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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 17.08. | China Rare-Earth Curbs Send Japan Dysprosium Imports Down 82% in 1H26; Chip Supply Chain Feels Squeeze | ||
| 17.08. | Germany DDR5 Prices Near 5X YoY in August; China Reportedly Sees 14% WoW Jump as Global Rally Continues | ||
| 17.08. | TSMC Arizona Profit Soars 663% YoY in 1H26; U.S. Earnings Pull Back 8.2% QoQ in 2Q as Depreciation Bites | ||
| 17.08. | Vertilite to Build InP Laser Chip Base in China's Changzhou with RMB 5 Billion | ||
| 17.08. | China's Top Two Foundries Hit Capacity Crunch: What's Next for SMIC and Hua Hong's Expansion Plans? | ||
| 14.08. | Samsung May Repurpose R&D Line for Foundry, Targeting 2nm HBM Base Dies for Future NVIDIA Demand | ||
| 14.08. | Nanya Tech Reportedly Eyes Yunlin, Pingtung Fabs for 1d DRAM, Custom Memory, Investment to Top NT$300B | ||
| 14.08. | SMIC 2Q26 Gross Margin Hits 25.3%, Eyes 26%-28% in 3Q as AI Spillover, Pricing Momentum Build | ||
| 14.08. | Sandisk Reportedly Tapes Out First HBF Product, Targets 2027 Samples and 2028 Production | ||
| 14.08. | ZJ InnoLight Subsidiary Takes Stake in PCB Giant Avary Holding | ||
| 14.08. | YMTC Reportedly Invests in SOI Micro, Backing an Alternative Chipmaking Approach Without EUV | ||
| 14.08. | Applied Materials Lifts 2026 Packaging Growth Above 70%; DRAM Set to Accelerate, China Remains Key Market | ||
| 13.08. | ADI Reportedly Set to Raise Prices Again on September, With Military Chips Facing Up to 30% Hike | ||
| 13.08. | AI Agents Enter Chipmaking: SK hynix Tests Back-End Deployment; Samsung Cuts SoC Verification to 2 Days | ||
| 13.08. | Samsung, SK hynix's HBM4 Push Puts HBM, General Memory Pricing in the Spotlight for 2H Earnings | ||
| 13.08. | Intel Reportedly Hints at Memory Reentry, Eyes CPU-Memory Stacking as XBM Patent Emerges | ||
| 13.08. | GaN Patent Battle Heats Up: Navitas Sues Renesas After Trade-Secret Claims | ||
| 13.08. | Huawei Reportedly Readies Mate 90, XT2 for September with Tau Scaling-Based Chips, Claiming 3nm-Level Performance | ||
| 12.08. | Micron Flags HBM4E as Start of Custom HBM Era; HBM Market Could Tilt Toward Dual-or-Single Suppliers | ||
| 12.08. | SK hynix Reportedly Restarts Dalian Fab 2, Targets 1H27 Mass Production and 50% China NAND Capacity Boost | ||
| 12.08. | [Insights] Memory Spot Price Update: DRAM Spot Trading Stays Subdued as Pricing Gap Persists; DDR4 Up 0.93% | ||
| 12.08. | ASE's SPIL Breaks Ground on Nearly TWD 100B Plant in Douliu to Boost CoWoS Capacity, Operations Set for 2028 | ||
| 12.08. | Micron Meets Less Than Half of Data Center Demand as Customers Rush to Secure Memory at "Very High" Prices | ||
| 12.08. | China's 12-Inch Silicon Wafers Hit the Accelerator with Billions in New Capacity Investments | ||
| 12.08. | Musk Signals Interest in FEL-EUV for Terafab, Potentially Cutting Power vs. ASML's Current Light Source |
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