| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 10.03. | Chinese Smartphone Price Hikes Begin; OPPO Adjusts From Mar. 16, Reportedly Up to ¥500 | ||
| 10.03. | Samsung Groq Orders May Jump ~70% to 15K Wafers; Tesla Reportedly Delays Other Foundry Clients | ||
| 10.03. | Nexperia China Reportedly Launches 12-inch Chip Production, Defying Dutch Parent | ||
| 10.03. | SK hynix Develops 1c LPDDR6 DRAM with 33% Speed Gain, 20% Power Savings; Ships in 2H26 | ||
| 10.03. | ROHM Secures GaN Technology License from TSMC, to Build Production Line by 2027 | ||
| 10.03. | Beyond HBM: Samsung, SK hynix Reportedly Explore Next-Gen AI Memory That Could Challenge NVIDIA | ||
| 09.03. | Texas Instruments Reportedly Set to Raise Prices Again from April 1, Hikes Could Reach 85% | ||
| 09.03. | Apple Reportedly Boosts iPhone Fold Inventory Build 20% Amid Strong Confidence, Lifting Foxconn, TSMC | ||
| 09.03. | NAND Giant YMTC Reportedly Debuts First Commercial PCIe 5.0 SSD Using In-house Xtacking Flash | ||
| 09.03. | Middle East Energy Turmoil Raises Chip Risks, Spotlight on TSMC Power Use and Bromine for DRAM | ||
| 09.03. | Samsung, SK hynix Reportedly Tapped as NVIDIA Rubin HBM4 Suppliers; Shipments Could Start in March | ||
| 09.03. | Beyond Computing Power: AI Hardware Selection as a New Enterprise Challenge | ||
| 09.03. | China GPU Race Intensifies: Cambricon Turns Profitable in 2025; Moore Threads, MetaX Narrow Losses | ||
| 09.03. | Samhwa Paint Enters Semiconductor Materials with Melt Master Batch in Samsung AP Packaging | ||
| 06.03. | "China's ASML" by 2030? SMIC, Naura and Other Chip Leaders Call for National Effort | ||
| 06.03. | Industry Weigh 825-900 µm HBM Thickness for 20-High Stacks, Potentially Slowing Hybrid Bonding | ||
| 06.03. | [Insights] Early March Panel Prices: TV Strength Continues; MNT Turns Up While NB Weakness Moderates | ||
| 06.03. | Apple Reportedly Uses A18 Pro with 8GB RAM in MacBook Neo Amid TSMC Supply Constraints | ||
| 06.03. | U.S. Reportedly Mulls Tiered AI Chip Export Rules, 200K+ Units Need Investment, Official Assurances | ||
| 06.03. | Tiny "Mouse Bites" in Transistors Mapped by Cornell, ASM & TSMC Using Electron Microscopy | ||
| 06.03. | Nanya Tech Reportedly Starts Custom AI Memory Trial, Progress Set to Show in H2 2026 | ||
| 05.03. | NVIDIA Reportedly Halts H200 Production Amid China Sales Uncertainty, Shifts TSMC Capacity to Vera Rubin | ||
| 05.03. | U.S. Plans to Ban Select Chinese Chips in Federal Procurement from Dec. 2027, Lifting Korean Chipmakers | ||
| 05.03. | Intel Reportedly Reconsiders 18A for External Use, Hinting EMIB Could Generate Billions by 2H26 | ||
| 05.03. | Broadcom Reportedly Eyes $100B AI Chip Revenue in 2027, Backed by 6 Key Clients Like Google |