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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 15.04. | Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up | ||
| 15.04. | China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 | ||
| 15.04. | ASML Raises 2026 Sales Outlook to €36B-€40B on Memory, Logic Demand; South Korea Share Hits 45% | ||
| 15.04. | [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% | ||
| 15.04. | Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain | ||
| 15.04. | HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% | ||
| 15.04. | Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization | ||
| 15.04. | [Insights] NVIDIA's US$2B Marvell Deal: What's the Strategic Significance for CPO and AI Interconnects? | ||
| 14.04. | Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch | ||
| 14.04. | China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7% | ||
| 14.04. | Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC | ||
| 14.04. | Samsung Reportedly Lifts HBM4 Logic Die Prices by 40-50% Amid AI Boom; 4nm at Full Capacity | ||
| 14.04. | Intel Launched World's First Thinnest GaN Chiplet | ||
| 14.04. | Apple Foldable Supply Chain Takes Shape: Samsung, Foxconn, Chinese Suppliers in Focus | ||
| 13.04. | Nanya Tech Reportedly Sees Double-Digit DRAM Price Gains in Q2, with Multiple Partnerships in Discussion | ||
| 13.04. | Rapidus Reportedly Launches Back-End Prototype Line; Japan Adds ¥631.5B to Support 2nm Push | ||
| 13.04. | NAND Controller Maker Silicon Motion Reportedly Sees Memory Tightness Persist, Supply Gap Widening in 2027 | ||
| 13.04. | SanDisk Reportedly Eyes 2H26 HBF Pilot Line; May Advance Previously Announced Timeline by Half a Year | ||
| 13.04. | TSMC Advances Panel-Level Packaging, CoPoS Pilot Line Reportedly Set for June Completion, 2028-29 Ramp Eyed | ||
| 13.04. | China Achieved Breakthrough in High-Performance 2D Semiconductor Materials | ||
| 13.04. | Samsung-Backed Vertical Die Research Reportedly Targets 10x I/O and 4x Bandwidth Gains for HBM | ||
| 10.04. | ASE Reportedly to Break Ground on Six New Plants in 2026; CPO Mass Production Expected to Begin This Year | ||
| 10.04. | China Memory Firms Ride AI Upcycle: Biwin 2025 Net Profit Surges 429% YoY; GigaDevice Leads HK Listings | ||
| 10.04. | PSMC Core Business Reportedly Swings to Profit in Q1; Micron Deal Adds Strategic Upside | ||
| 10.04. | Amazon Weighs In-House Chip Sales as Unit Set to Exceed $20B Annually; Anthropic Explores Custom Silicon |
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