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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 31.12.25 | TSMC May Fast-Track 1.4nm at Central Taiwan Science Park as 2nm Yields Reportedly Beat Expectations | ||
| 31.12.25 | Micron Reportedly Weighs Acquiring PSMC 12-Inch Tongluo Fab, With Multiple Partners Also Interested | ||
| 31.12.25 | ASUS to Raise Prices on Selected PC Lines from Jan. 5 Amid Memory Cost Surge, Following Dell | ||
| 31.12.25 | 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles | ||
| 31.12.25 | Sony, Microsoft Reportedly Weigh Delaying Next-Gen Game Consoles Beyond 2028 Amid Memory Price Surge | ||
| 30.12.25 | Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4 | ||
| 30.12.25 | China Diversification Reportedly Lifts Mature-Node Foundries UMC, VIS, PSMC Despite Tariff Delay | ||
| 30.12.25 | Samsung, SK hynix Escape Worst-Case as China VEU Ends: Annual Review Risks Loom | ||
| 30.12.25 | TSMC Advanced-Node Materials Reportedly Found at Lo's Residence Amid Controversial Intel Hire | ||
| 30.12.25 | NVIDIA's $20B Groq Deal Spotlights SRAM Shift-MediaTek NPU Already On Board | ||
| 30.12.25 | Chinese Scientists Achieved New Breakthrough in Next-Gen Optical Computing Chips | ||
| 30.12.25 | Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team | ||
| 29.12.25 | Samsung Reportedly Pushes In-House CPU and GPU for Exynos 2800 to Cut Qualcomm, AMD Reliance | ||
| 29.12.25 | SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC | ||
| 29.12.25 | TSMC Reportedly to Raise Sub-3nm Prices 3-10% in 2026, Plans Hikes Through 2029 | ||
| 29.12.25 | Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal | ||
| 29.12.25 | 7.0 Quake Hits: TSMC Nears Full Production, Sector Losses Reportedly Tens of Billions NTD | ||
| 29.12.25 | SLC-Based AI SSDs Gain Traction as SK hynix and Kioxia Accelerate Development With NVIDIA | ||
| 29.12.25 | NVIDIA Reportedly Denies USD 20B Groq Acquisition Rumors | ||
| 26.12.25 | Huawei Reportedly Plans 2026 Ascend 950 Sales in South Korea, Targeting Cluster-Level Deployments | ||
| 26.12.25 | AI Reportedly to Consume 20% of Global DRAM Wafer Capacity in 2026, HBM and GDDR7 Lead Demand | ||
| 26.12.25 | China's SMEE Reportedly Wins RMB 110M Lithography Tool Contract Amid Domestic Push | ||
| 26.12.25 | TSMC Dismisses Nanjing Risks as VEU Expires, Flags Global Advanced Capacity for Chinese Clients | ||
| 26.12.25 | Automakers Race Into the Emerging AI Glasses Arena | ||
| 26.12.25 | Key Highlights to Watch at CES 2026: From Intel Panther Lake to Qualcomm's Snapdragon X2 Elite |
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