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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 27.03. | Memory Giants' China Investments Soar in 2025: Samsung Xi'an Up 67.5%, SK Hynix Wuxi & Dalian Hit Trillion-Won | ||
| 26.03. | Naura Reportedly Unveils Hybrid Bonding Tool at SEMICON China; SiCarrier, Last Year's Lithography Standout, Misses Show | ||
| 26.03. | Decoding Google's TurboQuant: 6x KV Cache Cut-Headwind for Memory Players? | ||
| 26.03. | STMicroelectronics Reportedly to Raise Prices from Apr. 26; Intel, AMD Said to Plan CPU Hikes of 10-15% | ||
| 26.03. | [Sponsored Content] Building Dedicated AI Factories: Confronting the "Power = Compute = National Power" Challenge | ||
| 26.03. | NAND Leaders Bet on Taiwan's DRAM Maker: Why Kioxia, SanDisk, SK hynix Back Nanya Tech's $2.5B Deal? | ||
| 26.03. | NexChip, Silan and Hua Hong Step Up Efforts in Advancing Mature-Node Foundry | ||
| 26.03. | From EUV to Backside Cooling: How Middle East Tensions Could Squeeze Bulk Gas Supply for Chipmaking | ||
| 25.03. | Alibaba Unveils RISC-V XuanTie C950 CPU for AI Agents, 5nm Chip Reportedly Made by TSMC | ||
| 25.03. | SK hynix Aims to Secure W100T+ in Net Cash to Support Long-Term Investment; ADR Eyed for 2H26 | ||
| 25.03. | [Insights] Memory Spot Price Update: DRAM Spot Momentum Constrained as March Contracts Hold, DDR4 Weakest | ||
| 25.03. | Arm Unveils First AGI CPU on TSMC 3nm; Meta Among Customers, Promising Up to 2× Performance vs. x86 | ||
| 25.03. | Chip Giants Tighten Taiwan Links as Intel CEO Tan Headlines COMPUTEX, Qualcomm Elevates Taiwan | ||
| 25.03. | China's Leading Robotics Firm Unitree Reportedly Files for IPO; Seeks to Raise ~4.2B Yuan | ||
| 25.03. | Samsung Reportedly to Build a New Wafer Fab in the U.S. | ||
| 24.03. | Broadcom Reportedly Flags TSMC Capacity as 2026 Bottleneck, With Lasers and PCBs Also in the Squeeze | ||
| 24.03. | TSMC Reportedly Eyes 2H27 3nm Mass Production at Arizona Fab 2; Four U.S. Fabs Said to Be Fully Booked | ||
| 24.03. | SK hynix Commits $8B to ASML EUV Equipment by 2027 in Push for AI Memory Dominance | ||
| 24.03. | Tesla Reportedly Ramps TeraFab Hiring in Taiwan; TSMC Talent Seen as Primary Target | ||
| 24.03. | ASUS Reportedly Warns PC Prices Could Jump 25-30% in 2Q, Rising Further in 3Q Amid CPU, Memory Costs | ||
| 24.03. | India's Chip Output Set to Reach 75-80 Million Units per Day, Marking a New Milestone | ||
| 24.03. | South Korea Reportedly Tackles 3D NAND Bottleneck with New Material, Achieving Up to 23× Faster Erase Speed | ||
| 23.03. | STMicroelectronics Launches Locally Made STM32 MCUs in China via Huahong Partnership | ||
| 23.03. | Micron Reportedly Expects Future Autonomous Cars to Require 300GB+ DRAM, Cautious on HBF Outlook | ||
| 23.03. | Under Qatar's Shadow: Helium Crunch Hits South Korea Harder, Putting Samsung, SK hynix, TSMC in Spotlight |
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