| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11.08. | Samsung Reportedly Eyes High-NA EUV for 1nm around 2030 as TSMC Also Takes a Cautious Approach | ||
| 11.08. | TSMC's 5.5-Reticle CoWoS Reportedly Tops 99% Yield; Flags Memory, ABF as AI Bottlenecks | ||
| 11.08. | Apple Reportedly Plans Glass-Heavy 2027 iPhone Pro amid Design Scrap Rumors; Samsung Adds 1M Fold 8 Units | ||
| 11.08. | SK hynix-linked BCPE Pangea Cayman2 Becomes Kioxia's Largest Shareholder; Influence Under Scrutiny | ||
| 11.08. | Microsoft Eyes Maia 300 Launch in Sep., Reportedly Seeks 300K TSMC Capacity as Google, AWS Race Ahead | ||
| 11.08. | Xiamen Sets Up China's Largest GaAs Satellite Solar Cell Production Base | ||
| 11.08. | China's AI Chip Makers Make Waves: Cambricon 1H26 Net Profit Surges 123%, Moore Threads Eyes HK Listing | ||
| 10.08. | SK hynix's Chongqing Sale Plan Signals a Global Production Reset, Not a China Exit-Or Full Ownership of Every Site | ||
| 10.08. | TSMC, Sony Reportedly Plan JPY 1 Trillion JV for Image Sensors in Kumamoto, Eye 2029 Mass Production | ||
| 10.08. | TSMC Reportedly Eyes Two AUO Fabs Worth TWD 30B+ for FOPLP and CoPoS; Longtan Could Add 1.4nm | ||
| 10.08. | Samsung's HBM4 Yield Reportedly Hits 80% as HBM Race Heats Up, SK hynix Labor Talks Add a Twist | ||
| 10.08. | Chinese Firms Double Down on High-End PCB, with Total Investment Exceeding RMB 2.7 Billion | ||
| 10.08. | Samsung Reportedly Developing In-House Humanoid Robots; Forms CEO-Led RX Robotics Division | ||
| 07.08. | China's Robot Maker Unitree Heads for IPO at RMB 60.99B Valuation, Backed by DeepSeek and Tencent | ||
| 07.08. | Memory Giants Race Ahead: SK hynix Targets 2029 Yongin Y2 Cleanroom; Samsung Advances P5, P5 Fab 2 | ||
| 07.08. | TSMC and Researchers Overcome 2D Semiconductor Bottleneck with Epitaxial Interface Engineering | ||
| 07.08. | Winbond Says Customers Seek LTAs Through 2030; Adata Expects Even Tighter DRAM Supply in 2027 | ||
| 07.08. | SK hynix's U.S. NAND Unit Solidigm Reportedly Eyes Nasdaq - But Debt and Aging Fabs Cloud the Path | ||
| 07.08. | 18 Chinese Enterprises Accelerate Positions in Glass Core Substrate Market | ||
| 07.08. | China's Big Fund Phase III Pivot: From Fab-Building to Advanced Packaging, Equipment, and AI Chips | ||
| 07.08. | Tesla's Terafab Takes Shape in Texas with $16.8B First Phase; Memory Engineering Hiring Signals DRAM Push | ||
| 06.08. | Samsung Reportedly Eyes Galaxy S27/S28 DDI Dual Sourcing Beyond System LSI Amid Rising Memory Costs | ||
| 06.08. | Nittobo Raises FY2027 Net Profit Forecast by JPY 3B; No Further T-Glass Price Hikes Planned | ||
| 06.08. | Nanya Tech Unveils Up to US$10.7B Fab 5A Investment Plan Through 2029; Targets 10nm-Class DRAM with EUV | ||
| 06.08. | Sandisk's Gross Margin Guidance Flatlines at 83-85%: What's Inside Its New Business Model Contracts? |