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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 28.05. | UMC Reportedly to Raise Prices Selectively in 2H26, with Broader and Potentially Larger Increases in 2027 | ||
| 27.05. | Infineon Announces Second 2026 Price Hike Effective July 1 Amid Rising Supply Chain Costs, Strong Demand | ||
| 27.05. | [Insights] Memory Spot Price Update: DDR5 Spot Price Gains Narrow Amid Sluggish Trading; DDR4 Rebounds | ||
| 27.05. | TSMC Reportedly Eyes Up to 15% 3nm Price Hike in 2H26, Further 5%-10% Seen in 2027 Amid AI, ASIC Demand | ||
| 27.05. | Inside Micron's $1 Trillion Market Cap Leap: A Global Fab Expansion Overview Across the U.S. and Asia | ||
| 27.05. | China Reportedly Tightens Overseas Travel Rules for AI Talent at Private Firms Like Alibaba and DeepSeek | ||
| 27.05. | Chinese Equipment Maker Achieves Breakthrough in SiC Laser Lift-Off Technology | ||
| 27.05. | China's Chip Push Extends Beyond State Efforts, From Xiaomi's 3nm SoC to NIO Autonomous Driving Chips | ||
| 26.05. | China's Unitree Robotics Reportedly Posts 52% YoY Q1 Profit Slump Ahead of 4.2 Billion Yuan IPO Review | ||
| 26.05. | Rapidus Reportedly Taps Lam Research Panel-Level Packaging System for 600mm Square Glass Interposer Push | ||
| 26.05. | Alchip Says Key Customer's AI Chip Enters Mass Production in May; ASICs Seen Outpacing GPU CAGR | ||
| 26.05. | Intel Reportedly Eyes World's First Glass Substrate Output at Rio Rancho; Offers Silicon Photonics to Customers | ||
| 26.05. | SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction | ||
| 26.05. | Japan's Adhesive Tape Firm Lintec Targets EUV Pellicles, Reportedly Plans ¥7B Investment and 2026 Production | ||
| 26.05. | Huawei Unveils New Semiconductor Principle - Tau (t) Scaling Law | ||
| 25.05. | Samsung Reportedly Begins V9 NAND Cleanroom Build-Out in Xi'an Following V8 Ramp-Up and V6 Phase-Out | ||
| 25.05. | Intel Roadmap Leak Hints at NVIDIA GPUs in 2028 Titan Lake-B/BX; Hammer Lake May Revive Hyperthreading | ||
| 25.05. | South Korea-Netherlands Chip Ties May Go Beyond ASML; Silicon Photonics Seen as a Key Opportunity | ||
| 25.05. | AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech's FOPLP Packaging Said to Be Under Evaluation | ||
| 25.05. | Industry Reportedly Eyes Separating HBM From GPUs to Expand Memory Capacity; Optical Links May Be Key | ||
| 25.05. | [Insights] As COMPUTEX Nears, Has x86 Already Won the PC Battle Against Arm? | ||
| 22.05. | Micron Turns More Upbeat on Outlook, Reportedly Sets 2027 HBM4E Ramp with TSMC for Standard and Custom Logic Dies | ||
| 22.05. | Huawei Reportedly Builds 122TB SSDs With New Packaging Tech Despite Limited 100+ Layer 3D NAND Access | ||
| 22.05. | SMIC, Hua Hong Reportedly Lift Prices Amid AI-Driven Capacity Shifts; Hua Hong Expects More 12-Inch Hikes in 2026 | ||
| 22.05. | PSMC Joins Intel, SAIMEMORY to Demo 9-Layer Via-in-One Architecture for High Bandwidth 3D Memory |
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