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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 06.11. | [Insights] Early November Panel Prices: TV Panels Dip as Makers Adopt More Flexible Pricing Strategies | ||
| 06.11. | [Sponsor Content] iDEAL Semiconductor Expands SuperQ Platform with Industry-Leading 150 V MOSFETs Delivering Record-Low Resistance | ||
| 06.11. | Lenovo Unveils MicroLED AI Glasses V1, Reportedly Among the Lightest but Misses Camera | ||
| 05.11. | [Insights] Memory Spot Price Update: DRAM Buyers Rush In as DDR5 Spot Prices Jump 30% Amid Tight Supply | ||
| 05.11. | Intel Israel Reportedly Revamps Pay Structure, Boosting Monthly Salaries by 10% | ||
| 05.11. | Musk Signals Tesla AI5 Mass Production Delay to 2027, Casting Uncertainty Over Samsung | ||
| 05.11. | TSMC Affiliate VIS Sees 4-6% Q4 Wafer ASP Rise as Aggressive Price Cutting Fades | ||
| 05.11. | AMD Forecasts Strong Q4 After Record Q3 Sales, Flags China and 2026 AI Chip Ramp-up | ||
| 05.11. | China's Big Fund Phase III Invested in Lithographic Material Related Company | ||
| 05.11. | TSMC's Possible Weak Spot? Industry Commentator Sees Chances for Japan's Rapidus | ||
| 04.11. | Nexperia Reportedly Expanding in Southeast Asia; Wingtech Sister Firm Said to Supply China Plant | ||
| 04.11. | Huawei Unveils Enterprise Storage Refresh: A Series Dorado Slashes HBM Dependency via UCM | ||
| 04.11. | SK hynix Unveils 2029-2031 Roadmap Featuring HBM5, GDDR7-Next, and 400+ Layer NAND | ||
| 04.11. | Samsung Reportedly to Deliver HBM4 Samples to NVIDIA This Month, Eyes Early-2026 Validation | ||
| 04.11. | Chinese Research Team Breaks Through Bottleneck in Power Semiconductor Packaging Materials | ||
| 04.11. | Chinese Chip Tool Maker AMEC Thin-Film Revenue Soars Nearly 1,300% YoY - What's Behind It? | ||
| 03.11. | SK hynix Unveils Next-Gen Memory Roadmap: Custom HBM, AI-DRAM, AI-NAND with Tech Giants | ||
| 03.11. | Nexperia China Says Supply Stable Through Year-End, Alleges ¥1B Debt by Dutch Arm | ||
| 03.11. | DRAM Quotes Reportedly Shift to Monthly as Samsung Largely Halts Contracts | ||
| 03.11. | CSPs' ASIC Push Sparks Competition Among IC Designers, Margins Under Pressure | ||
| 03.11. | TSMC Reportedly Flags 3-5% Price Hikes for Sub-5nm in 2026, Ripple Effects on Mature Nodes Expected | ||
| 03.11. | China Makes Breakthrough in Chip Technology, Paving the Way for Lithography Advancements | ||
| 03.11. | [Insights] Xiaomi Leaps to 17 to Mirror iPhone: Decoding China's Benchmarking Strategy | ||
| 31.10. | Chip Packaging Giant ASE Reportedly to Boost 2025 CapEx by US$1B Amid Strong AI and HPC Demand | ||
| 31.10. | Samsung in Talks to Supply HBM4 to NVIDIA for 50K-GPU AI Mega Fab; HBM3e/GDDR7/SOCAMM2 Also Included |
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