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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 21.09. | Apple Reportedly Cuts More Jobs Following 200+ August Layoffs, With Fitness+ Affected | ||
| 21.09. | China's MLCC Market Splits: AI-Grade Orders Reportedly Stretch Into 2Q27 While Consumer Spot Prices Slide | ||
| 21.09. | TSMC Plans Mini-Loop at Kaohsiung to Speed CoWoS Tool Validation; Reportedly Eyes AUO Site for CoPoS | ||
| 21.09. | CXMT G5 DRAM Enters Mass Production with 50%+ Higher Dies Per Wafer; SAQP Enables 11.95nm Half-Pitch | ||
| 21.09. | Chinese Researchers Achieve Breakthrough in Superconducting Quantum Computer Architecture | ||
| 21.09. | Tesla Reportedly Audits China Suppliers for Optimus Gen 3 Ramp, Eyes $20,000 Price Target | ||
| 18.09. | China's DRAM Leader CXMT Reportedly Plans NAND R&D Line, Could Challenge Samsung, SK hynix and YMTC | ||
| 18.09. | Chinese Researchers Reportedly Push GAA With DUV, Opening Potential Path to 3nm-Level Performance | ||
| 18.09. | AMD Reportedly Plans 10% Price Hike for GPUs, AI Chips, Chipsets in 4Q26 as TSMC Costs Rise | ||
| 18.09. | OpenAI, Intel Reportedly Downplay CXL as HBM Replacement, Citing Use-Case and Data-Transfer Limits | ||
| 18.09. | Apple Gets Serious About Cooling: iPhone 18 Pro Rethinks A20 Pro Packaging, Triples Vapor Chamber Size | ||
| 18.09. | Chip Equipment Component Lead Times Reportedly Double, Stretching to 40 Months as Price Pressures Mount | ||
| 17.09. | NVIDIA CEO Jensen Huang Reportedly Says China Could Develop Advanced Lithography Systems by 2030 | ||
| 17.09. | Huawei Speeds Up AI Chip Roadmap, Reportedly Pulls Ascend 960DT Forward Three Quarters to 1Q27 | ||
| 17.09. | Apple Reportedly Eyes 2029 Enterprise Server Return With M8 Ultra, NVIDIA NVLink | ||
| 17.09. | Winbond's $1.12B Infineon NOR Flash Deal Could Lift Global Share Above 30%, Widening Its Lead | ||
| 17.09. | Ex-HiSilicon Chip Chief's Startup Reportedly Raises $100M, Targets Ultra-Large AI Models on a Single Chip | ||
| 17.09. | [Breaking] SMIC Eyes Backside Power for N7/N5 as AMEC ALD Tool Reportedly Clears Validation | ||
| 16.09. | Meta Targets 1H27 Deployment for New TSMC-Made AI Chip, Claims Efficiency Edge Over NVIDIA | ||
| 16.09. | [Insights] Memory Spot Price Update: DRAM Spot Cools as DDR5 Inquiries Slow, 2Gx8 DDR4 Prices Retreat | ||
| 16.09. | SK hynix Reportedly Explores Leasing Intel's Ohio Fab, Could Produce Memory in U.S. for First Time | ||
| 16.09. | Samsung Reportedly Shifts Cheonan Capacity to HBM Packaging, Outsource Conventional Memory Modules | ||
| 16.09. | Intel CEO Flags AI Supply Squeeze: Memory Prices Up 5-7x, Its CPUs Meet Just 50% of Demand | ||
| 16.09. | Samsung Electro-Mechanics, Qualcomm Reportedly Develop Organic Bridge Packaging, Target Intel EMIB Alternative | ||
| 16.09. | Hanmi Semiconductor Reportedly Receives Terafab Packaging Tool Order, Eyes HBM TC Bonder Supply |
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