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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 08.07. | Memory Rally Extends as ADATA Reportedly Sees Q3 DRAM Prices Up 20-30%, NAND Up 35-40% | ||
| 08.07. | TSMC PIC Capacity Seen Surging to 25K Wafers/Month by 2028; NVIDIA, Broadcom Eyed as Early COUPE Customers | ||
| 08.07. | [Insights] Memory Spot Price Update: DRAM Spot Trading Remains Subdued, with DDR3 and 4Gb DDR4 Edging Higher | ||
| 08.07. | China AI Model Developers Ramp Up In-house Chips: DeepSeek, Zhipu Explore Custom Silicon | ||
| 08.07. | 15 New Integrated Circuit-Related Companies Established in China | ||
| 08.07. | New DRAM Price-Fixing Case Against Samsung, SK hynix, and Micron Tests Whether HBM Expansion Can Prove Collusion | ||
| 07.07. | [Insights] Early July Panel Prices: TV Prices Decline, MNT and NB Prices Stay Flat | ||
| 07.07. | Chinese Firms Reportedly Raise Domestic AI Chip Budget Share from 30% to 46% Amid Shift from NVIDIA | ||
| 07.07. | PC Brands Expand Chinese Memory Adoption Amid Rising Costs; Asus, MSI, and Acer Reportedly Join Trend | ||
| 07.07. | Intel Reportedly Raises CPU Prices; Flagship Xeon Up US$1,495, Select Desktop Chips +US$30-50 | ||
| 07.07. | Samsung's 2Q Operating Profit Soars 1,810% to Record KRW 89.4T, Reportedly Surpassing NVIDIA and Apple | ||
| 07.07. | Chinese Team Achieved Major Breakthrough in Carbon Nanotube CFET Architecture | ||
| 07.07. | Samsung, SK hynix Reportedly Reconsider Hybrid Bonding Timeline; 16-High HBM4E May Be Earliest Adoption | ||
| 06.07. | Huawei Expands Tau Scaling Law V2 Paper, Highlighting LogicFolding Path to Ascend AI Chips in 2030 | ||
| 06.07. | Samsung, SK hynix Reportedly Look Beyond Chinese Tool and Component Suppliers Amid Supply Chain Risks | ||
| 06.07. | Intel Reportedly Weighs Dual-Side Power Delivery for 14A2 to Boost Chip Density in Race With TSMC, Samsung | ||
| 06.07. | Micron Breaks Ground on Hiroshima Fab Expansion, Scaling 1? DRAM and HBM Output as Equipment Set for 2H28 | ||
| 06.07. | China Breaks Into Panel-level Packaging: CFMEE's 510×515mm PLP System Passes Validation | ||
| 06.07. | Samsung Electro-Mechanics Reportedly to Form Glass Core JV with Sumitomo Unit, Targeting 2H27 Production | ||
| 03.07. | Samsung Reportedly Seeks Up to 20% 3Q26 DRAM Price Increase; LPDDR Hikes May Exceed 20% | ||
| 03.07. | China's Chip Material Suppliers Challenge Japanese Dominance; Guangyuan Invests US$1B in T-Glass | ||
| 03.07. | Kioxia Begins BiCS 10 NAND Sampling, Reportedly Targets 2027 Mass Production at Kitakami Fab | ||
| 03.07. | Anthropic Reportedly Eyes Custom AI Chip; in Talks with Samsung for 2nm Foundry and Advanced Packaging | ||
| 03.07. | Intel Raises Arrow Lake Refresh Core Ultra 200S Plus Prices by $30-$50 Shortly After Launch | ||
| 03.07. | Musk Shares Tesla Optimus Production Team Photo, Says Initial Robot Output Will Be "Extremely Slow" |
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