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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 24.09. | Taiwan-Backed Photonics Chip Startups Target Cloud Giants with 2026 Launch | ||
| 24.09. | Huawei Released SiC Thermal Management Technology Patents | ||
| 23.09. | OpenAI Reportedly Partners with Apple Supplier Luxshare for AI Hardware, Launch Slated for 2026-2027 | ||
| 23.09. | TSMC Reportedly Raising N3P Prices 20% Ahead of 2nm Era, Pressuring Qualcomm and MediaTek | ||
| 23.09. | MediaTek Reportedly Eyes U.S. Production with TSMC; Dimensity 9500 Targets Apple A19 Pro | ||
| 23.09. | SK hynix Reportedly Negotiates Price Adjustments with Customers Following Micron and Samsung | ||
| 23.09. | SK hynix Reportedly Launches M15 Pilot Line for 1b DRAM Production Amid Big Tech HBM Surge | ||
| 23.09. | China Reportedly Blocks NVIDIA RTX Pro 6000D; Samsung, SK hynix Impact Seen as Limited | ||
| 22.09. | TSMC 2nm Customer Surge: 15 Clients Reportedly Secured, 10 in HPC | ||
| 22.09. | Trump Proposes H-1B Visa Changes, Pressuring Indian Tech Workers; TSMC Reportedly Unaffected | ||
| 22.09. | Samsung Reportedly Plans Q4 Memory Price Hikes: DRAM Up 30%, NAND Up 10% | ||
| 22.09. | Samsung 12H HBM3e Reportedly Clears NVIDIA Tests After 18-Month Setback, HBM4 Reaches Final Phase | ||
| 22.09. | AI Fuels High-Speed Interconnects, NVIDIA, Google, AWS Boost Optical Transceiver Module Demand | ||
| 22.09. | Researchers Propose "Beyond EUV" Using Soft X-Rays, Potentially Challenging High-NA EUV | ||
| 19.09. | China's Rare-Earth Shipments Hit Record in Aug. Before Xi-Trump Talks Amid Ongoing Access Risks | ||
| 19.09. | STMicroelectronics Joins Panel-Level Packaging Race with New French Pilot Line, Launching 3Q 2026 | ||
| 19.09. | DDR4, DDR5 October Prices to See Double-Digit Gains; Taiwan's DRAM Makers Poised to Benefit | ||
| 19.09. | Samsung Reportedly Secures Foundry Deal for IBM Power11 Using 7LPP EUV Process | ||
| 19.09. | Mega NVIDIA-Intel Deal: No Chipmaking Orders, Co-Developed Products Might Launch 2027-28 | ||
| 19.09. | Japan Pledged JPY 536 Billion to Micron, Escalating Global Semiconductor Subsidy Race | ||
| 19.09. | India's Chip Push Grows as ARM Unveils Design Office for Advanced Chips, Including 2nm | ||
| 18.09. | TSMC Reportedly Denies Halting 2nd Phase of Chiayi, Taiwan Packaging Plant Amid U.S. Expansion | ||
| 18.09. | Samsung Reportedly Wins Additional $250M Subsidy from Texas for Taylor Plant | ||
| 18.09. | Huawei Unveils Ascend 950 with In-House HBM in 2026, Touts SuperPoD to Rival NVIDIA | ||
| 18.09. | Apple Reportedly Mulls Taiwan Pilot, India Mass Production for Foldable; Targets 10% Shipment Growth |
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