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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 15.06. | TSMC CoWoS Supply-Demand Gap Reportedly Seen Narrowing from 20% to 10% by End-2026 | ||
| 15.06. | NVIDIA, Google Among First 800V HVDC Adopters; Initial 3Q26 Shipments May Boost Infrastructure Suppliers | ||
| 15.06. | Samsung Electro-Mechanics Sees 18%+ Annual Silicon Capacitor Market Growth, Boosts MLCC, FC-BGA Integration | ||
| 15.06. | Infineon Found to Infringe Innoscience GaN Patent, Barred from Selling Certain Products in China | ||
| 15.06. | SK hynix Reportedly Pulls Forward HBM4E Sample Timeline, Eyeing June-July Shipments to Key Customers | ||
| 15.06. | HKC to Go Public at China's SZSE Main Board Soon | ||
| 15.06. | Apple's First Foldable iPhone Nears Fall Debut: TSMC 2nm A20 Pro, Crease-Free Display Lead Rumored Features | ||
| 12.06. | Tesla Elon Musk Discusses TeraFab at ASML Conference; Project Expected to Spur EUV Tool Orders | ||
| 12.06. | NVIDIA Reportedly Opens Vera CPU Sales to China as Early as August as H200 Shipments Stall | ||
| 12.06. | Key Semiconductor Gas WF6 Prices Reportedly Surge Over 200% as Supply Tightens Ahead of Japan Output Cuts | ||
| 12.06. | Samsung Reportedly in Talks for Google 2nm TPU I/O Die Order; 2028 Mass Production Eyed | ||
| 12.06. | Micron Taps Bechtel, Intel Ohio Fab Builder, to Speed Up New York Mega Fab Construction | ||
| 12.06. | From Rare Earth-Free Magnets to New Supply Chains: The Push to Break China's Grip Accelerates | ||
| 12.06. | The Race to 400-Layer NAND: Roadmaps and Key Technologies Driving Samsung, SK hynix, and Kioxia | ||
| 11.06. | ASE's SPIL Acquires NT$2.8B Plant Amid Spillover Demand from TSMC Advanced Packaging Capacity Crunch | ||
| 11.06. | South Korea Chip Export Volume Falls Yet Revenue Surges; May DRAM +370%, NAND +207% | ||
| 11.06. | Applied Materials Opens $500M Singapore Site, Aims to Double Global Capacity on AI Demand | ||
| 11.06. | SK hynix Advances DRAM and NAND Roadmap, Targets 3x Wafer Output by 2034, 375-Layer NAND at Year-End | ||
| 11.06. | Microsoft Reportedly Cuts Up to 400 Azure Jobs in China Amid Its 3rd Downsizing Round There in 2 Years | ||
| 11.06. | NVIDIA RTX Spark Packs 6,144 CUDA Cores; Can It Balance Performance, Battery Life, and Cost? | ||
| 10.06. | Lenovo Reportedly Set for July Price Hikes Across Product Portfolio as Memory Costs Pressure PC Market | ||
| 10.06. | China Reportedly Narrows Glass Substrate Gap with South Korea as BOE and Visionox Advance | ||
| 10.06. | [Insights] Memory Spot Price Update: DDR5 Spot Momentum Continues as DDR4 Tightness Spills Over to DDR3 | ||
| 10.06. | Samsung May Announce New Gwangju Advanced Packaging Base by End-June as Capacity Expansion Continues | ||
| 10.06. | Taiwan Reportedly Mulls Tighter AI Chip Export Rules on China Beyond Huawei, Raising Risks for Server Makers |
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