Zeit | Aktuelle Nachrichten | ||
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17.09. | SMIC Said to Test Chinese-Made DUV Lithography Tool from SiCarrier Affiliate Amid AI Chip Push | ||
17.09. | NVIDIA RTX6000D Reportedly Fails to Gain Traction in China, Stock Surplus Looms | ||
17.09. | SanDisk Reportedly Sees NAND Shortage Until 2026; Ongoing Price Opportunities Across Board | ||
17.09. | HBM Market Heats Up as Three Giants Clash, with HBM4 at the Center | ||
17.09. | Tencent Reportedly Says No Plans for In-House AI Chips, Pledges to Use Domestic Options | ||
16.09. | Samsung Reportedly Delays V9 QLC NAND to 1H26 as SK hynix Hits 321 Layers in August | ||
16.09. | Kioxia Stock Jumps 70% on NAND Shortage; SK hynix Reaps Stake Gains | ||
16.09. | TSMC 2nm Gains Steam: MediaTek Completes First 2nm Tape-Out as Apple Preps A20, M6, R2 | ||
16.09. | Intel Completes Altera Stake Sale; Trims 2025 Operating Expense Target to $16.8B | ||
16.09. | Silicon Carbide Battle Rekindled by Industry Giants: Wolfspeed, Samsung Make Waves | ||
16.09. | Microsoft Uses Micro LED to Build an Analog Optical Computer | ||
16.09. | Samsung Reportedly Set to Start Exynos 2600 Mass Production by September's End | ||
15.09. | Beijing Says NVIDIA Violated Anti-Monopoly Law, Potential Fines Up to 10% of China Sales | ||
15.09. | Western Digital Raises HDD Prices Amid Soaring Demand, Shipping Delays of Up to 10 Weeks | ||
15.09. | NVIDIA May Be Among the First to Adopt TSMC A16 for 2028 Feynman Architecture | ||
15.09. | NVIDIA Rumored to Ditch SOCAMM1 for Next-Gen SOCAMM2, Opening Door for Samsung, SK hynix | ||
15.09. | Amazon Reportedly Cutting Jobs at AWS Greater China, Up to 30% of Staff Affected | ||
15.09. | China Opens Analog Chip Dumping Probe Against TI, Broadcom and Others Over 300% Margin | ||
15.09. | Infineon Reportedly Set to Build RISC-V Auto MCUs at TSMC Dresden Fab, Mass Production in 2028 | ||
15.09. | What Comes After HBM? NAND-Stacked HBF May Power AI's Future | ||
12.09. | Micron Freezes Prices as Inference AI Fuels Surge in SSD Demand and Supply Shortages | ||
12.09. | Intel Double Hit: Xeon CPU Chief Architect Exits, Ohio Lobbyist Out as Project Stalls | ||
12.09. | HiSilicon Taps Tech Veteran Gao Ji as Chairman After Eric Xu's Exit Amid Huawei's Chip Push | ||
12.09. | SK hynix Finalizes World's First HBM4, Mass Production Ready, Eyes NVIDIA Approval | ||
12.09. | FOPLP Trial Yields Reportedly Reach 90% at Powertech as TSMC Advances CoPoS Development |