- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 15.09. | MediaTek's Dimensity 9600 Pro, Built on TSMC 2nm, Reportedly Hits Record $220, Closing In on Qualcomm | ||
| 15.09. | Micron Taiwan Union Reportedly Seeks 15% Profit Share After New Reward Plan; Warns of Strike Vote | ||
| 15.09. | ASE's SPIL Reportedly Nears Arizona Expansion as TSMC, Amkor Step Up U.S. Advanced Packaging Push | ||
| 15.09. | Kioxia Reportedly Weighs $10B U.S. Listing in 2027; Toshiba Cuts Stake to 12.84% | ||
| 15.09. | South Korea Expands Espionage Law to Combat Chip Tech Leaks; China Led Overseas Cases at 54.5% | ||
| 15.09. | China's Empyrean Reportedly Cuts Chip Design Task from 4 Weeks to One with AI, Eyes New EDA Opening with Tau Law | ||
| 14.09. | Anthropic CEO Calls for Slower AI Progress but Flags China Risk; OpenAI Reportedly Rules Out 2026 IPO | ||
| 14.09. | SanDisk Reportedly Hunts for HBM, LPDDR Talent in Korea as AI Memory Race Heats Up | ||
| 14.09. | TSMC Reportedly Targets 22% 2nm, 16%+ 3nm Capacity Boost by Mid-2027; CoWoS to Double by 2028 | ||
| 14.09. | Kepler Claims HBM Alternative Without EUV Using GlobalFoundries' 28nm Fabs, 2027 Production | ||
| 14.09. | China's High-Purity Quartz Reportedly Qualifies for 300mm DRAM Production, Boosting Materials Localization | ||
| 11.09. | Samsung-Qualcomm 2nm Deal May Slip to 2027; Foundry Resists Lower Pricing as Process Stabilizes | ||
| 11.09. | Samsung Electro-Mechanics' MLCC Revenue Seen Topping KRW 8T in 2027; Murata EOL May Reshape Market | ||
| 11.09. | Micron Unveils Record Rewards: Taiwan Staff Get NT$1M Bonus, Up to 68 Months of Compensation | ||
| 11.09. | Huawei Unveils 7.2Tbps Near-packaged Optics Module, Challenging NVIDIA and Broadcom's CPO Push | ||
| 11.09. | Samsung, CXMT Reportedly Supply LPDDR5X for Chinese AI Phone as Domestic Memory Enters Flagship Supply Chain | ||
| 11.09. | Renesas to Raise Prices Again From Jan. 2027, Citing Rising Material, Energy and Manufacturing Costs | ||
| 10.09. | Chinese AI Chipmakers Reportedly Hike Prices on HBM Costs, Huawei 950DT Up as Much as 50% | ||
| 10.09. | TSMC August Revenue Tops NT$500B for First Time, Sets Record for Fourth Straight Month | ||
| 10.09. | TSMC's Taichung 1.4nm P1, P2 Fabs Could Begin Mass Production in 2027, Ahead of 2028 Plan | ||
| 10.09. | Inside iPhone 18 Pro and Duo: A20 Pro Debuts as Apple's 1st 2nm Chip in iPhone, Duo Trades RAM for Storage | ||
| 10.09. | World's First Silicon Carbide Superjunction MOSFET Made its Debut | ||
| 10.09. | NVIDIA's DLSS 5 Could Boost Graphics DRAM Demand, With GDDR6 Prices Reportedly Already Triple | ||
| 09.09. | OpenAI Says It Is Working with Samsung on Next-Gen Chips; Ties Could Expand Beyond Memory | ||
| 09.09. | Kioxia Denies SK hynix Joint Production Talks, Seeks NAND Price Stability to Sustain AI Investment |
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