| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 22.05. | Huawei Takes Stake in InP Optical Chip Firm Milphoton Semiconductor | ||
| 22.05. | Samsung Reportedly Shifts GaN Strategy to Foundry on Customer Growth; Operations May Start in July | ||
| 21.05. | AMD's Lisa Su Reportedly to Visit TSMC for 2nm Capacity; Announces US$10B Taiwan AI Packaging Investment | ||
| 21.05. | DDR4 Shortage Reportedly Limits Nanya Tech's DDR5 Shift; GM Says DRAM Margins Across Segments Top HBM | ||
| 21.05. | Micron Reportedly Expands Korea HBM Hiring Amid Samsung Labor Tensions; Annual Pay Reaches KRW 300M | ||
| 21.05. | NVIDIA Earnings Spotlight: $20B CPU Sales Target in 2026, China Concession to Huawei, and Reporting Overhaul | ||
| 21.05. | Researchers Develop Piezoelectric Hybrid Chip, Achieving 96.2% Power Conversion Efficiency for GPU | ||
| 21.05. | Alibaba T-Head Unveils Zhenwu M890 With 3× Performance vs. Prior Gen; New AI Chips Planned for 3Q27/3Q28 | ||
| 20.05. | [Insights] Memory Spot Price Update: DDR5 Spots Strengthen on Branded Demand and Higher Bids, DDR4 Weakens | ||
| 20.05. | ADATA Sees Samsung Strike Boosting Memory Prices; China Expansion Impact Seen No Earlier Than 2028 | ||
| 20.05. | Meta Reportedly Lays Off 8,000 Workers Amid AI Push; Cuts Seen Saving Only US$3 Billion Against Rising CapEx | ||
| 20.05. | ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC's Cost-Driven Delay | ||
| 20.05. | Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments | ||
| 20.05. | Joint Team Led by Shanghai AI Lab Cracks Stable Production Challenge for Photoresist | ||
| 20.05. | NVIDIA Reportedly Plans GPU-Direct Storage for Vera Rubin, Raising Expectations for HBF Beyond HBM | ||
| 19.05. | Intel 18A Yields Up 7%-8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages | ||
| 19.05. | SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review | ||
| 19.05. | China's AMEC Reportedly Produces Some of the Most Advanced Etching Tools; SMIC Purchased 800+ Machines | ||
| 19.05. | Anhydrous Hydrogen Fluoride Supply Tightens, Raising Concerns Across Semiconductor Materials Chain | ||
| 19.05. | Apple Cuts China iPhone 17 Pro Prices by ¥1,000; Huawei, Xiaomi Follow - What's Behind the Discounts? | ||
| 18.05. | First Intel Wildcat Lake Laptops Near Launch; Reportedly Built on 18A, Taking Aim at Apple's MacBook Neo | ||
| 18.05. | TSMC Targets 2H26 COUPE on Substrate; NVIDIA Could Eye Long-Term Substrate Deals Amid CPO Push | ||
| 18.05. | Memory 1Q26 Price Surge: Samsung Flags 146% ASP Jump, SK hynix Sees Mid-60% DRAM Gains | ||
| 18.05. | YC Chem Reportedly First in Industry to Supply Glass Substrate Photoresists; Customer Targets End-2026 Mass Production | ||
| 18.05. | China's Rare Earth Compound Exports Fell 17% in Value; Alternative Supply Chains Gain Momentum |