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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 23.07. | SK hynix Reportedly Eyed as Potential Partner to Operate Intel's Ohio Fab After Denying Acquisition Plans | ||
| 23.07. | GaAs and InP Substrate Project Approved in Chinese Zhejiang Province | ||
| 23.07. | Nanya Tech Sees Memory Market to Reach Record US$800B in 2026, Nearly Half of Semiconductor Revenue | ||
| 22.07. | AI Data Center Demand Revives HDD; Japanese Component Makers TDK, Resonac Expand Capacity | ||
| 22.07. | Samsung Reportedly Builds Hybrid Bonding Mass Production Line; Full-Scale Deployment Seen in 2029-2030 | ||
| 22.07. | [Insights] Memory Spot Price Update: DRAM Spot Market Edges Higher as Branded DDR4 Demand Supports Prices | ||
| 22.07. | Wistron Produces First U.S.-Made GB300 Baseboard; D1 Factory Represents Just 5% of NVIDIA's Output | ||
| 22.07. | TSMC Reportedly Plans Up to 10% Price Hikes in 2027, with Extra HPC Premiums: Apple, NVIDIA in Focus | ||
| 22.07. | Chinese Researchers Developed the World's First Phase-Change Memristor-Based Neural Dynamical System Chip | ||
| 22.07. | SK hynix Set to Post Record Operating Margin in Q2, as HBM Mix Weighs on ASP Growth and LTAs Gain Focus | ||
| 21.07. | Samsung Reportedly Targets 2026 CXL 3.2 Mass Production; SK hynix Advances New AI Memory Architecture | ||
| 21.07. | Moonshot Suspends Kimi K3 Subscriptions Amid Compute Crunch; Microsoft Reportedly Weighs Adoption | ||
| 21.07. | Intel Reportedly Plans Data Center and AI Group Layoffs Despite the Unit's 22% 1Q26 Revenue Growth | ||
| 21.07. | AMD's Helios AI Rack Challenges NVIDIA with HBM4 Memory Edge; Microsoft Joins as Latest Customer | ||
| 21.07. | OPPO Reshapes Global Brand Strategy as realme Exits China Market | ||
| 21.07. | China Memory Prices Show Early Signs of Easing; Second-Hand 16GB DDR4 Reportedly Falls Over 30% From Peak | ||
| 20.07. | SK Group Chairman Says Abnormal Memory Prices Should Fall; AI Chip Demand Seen Up 60-100% Next Year | ||
| 20.07. | [Sponsored Content] Breaking AI Server Integration Barriers: How ARDGE and Advantech Make Enterprise On-Premises AI Deployment Practical | ||
| 20.07. | NVIDIA's RTX 50 Super Refresh Faces Launch Uncertainty as 3GB GDDR7 Reportedly Costs 3× Than 2GB | ||
| 20.07. | Samsung Reportedly Gives Wide Fold the Largest Annual Production Share at 2.8M as Apple May Drive 4:3 Shift | ||
| 20.07. | TSMC's $265B U.S. Bet: "No Food Left on the Table" Despite 4-5x Higher Fab Construction Costs | ||
| 20.07. | Tata's India Fab Reportedly to Launch at 90nm Instead of 28nm; Commercial Production Delayed to Mid-2028 | ||
| 20.07. | WAIC 2026 Highlights China's SuperNode Push Led by Huawei; MiniMax M3, Unitree Robots in Focus | ||
| 17.07. | TSMC After Earnings Call: Foreign Brokerages See EUV-Driven CapEx Surge and 2027 Price Hikes | ||
| 17.07. | Samsung Reportedly Holds Back High-NA EUV Mass Production to Contain Costs Ahead of Foundry Turnaround |
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