| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 05.03. | Nanya Tech: DRAM Up Month by Month in 1Q, Sharp 2Q Jump Ahead, Shortage Through 2028 | ||
| 05.03. | SK Hynix Commits Additional USD 15 Billion, Escalating Fab Expansion Race among Memory Giants | ||
| 05.03. | South Korea Steps Up Push for Next-Generation Power Semiconductors | ||
| 04.03. | [Insights] Memory Spot Price Update: DRAM Spots Top Contracts, Sentiment Cautious Ahead of Q2 Negotiations | ||
| 04.03. | Tesla Reportedly Weighs Doubling AI6 Output, May Add Samsung Orders Ahead of Executive Talks | ||
| 04.03. | Middle East Escalation Hits Tech: NVIDIA Shuts Dubai Office, AWS Data Center Strike Raises Concerns | ||
| 04.03. | Asia's Chipmakers Reportedly Eye $136B Spend in 2026, Up 25% YoY, Spanning Foundry and Memory | ||
| 04.03. | Intel Appoints Former Qualcomm and Google Executive Craig H. Barratt as Chairman, Effective May | ||
| 04.03. | SOCAMM War Heats up: Micron Ships 256GB SOCAMM2 Samples, Topping Industry Capacity | ||
| 04.03. | Wafer Capacity Set to Surge: A New Phase for the SiC Industry in 2026 | ||
| 04.03. | Inside Look at Micron's Newly Opened Sanand Plant: 10% of Global Output, Key Products and Clients | ||
| 03.03. | SK hynix Reportedly Explores New HBM4 Packaging, Boosting Performance via Tight DRAM Gaps | ||
| 03.03. | SKC Reportedly Channels Over Half of Won 1T Capital Increase Into Absolics to Fast-Track Glass Substrates | ||
| 03.03. | Delay at Samsung's Taylor Reportedly Slips Mass Production to 2027, Raising Concerns for Tesla | ||
| 03.03. | Israel Unrest Disrupts Tower; Orders Reportedly Shift to Vanguard, PSMC, Lifting Mature-Node Pricing | ||
| 03.03. | Intel Unveils Xeon 6+ Clearwater Forest at MWC with 18A Chiplet Design and Foveros Direct 3D | ||
| 03.03. | Samsung Reportedly Targets HBM4E Power Bottleneck with Structural Overhaul, Slashes Defects 97% | ||
| 03.03. | China's Smartphone Market Divides: Honor, Vivo at MWC vs Reported Memory-Driven Price Hikes This Week | ||
| 02.03. | Rapidus Reportedly Secures ¥167.6B Private Funding; 60 Clients in Talks, 10 Receive Initial Quotes | ||
| 02.03. | TSMC's 2025 Overseas Split: China Leads Profits, Arizona Turns Profitable, Japan Losses Widen | ||
| 02.03. | Huawei to Show Atlas 950 SuperPoD Overseas for First Time, Challenges NVIDIA on Cluster Scale | ||
| 02.03. | Taiwan's Phison Reportedly Follows Key Suppliers Kioxia, Sandisk with New Prepayment Policy | ||
| 02.03. | Only 1nm, Record-Low Power Consumption: Peking University Team Achieves Chip Breakthrough | ||
| 02.03. | [Insights] AI Power Demand Drives HVDC Shift in Data Centers; Full-Stack Integration Emerges as Key | ||
| 27.02. | SJ Semiconductor Reportedly Wins IPO Nod as China Bets on Advanced Packaging |