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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 23.03. | Musk's Terafab Vision Raises Questions Over TSMC Impact; Advanced Packaging May be Best Entry Point | ||
| 23.03. | Huawei Debuts Atlas 350 on Ascend 950PR with In-house HBM, Touting 2.8X H20 Performance | ||
| 23.03. | ASML Reportedly Eyes Hybrid Bonding Equipment, Precision Edge May Reshape Advanced Packaging Landscape | ||
| 23.03. | While DDR5 Margins Reportedly Surpass HBM: What's Next for Memory Giants? | ||
| 20.03. | Samsung Reportedly Eyes Long-Term Memory Deals with Google, Microsoft; May Include $10B+ Prepayments | ||
| 20.03. | Alibaba's T-Head Reportedly Hits 470K Chip Shipments, Expands Amid Unclear IPO Timeline | ||
| 20.03. | CSPs Accelerate ASIC Push in 2H26, Challenging NVIDIA as MediaTek, GUC, Alchip Benefit | ||
| 20.03. | Samsung Reportedly Allocates 50%+ of Pyeongtaek Foundry Capacity to HBM4 Base Die; Said to Win OpenAI Deal | ||
| 20.03. | SK hynix Reportedly Weighs TSMC 3nm for HBM4E Logic Dies to Gain Edge over Samsung | ||
| 20.03. | Tsinghua Team Achieves Key Breakthrough in Novel Magnetic Memory | ||
| 20.03. | Japan's Rix Said to Target AI Chip Packaging Boom with Cleaning Tools in 2026 | ||
| 19.03. | MLCC Giant Murata Reportedly to Decouple China Rare Earth Supply in 3 Years as Risks Rise | ||
| 19.03. | Kioxia Reportedly to End Slim NAND Packages, Final Shipments due March 2027 | ||
| 19.03. | imec Secures ASML's Most Advanced EXE:5200 High-NA EUV for Sub-2nm; 4Q26 Qualification Target | ||
| 19.03. | AMD Secures Samsung HBM4 for MI455X; Deal May Tie Partial AI Chip Shift to Samsung Foundry | ||
| 19.03. | Micron Ramps FY26 Capex to $25B, Signs First 5-Year Customer Deal | ||
| 19.03. | China Achieves 14-Inch SiC Breakthrough, Intensifying Global Large-Wafer Competition | ||
| 19.03. | [Insights] NVIDIA Expands Robotics Ecosystem at GTC as Physical AI Moves Toward Large-Scale Deployment | ||
| 18.03. | Memory Giant Shifts Strategy: Samsung Reportedly Eyes 3-5 Year Contracts to Stabilize Supply | ||
| 18.03. | [Insights] Memory Spot Price Update: DRAM Spots Pause Amid Samsung's March DDR4 Freeze | ||
| 18.03. | Samsung Reportedly Eyes 2nm Base Die for HBM5, 1d DRAM HBM5E; HBM4 to Exceed 50% of Output | ||
| 18.03. | NVIDIA Rubin Ultra and Feynman Reportedly to Boost TSMC SoIC; Besi, Applied Materials, TEL to Benefit | ||
| 18.03. | NVIDIA's China-Ready LPUs Could Launch as Early as May; H200 Production Restarts | ||
| 18.03. | World's First 6-Inch InP Photonic Chip Industrial Wafer Fab Broke Ground | ||
| 18.03. | Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026, EMIB Update |
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