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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 04.09. | China's Chip Industry Surges in 1H25 - 38 A-Share Listed Firms Reportedly Post Growth | ||
| 04.09. | First Intel 18A-Based Panther Lake Laptop Unveiled: Acer Leads with 16-Inch Ultralight Model | ||
| 03.09. | Intel Loses Silicon Photonics Lead to TSMC as Patent Filings Reportedly Plummet Since 2023 | ||
| 03.09. | Alibaba's Ant Group, ByteDance Back InnoStar, Boosting China's Memory Chip Drive | ||
| 03.09. | [Insights] Memory Spot Price Update: DDR4 Prices Outpace DDR5 as Memory Giants' EOL Impact Lingers | ||
| 03.09. | SK Hynix Leads the Pack to Introduce ASML's High-NA EUV System for Memory Production | ||
| 03.09. | US to End TSMC Nanjing Waiver by End-2025: Decoding the Impact on the Foundry and Supply Chain | ||
| 03.09. | San'an Announced 8-inch SiC Chip Production Line Commissioning Completed | ||
| 03.09. | Nikon Reportedly Aims Doubled Wafer Alignment Sales by FY27 as 3D Stacking, Wafer Bonding Rise | ||
| 02.09. | Samsung Reportedly Plans Big September Reveal: Tri-Fold Phone, XR Headset, AI Smart Glasses | ||
| 02.09. | Applied Materials Reportedly Flags Minimal Effect of U.S. Incentives, Offers Nuanced View on China | ||
| 02.09. | TSMC Partners with Technical University of Munich to Establish AI Chip R&D Center in Bavaria | ||
| 02.09. | Alibaba Reportedly Unveils AI Chip Rivaling NVIDIA's H20, Boosting Taiwan's Server ODM Inventec | ||
| 02.09. | Samsung, SK hynix Reportedly Delay Phase-out to 2026 as DDR4 Becomes Unexpected Cash Cow | ||
| 02.09. | Ennostar Expands into Robotics, Unveils Mini/Micro LED Human-Machine Interface Displays | ||
| 02.09. | Memory Giant, Fragile Link: Korea's Reliance on Japan in HBM Supply Chain | ||
| 01.09. | NVIDIA's Jensen Huang to Join APEC in Oct., Raising Hopes for US-Korea Chip Push | ||
| 01.09. | Samsung Reportedly Restarts Taylor Equipment Orders, Appoints New Head to Lead Operations | ||
| 01.09. | Huawei's R&D Hits Record 22.7% of 1H25 Sales, Dragging Profits Amid Chip Drive | ||
| 01.09. | Rapidus 2HP Reportedly Surpasses Intel 18A Logic Density Impacted by BSPDN, Rivals TSMC | ||
| 01.09. | U.S. Revokes China Chipmaking Tool Licenses for Samsung, SK hynix: Decoding Market Impact | ||
| 01.09. | UltraRAM Reportedly Nears Commercialization: DRAM Speed, NAND Durability, 1K-Year Data Life | ||
| 01.09. | HBM Evolution Outpaces JEDEC Standards as Generation Cycles Reportedly Shrink to 2.5 Years | ||
| 29.08. | Memory Giants Diverge on HBM Base Die: Micron Reportedly Delays Foundry Shift, Risks Losing Edge | ||
| 29.08. | NVIDIA's Top 2 Customers Jump to 39% of Sales from 25% Last Year, Raising Client Dependence Concerns |
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