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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 14.10. | ASML Warns of 2027-28 Supply Shortfall Despite 30% Annual Capacity Hikes; Pricing Impact Starts in 2027 | ||
| 14.10. | SEMI Sees Americas Fab Tool Spending Double to US$40.6B by 2029 as TSMC, Intel, Micron, Samsung Expand | ||
| 14.10. | Musk Weighs In on Memory: Praises Micron's Future Pricing, Slams "Extortionate" Practices | ||
| 14.10. | CanSemi Debuts on ChiNext, Raising CNY 7.5 Billion to Expand Specialty Processes and Silicon Photonics | ||
| 14.10. | Musk Says China Is Rapidly Advancing in LPDDR5/LPDDR6, Highlights Its Mass Production Capabilities | ||
| 13.10. | [OCP in Focus] SK hynix Drives up to 5x Faster Time-to-First-Token with MARS; HBF Expands Capacity by 14x | ||
| 13.10. | Samsung Showcases CXL Memory Expansion With AMD at OCP 2026, Expands AI Memory Push Beyond HBM | ||
| 13.10. | [OCP in Focus] Lisa Su Calls 2026 "Year of Inference" as AMD Lifts 2030 CPU TAM Forecast to $200B+ | ||
| 13.10. | NVIDIA, Cisco Target 4× Bandwidth Density With 400G USFP Optical Module; Taiwan Suppliers Eye Gains | ||
| 13.10. | AI Chip Memory Strategies Diverge: Microsoft's Maia 300 Fuels HBM4 Demand as Intel Bets on LPDDR5X | ||
| 13.10. | Vital Technology Group's Photonics Chip Base Begins Operation in Wuhan | ||
| 13.10. | Samsung Reportedly Expands zNAND Lineup With zNAND-T and zNAND-I for AI Data Centers and Inference | ||
| 12.10. | Nanya's 3Q DRAM ASPs Surge Over 60% QoQ as Gross Margin Hits 85.7%; Further Gains Seen in 4Q | ||
| 12.10. | TSMC's $2B Silicon Interposer Deal with GF Could Fast-Track U.S. Packaging to 1H28, Free Up Fab Capacity | ||
| 12.10. | CPU Price Hike Wave: Intel Reportedly Up to 20%, Qualcomm 10%, AMD May Join as TSMC Costs Climb | ||
| 12.10. | ASML Reportedly Plans 10% Parts Price Hike in South Korea Starting Jan. 2027; Equipment Prices May Also Rise | ||
| 12.10. | CXMT Accelerates 4F² DRAM Push, Eyes Year-End Server DDR5 RDIMM Launch | ||
| 12.10. | UNT Invests CNY 2.13 Billion in Advanced Chip Unit, Advances 12-Inch Fab Project | ||
| 12.10. | AI Interposers Grow Larger, Raising HBM4E Cooling Challenges: How Samsung, SK hynix Are Responding | ||
| 09.10. | Samsung Reportedly Plans Exynos Auto Exit, Prioritizes Mobile APs, Image Sensors for 2027 System LSI Turnaround | ||
| 09.10. | NVIDIA's NVHBM Reshapes Base Die Strategies: How Micron, Samsung Are Bringing TSMC Into the Fold | ||
| 08.10. | AI Chip Spending Fuels Debt Financing Wave; Broadcom Reportedly Eyes Tens of Billions to Fund OpenAI | ||
| 08.10. | TSMC Q3 Revenue Beats Forecasts at Record NT$1.49 Trillion; Net Profit Seen Surging 64% | ||
| 08.10. | Microsoft Expands Local AI Push With NVIDIA RTX Spark; Surface Ultra Priced Up to $5,899 as Memory Costs Rise | ||
| 08.10. | Samsung Sees 3Q26 Operating Profit Soaring 783% to Record KRW 107.4 Trillion on HBM4, Memory Price Gains |
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