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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 10.06. | Amazon Signed Multibillion-Dollar Fiber Optics Supply Agreement With Corning | ||
| 10.06. | China's Prinano Claims 8-inch Photonic Chip Mass Production Using Nanoimprint Tech, Bypassing DUV Lithography | ||
| 09.06. | Apple Foldable Takes Shape as iOS 27 Reveals Flexible-Display Support; Smart Glasses Plans Also Emerge | ||
| 09.06. | Largan Expands CPO Push, Plans September Fiber Array Pilot Line, Eyes 2027 Revenue Contribution | ||
| 09.06. | SK hynix Reportedly Places 44.2bn Won TC Bonder Order with Hanmi, Accelerating HBM4 Ramp-up | ||
| 09.06. | Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips | ||
| 09.06. | Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs | ||
| 09.06. | Nikon Targets Panel Packaging With New Lithography System Set for FY27 Launch, Targeting 30%+ Productivity Gain | ||
| 09.06. | China's Tungsten Carbide and Powder Exports to Japan Reportedly Drop to Zero in Feb-Apr as Prices Surge | ||
| 08.06. | Chinese EV Makers Reportedly Hike Prices by Up to RMB 6,000 as Auto Memory Costs Surge 180% in 3 Months | ||
| 08.06. | Apple May Debut M5 Ultra-Powered Mac Studio at WWDC, Boosting Demand for TSMC N3P and SoIC-mH | ||
| 08.06. | Huawei Brings Forward Ascend 950DT Deployment to August, DeepSeek V4.2 Seen as Potential Early Adopter | ||
| 08.06. | SK hynix to Supply Memory for NVIDIA Vera CPU as Partnership Deepens; Samsung Meeting in Spotlight | ||
| 08.06. | Samsung Reportedly Trims 2026 Foldable Target to 5-6M Units for Galaxy Z Fold8, Flip8 and Wide Fold | ||
| 08.06. | Onsemi Reportedly Plans Up to 300 Job Cuts in Czech Plant as Low-cost Chinese SiC Competition Intensifies | ||
| 05.06. | [Insights] Early June Panel Prices: TV Demand Weakens; MNT Price Gains Lose Momentum, NB Stays Flat | ||
| 05.06. | HBF Spurs Equipment Race; Hanmi Semiconductor Eyes First TC Bonder Deliveries in 2H26 | ||
| 05.06. | SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion | ||
| 05.06. | Motherboard and Module Makers Reportedly Expand DDR4 Platforms Amid Rising DDR5 Costs | ||
| 05.06. | Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows | ||
| 05.06. | Laser Annealing Adoption May Broaden with Wolfspeed, Samsung SiC Push and 400-Layer NAND Expansion | ||
| 05.06. | Samsung, SK hynix Plan New Heat Dissipation Technologies Starting HBM5: Three Memory Makers' Approaches in Focus | ||
| 04.06. | Intel Says 18A May Reach Strong Margins by 2027; Notebook Chips on the Node Mark Fastest Ramp in 5 Years | ||
| 04.06. | Broadcom Stops Short of Raising FY2027 US$100B AI Chip Sales Target Despite Google, Meta Commitments | ||
| 04.06. | TSMC Rejects High-NA EUV Investment Concerns, Confirms Purchase for R&D Use |
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