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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 21.01. | JX Advanced Metals Reportedly Plans ¥5B Rapidus Investment, Plus Key Materials Supply | ||
| 21.01. | China's Xiaomi, OPPO Reportedly Cut 2026 Shipments Amid Memory Crunch, Huawei Less Affected | ||
| 21.01. | [Insights] Late-January Panel Prices: TV Panels Poised to Rise, Notebook Continue to Fall | ||
| 21.01. | TSMC Advanced Packaging CapEx Projected to Grow 24% CAGR in 2025-27; AP7 Eyes WMCM, CoPoS | ||
| 21.01. | Volume-Locked, Price-Flexible LTAs Gain Ground in DRAM, Nanya, Winbond Reportedly Extend Contracts | ||
| 21.01. | China Robotics Competition Intensifies in 2026; Top Firms Near RMB 1B in Orders; Shakeout Looms | ||
| 21.01. | From Air Conditioners to SiC: China's Gree Electric Accelerates Third-Gen Chip Push for EVs | ||
| 20.01. | Intel Recruits Qualcomm and AMD GPU Veteran Eric Demers to Advance AI Push | ||
| 20.01. | Samsung Reportedly Sets March EUV Trials at Taylor Fab Ahead of Tesla Chip Production | ||
| 20.01. | TSMC Reportedly Expands WMCM Packaging for Apple, Capacity May More Than Double by 2027 | ||
| 20.01. | VRAM Shortage Reportedly Drives NVIDIA's RTX 50 Price Hikes at Taiwan's GPU Card Makers This Month | ||
| 20.01. | Chinese Memory Makers Push Ahead With IPO Plans: GigaDevice, UniIC, and DapuStor | ||
| 20.01. | Samsung Reportedly Cuts Fold Crease 20% With Ultra-Thin Glass; Galaxy Z Fold 8, Apple May Adopt | ||
| 19.01. | Nanya Tech Posts Record Q4 EPS NT$3.58, Flags Tight DDR5/4/3 Supply and 1Q Price Hikes | ||
| 19.01. | China Steps Up Glass Substrate: BOE Reportedly Targets 2026 Mass Production, Visionox Joins the Race | ||
| 19.01. | Intel's Ohio 14A Project Gains Traction as Key Contractor Bechtel Reportedly Ramps Hiring | ||
| 19.01. | Lutnick Reportedly Signals 100% Memory Tariff on Non-U.S. Output, Pressuring Samsung and SK hynix | ||
| 19.01. | DDR4 Reportedly Leads Legacy Memory Rally with Q1 Prices Up to 50%; DDR3 in Tight Supply | ||
| 19.01. | China's OSAT Giants Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund | ||
| 19.01. | Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch | ||
| 16.01. | Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027-28; Market Could Surpass HBM by 2038 | ||
| 16.01. | SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads | ||
| 16.01. | MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market | ||
| 16.01. | Taiwan-U.S. Trade Deal Cuts Tariffs from 20% to 15%, Secures $250B Investment with TSMC at Center | ||
| 16.01. | HBM Etching Equipment Said to Enter a Super Cycle |
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