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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 15.12.25 | Samsung Reportedly Nears 2nm Foundry Deal With AMD, Decision Possible Around Early 2026 | ||
| 15.12.25 | MediaTek Reportedly Secures Google v7e, v8e TPU Orders, Requests 7-Fold CoWoS Increase from TSMC | ||
| 15.12.25 | [Insights] Cambricon Remains China's Top AI Chip Startup; Rumored 2026 Triple Output Faces SMIC Limits | ||
| 15.12.25 | JFS Announced New Breakthrough in GaN Power Module, Poised for Pilot-Scale Validation | ||
| 15.12.25 | China Reportedly Promotes Domestic Chip Tool Adoption Under 50% Rule, Pressuring Korean Suppliers | ||
| 12.12.25 | SK hynix Reportedly Places HBM4 TC Bonder Order With ASMPT Amid Hanmi-Hanwha Patent Clash | ||
| 12.12.25 | Anthropic Emerges as Broadcom's Mega-Client; Margin Challenges Ahead | ||
| 12.12.25 | Samsung Chairman Reportedly Meets Musk, Granting Tesla CEO Dedicated Workspace at Taylor Fab | ||
| 12.12.25 | China's Apple Supplier Lens Tech Pivots to AI, Acquires NVIDIA-Certified Server Rack Maker | ||
| 12.12.25 | Apple Reportedly Plans 2026 AI Glasses Debut - With Cameras, Siri Upgrades, and More | ||
| 12.12.25 | Kioxia Reportedly to Make 332-Layer 10th-Gen NAND at Kitakami in 2026, Repurposing Existing Fab | ||
| 11.12.25 | TSMC Reportedly Weighs Shifting Kumamoto 2nd Plant from 6nm/7nm to 4nm Amid AI Demand | ||
| 11.12.25 | Canon Reportedly Mulls Multi-Billion-Yen Investment in Rapidus's 2nm Push | ||
| 11.12.25 | SK hynix Reportedly Aims 100 Million IOPS with AI-NAND by 2027 in Collaboration with NVIDIA | ||
| 11.12.25 | China's US$16.4B Chip Megamerger Collapses as Hygon and Sugon Call Off Deal | ||
| 11.12.25 | Samsung CEO Roh Reportedly to Meet Micron in Rare CES Meeting Over Tight Mobile DRAM Supply | ||
| 11.12.25 | Micron's Exit Reportedly Opens Door for Huawei to Target Korea's Consumer SSD Market | ||
| 11.12.25 | China's GPU IPO Wave Intensifies: MetaX Surpasses Moore Threads in Retail Investor Interest | ||
| 10.12.25 | [Insights] Memory Spot Price Update: DDR4 Rally Builds on 16Gb Strength; DDR5, DDR3 See Mild Pullbacks | ||
| 10.12.25 | Trump Approves H200 China Sales; U.S. Routing Reportedly Triggers 25% Revenue-Split Dispute | ||
| 10.12.25 | China Reportedly Adds Huawei, Cambricon AI Chips to Procurement List Ahead of H200 Approval | ||
| 10.12.25 | NVIDIA H200 Export to China Approved, Unlocking Gains for Taiwan OEMs, OSATs, and Server Suppliers | ||
| 10.12.25 | NAND Flash "Dry Year" Looms as Stock-Out Risk Reportedly Forces PC OEMs to Cut SSD Specs | ||
| 10.12.25 | Google to Launch First Gemini-Powered AI Glasses in 2026 | ||
| 10.12.25 | China's ACM Reportedly Lands Memory Giant Orders; Eyes HBM4-Compatible Cleaning Systems by 2026 |
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