| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 27.07. | Intel 18A Gains External Adopter Hitachi for Silicon Quantum Chip Project; 1,000-Qubit System Targeted for FY2030 | ||
| 27.07. | Intel's CPU Momentum Builds: 10 Long-Term Deals Reportedly Lock In Demand; Intel 3 Capacity Tightens | ||
| 24.07. | China's DRAM Maker CXMT to Debut Jul. 27; IPO to Raise RMB 57.9B, Largest on STAR Market Since Launch | ||
| 24.07. | SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI | ||
| 24.07. | AMD Unveils Next-Gen CPU Roadmap: Florence Targets 2028 with Rumored Sub-2nm Node, Ravenna in 2030 | ||
| 24.07. | AMD Unveils MI455X Targeting Nvidia Rubin; TSMC 2nm, CoWoS-L Demand Seen Rising | ||
| 24.07. | Intel Pulls Forward 14A Timeline by One Year, Targeting 2028 Mass Production Near TSMC's Roadmap | ||
| 24.07. | HKC Announced Investment in Advanced Semiconductor Packaging and Testing | ||
| 24.07. | SKC Reportedly Pushes Glass Substrate Mass Production to 2027, Targets Final Validation by Year-end | ||
| 23.07. | Intel, AMD Reportedly Sign Long-Term Server CPU Deals with Chinese Customers Amid Tight Supply | ||
| 23.07. | Google Raises 2026 CapEx Guidance Again Above US$200B; Free Cash Flow Turns Negative for First Time | ||
| 23.07. | Musk Says Micron Is "Making Room" for Tesla in the Years to Come, Hinting at Long-Term Memory Supply | ||
| 23.07. | Samsung Unveils Galaxy Z Fold8 Lineup; Flagships Feature TSMC 3nm Chips, Price Hikes Reach US$100 | ||
| 23.07. | SK hynix Reportedly Eyed as Potential Partner to Operate Intel's Ohio Fab After Denying Acquisition Plans | ||
| 23.07. | GaAs and InP Substrate Project Approved in Chinese Zhejiang Province | ||
| 23.07. | Nanya Tech Sees Memory Market to Reach Record US$800B in 2026, Nearly Half of Semiconductor Revenue | ||
| 22.07. | AI Data Center Demand Revives HDD; Japanese Component Makers TDK, Resonac Expand Capacity | ||
| 22.07. | Samsung Reportedly Builds Hybrid Bonding Mass Production Line; Full-Scale Deployment Seen in 2029-2030 | ||
| 22.07. | [Insights] Memory Spot Price Update: DRAM Spot Market Edges Higher as Branded DDR4 Demand Supports Prices | ||
| 22.07. | Wistron Produces First U.S.-Made GB300 Baseboard; D1 Factory Represents Just 5% of NVIDIA's Output | ||
| 22.07. | TSMC Reportedly Plans Up to 10% Price Hikes in 2027, with Extra HPC Premiums: Apple, NVIDIA in Focus | ||
| 22.07. | Chinese Researchers Developed the World's First Phase-Change Memristor-Based Neural Dynamical System Chip | ||
| 22.07. | SK hynix Set to Post Record Operating Margin in Q2, as HBM Mix Weighs on ASP Growth and LTAs Gain Focus | ||
| 21.07. | Samsung Reportedly Targets 2026 CXL 3.2 Mass Production; SK hynix Advances New AI Memory Architecture | ||
| 21.07. | Moonshot Suspends Kimi K3 Subscriptions Amid Compute Crunch; Microsoft Reportedly Weighs Adoption |