 300M | ||
| 21.05. | NVIDIA Earnings Spotlight: $20B CPU Sales Target in 2026, China Concession to Huawei, and Reporting Overhaul | ||
| 21.05. | Researchers Develop Piezoelectric Hybrid Chip, Achieving 96.2% Power Conversion Efficiency for GPU | ||
| 21.05. | Alibaba T-Head Unveils Zhenwu M890 With 3× Performance vs. Prior Gen; New AI Chips Planned for 3Q27/3Q28 | ||
| 20.05. | [Insights] Memory Spot Price Update: DDR5 Spots Strengthen on Branded Demand and Higher Bids, DDR4 Weakens | ||
| 20.05. | ADATA Sees Samsung Strike Boosting Memory Prices; China Expansion Impact Seen No Earlier Than 2028 | ||
| 20.05. | Meta Reportedly Lays Off 8,000 Workers Amid AI Push; Cuts Seen Saving Only US$3 Billion Against Rising CapEx | ||
| 20.05. | ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC's Cost-Driven Delay |
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