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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 30.04. | Qualcomm Reportedly to Supply Custom Chips to a Hyperscaler in December Quarter, Expands Data Center Push | ||
| 30.04. | Rapidus 2025 Financials Unveiled: Posts JPY 375M Loss; Assets Surge to JPY 749.5B on Rising Liabilities | ||
| 30.04. | Intel, SoftBank Reportedly to Unveil ZAM-Based HB3DM in June, Bandwidth More Than Double HBM4 | ||
| 30.04. | Samsung's DS Division Tops NVIDIA With 65.7% Operating Margin, Driving 93.8% of 1Q26 Profit | ||
| 30.04. | World's First AI Silicon Photonics Chip Listed Company Officially Goes Public | ||
| 30.04. | Researchers Reportedly Develop Ultrafast Laser Wiring for Glass Substrates, Targeting CPO Bottleneck | ||
| 29.04. | [Insights] Memory Spot Price Update: DDR5 Sees Sporadic Buying Interest; DDR4 Price Cuts Fail to Revive Demand | ||
| 29.04. | NAND Flash Controller Maker Silicon Motion Guides Up to 20% QoQ Sales Growth in 2Q After Record First Quarter | ||
| 29.04. | SK hynix Reportedly Completes 12-High Hybrid Bonding HBM Validation, Raises Yields for Mass Production | ||
| 29.04. | U.S. Reportedly Moves to Block Chip Tool Shipments to China No.2 Foundry Hua Hong as It Seeks 7nm After SMIC | ||
| 29.04. | Intel Foundry Gains Momentum: Apple Reportedly Eyes 18A-P as Google Explores Advanced Packaging | ||
| 29.04. | Over 10 Automobile Models Adopted Micro LED Headlamps in 2026, Mercedes-Benz and Audi Included | ||
| 29.04. | Huawei Ascend, Cambricon and Hygon Completed Day 0 Adaptation to DeepSeek-V4 | ||
| 28.04. | Xiaomi's Next Foldable Reportedly to Feature Self-Developed XRING O3 Chip, May Use 3nm Process | ||
| 28.04. | CXL May Emerge as Post-HBM Battleground; Samsung Reportedly Presents System with 10× Performance Gain | ||
| 28.04. | TSMC CoWoS Wafer ASP Reportedly Nears 7nm Levels; Advanced Packaging to Become a Key Profit Driver | ||
| 28.04. | Macronix NAND Sales Jump 382% YoY on Samsung's MLC Exit, Shifts to Monthly Pricing Amid Deepening Crunch | ||
| 28.04. | China Inference GPU Firm Sunrise Secures Over RMB 1B in Funding, Valuation Reportedly Exceeds RMB 10B | ||
| 28.04. | Moore Threads Reportedly Turns Profitable in 1Q26 but Remains Loss-Making in 2025 as R&D Hits RMB 1.3B | ||
| 27.04. | Intel Reportedly Sells Chips Typically Scrapped as CPU Demand Surges; 1Q26 Server CPU ASPs Up 27% | ||
| 27.04. | TEL Fined $5M in TSMC Trade Secrets Case; Former China Executive Left Over Links to Chinese Chip Tool Startups | ||
| 27.04. | TSMC 3nm Monthly Capacity May Hit 180K Wafers by 2026, Up Over 40% YoY on AI Demand | ||
| 27.04. | Samsung's May Strike Seen Disrupting Up to 4% of DRAM Output, With Weeks-Long Recovery Risk | ||
| 27.04. | OpenClaw's Popularity Ignites the AI Agent Trend: Advantech and D8AI Join Forces to Lower Barriers and Accelerate Enterprise Adoption | ||
| 27.04. | New Thermal Management Breakthrough: GaN-on-Sapphire Substrate Thinned to 50µm |
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