- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 29.07. | 7.1 Kumamoto Earthquake: TSMC Confirms JASM Safe; TEL Halts Plants as Chip Supply Chain Assesses Impact | ||
| 29.07. | SK hynix Posts Record 2Q Results but Misses Estimates Reportedly Due to Conservative Pricing; Completes 10 LTAs | ||
| 29.07. | Chinese Advanced Packaging Firms Kicks-Start a New Round of Capacity Expansion | ||
| 29.07. | China's Semiconductor Sector Attracts Billions in Industrial Investment Funds | ||
| 28.07. | China's Lens, BOE Advance Glass Substrates as Taiwan's Supply Chain Prepares for TSMC's CoPoS | ||
| 28.07. | NVIDIA Reportedly Halves Vera Rubin SOCAMM Capacity as Memory Costs Near 29% of System BOM | ||
| 28.07. | China Reportedly Mass-Produces Immersion DUV Tools; SMIC, Hua Hong, CXMT Deliveries Expected This Year | ||
| 28.07. | Shenzhen Adds Two RMB 10-Billion Semiconductor Projects Targeting AI Servers and 12-Inch Wafers | ||
| 28.07. | Samsung Display Revives Asan OLED Expansion Plan with KRW 67 Trillion | ||
| 27.07. | Q2 Memory Earnings Preview: What to Watch From Samsung, SK hynix, and Kioxia | ||
| 27.07. | CXMT's 471% STAR Debut Makes It China's Top Listed Firm, Reshaping Global Memory Dynamics | ||
| 27.07. | TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom | ||
| 27.07. | Intel 18A Gains External Adopter Hitachi for Silicon Quantum Chip Project; 1,000-Qubit System Targeted for FY2030 | ||
| 27.07. | Intel's CPU Momentum Builds: 10 Long-Term Deals Reportedly Lock In Demand; Intel 3 Capacity Tightens | ||
| 24.07. | China's DRAM Maker CXMT to Debut Jul. 27; IPO to Raise RMB 57.9B, Largest on STAR Market Since Launch | ||
| 24.07. | SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI | ||
| 24.07. | AMD Unveils Next-Gen CPU Roadmap: Florence Targets 2028 with Rumored Sub-2nm Node, Ravenna in 2030 | ||
| 24.07. | AMD Unveils MI455X Targeting Nvidia Rubin; TSMC 2nm, CoWoS-L Demand Seen Rising | ||
| 24.07. | Intel Pulls Forward 14A Timeline by One Year, Targeting 2028 Mass Production Near TSMC's Roadmap | ||
| 24.07. | HKC Announced Investment in Advanced Semiconductor Packaging and Testing | ||
| 24.07. | SKC Reportedly Pushes Glass Substrate Mass Production to 2027, Targets Final Validation by Year-end | ||
| 23.07. | Intel, AMD Reportedly Sign Long-Term Server CPU Deals with Chinese Customers Amid Tight Supply | ||
| 23.07. | Google Raises 2026 CapEx Guidance Again Above US$200B; Free Cash Flow Turns Negative for First Time | ||
| 23.07. | Musk Says Micron Is "Making Room" for Tesla in the Years to Come, Hinting at Long-Term Memory Supply | ||
| 23.07. | Samsung Unveils Galaxy Z Fold8 Lineup; Flagships Feature TSMC 3nm Chips, Price Hikes Reach US$100 |
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