- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 28.01. | China's Cmsemicon Lifts MCU, NOR Flash Prices by 15-50%; Goke Eyes Hikes of Up to 80% | ||
| 28.01. | SK hynix Reportedly to Supply About Two-Thirds of NVIDIA HBM4; Samsung Targets Early Delivery | ||
| 28.01. | Seagate Q3 Guidance Tops Estimates, Nearline HDD Capacity Fully Booked Through 2026 | ||
| 28.01. | ASMPT Reportedly Considers Divesting SMT Unit to Double Down on Advanced Packaging | ||
| 28.01. | China's Illuvatar CoreX Unveils Bold GPU Roadmap, Reportedly Eyeing NVIDIA's Rubin by 2027 | ||
| 27.01. | Samsung May Raise iPhone LPDDR Prices by Over 80% QoQ; SK hynix Reportedly Near-100% Increase | ||
| 27.01. | Microsoft Unveils Maia 200 AI Chip on TSMC 3nm; SK hynix Reportedly Sole HBM3E Supplier | ||
| 27.01. | AI Drives Mature-Node Prices: SMIC Reportedly Up 10%, Vanguard Estimated Up 4-8% From Q1 | ||
| 27.01. | Micron Launches $24 Billion NAND Expansion in Singapore, Wafer Output Slated for 2028 | ||
| 27.01. | IC Design Price Wave Looms: Power Manage ICs Reportedly Prepares Hike after Lunar New Year | ||
| 27.01. | Chinese and U.S. Researchers Jointly Achieved Breakthrough in Novel Chip Materials | ||
| 27.01. | Is VR Cooling Off? Meta Reportedly Scales Back Efforts With Layoffs as AI and Wearables Take Priority | ||
| 26.01. | China's Etching Tool Giant AMEC Flags Up to 35% Profit Growth in 2025 as Thin-Film Sales Soar | ||
| 26.01. | NVIDIA Reportedly Plans Arm-Based SoCs, with Lenovo and Dell Among Early Adopters | ||
| 26.01. | Samsung Reportedly Set to Begin Official HBM4 Shipments to NVIDIA and AMD in February | ||
| 26.01. | Samsung Readies New Price Hikes: Consumer DRAM, SSD Reportedly Doubled, NAND Set for 50%+ Rise | ||
| 26.01. | Intel Reportedly Presents First Thick-Core Glass Substrate with EMIB, Targeting AI Data Centers | ||
| 26.01. | Chinese AI Models Reportedly Hit ~15% Global Share in Nov. 2025, Fueled by DeepSeek Open-Source Push | ||
| 23.01. | Alibaba Chip Unit T-Head Reportedly Eyes Spinoff & IPO; AI Chip Said Comparable to NVIDIA H20 | ||
| 23.01. | Samsung's Custom HBM4E Design Reportedly Aimed for Mid-2026, Parallels SK hynix and Micron | ||
| 23.01. | Intel May License Super MIM to UMC, Boosting AI and Advanced Packaging Capability | ||
| 23.01. | Supply Constraints Hit Intel Q1 Forecast; 14A Customer Demand Expected 2H26-1H27 | ||
| 23.01. | Cmsemicon Makes a Foray into NOR Flash Market, New Product Coming | ||
| 23.01. | Chip Tool Giants Accelerate Advanced Packaging Push, Led by ASML, Tokyo Electron, and Others | ||
| 22.01. | Samsung & SK hynix Earnings Showdown on 1/29: Profit, CAPEX, HBM4 in Focus |
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