- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 22.01. | China's LED Industry Sees Broad Price Hikes; MLS and Kinglight Models Reportedly Up 5%-10% | ||
| 22.01. | First Wave of Chip Resistor Hikes: Walsin Reportedly Follows Yageo, Up to 20% from Feb. 1 | ||
| 22.01. | Apple Reportedly Eyes 2027 AirTag-Sized AI Wearable Launch to Compete With OpenAI | ||
| 22.01. | Samsung Accelerates Taylor Fab Ramp-Up, Domestic EUV Pellicles Reportedly Enter U.S. Line | ||
| 22.01. | World's First Gen-8.6 OLED Production Line Enters Mass Production and Begins Shipments | ||
| 22.01. | Vietnam Breaks Ground on First Domestic Chip Plant, Reportedly Aims Trial Production by 2027 | ||
| 21.01. | Samsung Reportedly Moves Custom HBM Logic Die to 2nm Foundry Process for the First Time | ||
| 21.01. | JX Advanced Metals Reportedly Plans ¥5B Rapidus Investment, Plus Key Materials Supply | ||
| 21.01. | China's Xiaomi, OPPO Reportedly Cut 2026 Shipments Amid Memory Crunch, Huawei Less Affected | ||
| 21.01. | [Insights] Late-January Panel Prices: TV Panels Poised to Rise, Notebook Continue to Fall | ||
| 21.01. | TSMC Advanced Packaging CapEx Projected to Grow 24% CAGR in 2025-27; AP7 Eyes WMCM, CoPoS | ||
| 21.01. | Volume-Locked, Price-Flexible LTAs Gain Ground in DRAM, Nanya, Winbond Reportedly Extend Contracts | ||
| 21.01. | China Robotics Competition Intensifies in 2026; Top Firms Near RMB 1B in Orders; Shakeout Looms | ||
| 21.01. | From Air Conditioners to SiC: China's Gree Electric Accelerates Third-Gen Chip Push for EVs | ||
| 20.01. | Intel Recruits Qualcomm and AMD GPU Veteran Eric Demers to Advance AI Push | ||
| 20.01. | Samsung Reportedly Sets March EUV Trials at Taylor Fab Ahead of Tesla Chip Production | ||
| 20.01. | TSMC Reportedly Expands WMCM Packaging for Apple, Capacity May More Than Double by 2027 | ||
| 20.01. | VRAM Shortage Reportedly Drives NVIDIA's RTX 50 Price Hikes at Taiwan's GPU Card Makers This Month | ||
| 20.01. | Chinese Memory Makers Push Ahead With IPO Plans: GigaDevice, UniIC, and DapuStor | ||
| 20.01. | Samsung Reportedly Cuts Fold Crease 20% With Ultra-Thin Glass; Galaxy Z Fold 8, Apple May Adopt | ||
| 19.01. | Nanya Tech Posts Record Q4 EPS NT$3.58, Flags Tight DDR5/4/3 Supply and 1Q Price Hikes | ||
| 19.01. | China Steps Up Glass Substrate: BOE Reportedly Targets 2026 Mass Production, Visionox Joins the Race | ||
| 19.01. | Intel's Ohio 14A Project Gains Traction as Key Contractor Bechtel Reportedly Ramps Hiring | ||
| 19.01. | Lutnick Reportedly Signals 100% Memory Tariff on Non-U.S. Output, Pressuring Samsung and SK hynix | ||
| 19.01. | DDR4 Reportedly Leads Legacy Memory Rally with Q1 Prices Up to 50%; DDR3 in Tight Supply |
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