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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 07.05. | [New] Chinese Researchers Made New Progresses in Wafer-Scale Transfer & Integration of Single-Crystal 2D Semiconductors | ||
| 07.05. | Moore Threads, MetaX Reportedly Top NVIDIA in R&D Ratios as China A-Share Chip R&D Hits Record ¥107B in 2025 | ||
| 06.05. | TSMC Affiliate VIS Reportedly Weighs Second 12-Inch Fab Amid Tight Capacity, Silicon Interposer Push | ||
| 06.05. | [Insights] Memory Spot Price Update: Buying Interest Stays Focused on DDR5 as Mainstream DDR4 Edges Down 0.25% | ||
| 06.05. | JEDEC Nears 2nd-Gen MRDIMM as CPUs Demand More Bandwidth; Samsung, SK hynix Reportedly Accelerate Push | ||
| 06.05. | TSMC Reportedly Upgrades Central Taiwan 28/22nm Fab to 4nm; Phase 2 1.4nm Trial Production May Start 3Q27 | ||
| 06.05. | AMD Lifts Server CPU Outlook to 35%+ CAGR, $120B by 2030; Warns on Memory-Driven PC, Gaming Weakness | ||
| 06.05. | CCL Market Tightens as Korea Import Prices Reportedly Rise 74.5% YoY; Suppliers Expand on AI Demand | ||
| 06.05. | Google TPU Push Reportedly Meets Cautious Early Adoption from AI Infrastructure Providers | ||
| 05.05. | JSR Reportedly Plans First Taiwan Production Plant to Supply Advanced EUV Photoresists to TSMC | ||
| 05.05. | Intel Reportedly Scales EMIB Expansion in U.S., Vietnam, with Taiwanese Tool Orders Set for 2H26 Delivery | ||
| 05.05. | Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification | ||
| 05.05. | Memory Makers Reportedly Tap Substrate Suppliers for DDR6 Prototypes; Commercialization May Start 2028-29 | ||
| 05.05. | SanDisk Long-Term Deals Gain Scale: Over One-Third of FY27 Bits Reportedly Locked, 50% in Sight; HBF Advances | ||
| 05.05. | Applied Materials to Acquire ASMPT NEXX for $120M, Expanding Panel-Level Advanced Packaging Portfolio | ||
| 05.05. | ASE, Powertech, KYEC CapEx May Hit NT$370B This Year as AI Drives Record OSAT Investment | ||
| 04.05. | Micron Says AI Still in Early Stage as Memory Demand Reportedly Seen Exceeding 50% of Total Market This Year | ||
| 04.05. | Kioxia, SanDisk to Demonstrate QLC NAND Using Multi-Stacked Cell Architecture, Targeting 1,000+ Layers | ||
| 04.05. | Samsung, SK hynix Deepen LTAs as Buyers Pay Premiums to Secure Supply, May Drive Memory Prices Higher | ||
| 04.05. | Intel's EMIB Reportedly Gains Traction at Google, Meta; Yields Said to Reach ~90% Milestone | ||
| 04.05. | China Unveils First GaN Magnetic Encoder Chip for Humanoid Robot Joints | ||
| 04.05. | Japan's Toilet Maker TOTO Reportedly Sees Ceramics Margins Exceed 40% as It Rides NAND and AI Chip Demand | ||
| 01.05. | Samsung Foundry Reportedly Wins Optical Module Order, Steps Up Silicon Photonics and CPO Drive | ||
| 01.05. | Behind TSMC's High-NA EUV Deferral: Low-NA Stays Strong, Customer Landscape Shifts, and ASML Quietly Pivots | ||
| 30.04. | MediaTek Reportedly Doubles 2026 AI ASIC Revenue Target to $2B, Aims 10-15% Market Share |
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