- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 14.08. | Applied Materials Lifts 2026 Packaging Growth Above 70%; DRAM Set to Accelerate, China Remains Key Market | ||
| 13.08. | ADI Reportedly Set to Raise Prices Again on September, With Military Chips Facing Up to 30% Hike | ||
| 13.08. | AI Agents Enter Chipmaking: SK hynix Tests Back-End Deployment; Samsung Cuts SoC Verification to 2 Days | ||
| 13.08. | Samsung, SK hynix's HBM4 Push Puts HBM, General Memory Pricing in the Spotlight for 2H Earnings | ||
| 13.08. | Intel Reportedly Hints at Memory Reentry, Eyes CPU-Memory Stacking as XBM Patent Emerges | ||
| 13.08. | GaN Patent Battle Heats Up: Navitas Sues Renesas After Trade-Secret Claims | ||
| 13.08. | Huawei Reportedly Readies Mate 90, XT2 for September with Tau Scaling-Based Chips, Claiming 3nm-Level Performance | ||
| 12.08. | Micron Flags HBM4E as Start of Custom HBM Era; HBM Market Could Tilt Toward Dual-or-Single Suppliers | ||
| 12.08. | SK hynix Reportedly Restarts Dalian Fab 2, Targets 1H27 Mass Production and 50% China NAND Capacity Boost | ||
| 12.08. | [Insights] Memory Spot Price Update: DRAM Spot Trading Stays Subdued as Pricing Gap Persists; DDR4 Up 0.93% | ||
| 12.08. | ASE's SPIL Breaks Ground on Nearly TWD 100B Plant in Douliu to Boost CoWoS Capacity, Operations Set for 2028 | ||
| 12.08. | Micron Meets Less Than Half of Data Center Demand as Customers Rush to Secure Memory at "Very High" Prices | ||
| 12.08. | China's 12-Inch Silicon Wafers Hit the Accelerator with Billions in New Capacity Investments | ||
| 12.08. | Musk Signals Interest in FEL-EUV for Terafab, Potentially Cutting Power vs. ASML's Current Light Source | ||
| 11.08. | Samsung Reportedly Eyes High-NA EUV for 1nm around 2030 as TSMC Also Takes a Cautious Approach | ||
| 11.08. | TSMC's 5.5-Reticle CoWoS Reportedly Tops 99% Yield; Flags Memory, ABF as AI Bottlenecks | ||
| 11.08. | Apple Reportedly Plans Glass-Heavy 2027 iPhone Pro amid Design Scrap Rumors; Samsung Adds 1M Fold 8 Units | ||
| 11.08. | SK hynix-linked BCPE Pangea Cayman2 Becomes Kioxia's Largest Shareholder; Influence Under Scrutiny | ||
| 11.08. | Microsoft Eyes Maia 300 Launch in Sep., Reportedly Seeks 300K TSMC Capacity as Google, AWS Race Ahead | ||
| 11.08. | Xiamen Sets Up China's Largest GaAs Satellite Solar Cell Production Base | ||
| 11.08. | China's AI Chip Makers Make Waves: Cambricon 1H26 Net Profit Surges 123%, Moore Threads Eyes HK Listing | ||
| 10.08. | SK hynix's Chongqing Sale Plan Signals a Global Production Reset, Not a China Exit-Or Full Ownership of Every Site | ||
| 10.08. | TSMC, Sony Reportedly Plan JPY 1 Trillion JV for Image Sensors in Kumamoto, Eye 2029 Mass Production | ||
| 10.08. | TSMC Reportedly Eyes Two AUO Fabs Worth TWD 30B+ for FOPLP and CoPoS; Longtan Could Add 1.4nm | ||
| 10.08. | Samsung's HBM4 Yield Reportedly Hits 80% as HBM Race Heats Up, SK hynix Labor Talks Add a Twist |
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