| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 08.10. | AI Chip Testing Capacity Tightness Prompts Customers to Lock In 1-Year-Plus Deals; Sigurd Hikes Prices | ||
| 08.10. | Micron Taiwan's Taoyuan Union Secures Right to Strike With 88.3% Support; Taichung Mediation Set for Oct. 22 | ||
| 07.10. | Intel CEO Lip-Bu Tan Says It Remains in Musk's Terafab as TSMC Speculation Grows | ||
| 07.10. | [Insights] Memory Spot Price Update: DRAM Spot Largely Sideways as Holidays, Month-End Effects Weigh | ||
| 07.10. | Huawei Says Ascend Market Share Tops NVIDIA in China, Backs NPO Over CPO for Optical Interconnects | ||
| 07.10. | Samsung 3Q Preliminary Results Preview: Market Sees Historic KRW 100T Profit, Memory Margin Could Top 80% | ||
| 07.10. | Micron's Expansion Push Lifts Korean Chip Suppliers, with Hanmi's HBM TC Bonder Reportedly in Focus | ||
| 07.10. | SK hynix's Solidigm Reportedly Eyes New Taiwan Data Center SSD Site, Dec. Shipments Planned | ||
| 06.10. | AMD's Lisa Su Visits TSMC, AI Supply Chain Partners as Company Locks In Capacity 3-5 Years Ahead | ||
| 06.10. | Seagate, Toshiba Reportedly Vie for TDK's HDD Head Unit, a Key Independent Supply Source | ||
| 06.10. | [Insights] Early October Panel Prices: MNT, NB Stay Flat Despite Weak Demand as Component Costs Rise; TV Also Holds Steady | ||
| 06.10. | Nanya DRAM ASP Seen Rising 10% in 4Q26; Winbond Also Sees Further Price Gains as Memory Supply Stays Tight | ||
| 06.10. | JEDEC Unveils First Industry-Wide Silicon Photonics Reliability Standard, Setting Rules Across Four Key Areas | ||
| 06.10. | Qualcomm, Apple, MediaTek Battle It Out on TSMC 2nm: Inside Their Flagship AI Strategies | ||
| 06.10. | Micron Sees Tighter Memory Supply Through FY28: When Will the Big Three's New Capacity Arrive? | ||
| 05.10. | Qualcomm to Pay Huawei for First Time Under Cross-Licensing Deal Covering 5G, AI and LogicFolding Patents | ||
| 05.10. | IC Designers Reportedly Eye 5% to Double-Digit Price Hikes in Late 2026-Early 2027 as Foundry Costs Rise | ||
| 05.10. | China Reportedly Spent $13B+ Stockpiling ASML DUV Tools in 2024-25 as Advanced Chip Push Continues | ||
| 05.10. | TSMC Earnings Preview: Terafab Talks, Price Hikes and A14-Intel Race Lead Five Key Themes | ||
| 05.10. | China-Based CS Microelectronics Develops 90W Addressable VCSEL Chip | ||
| 05.10. | AI, HBM Drive Memory Testing Demand: How China's Suppliers Are Challenging an 80%-Import Market | ||
| 02.10. | Tesla Halves AI5 AI Chip's LPDDR5 to 72GB, Cuts AI6 LPDDR6 by One-Third as Memory Supply Tightens | ||
| 02.10. | Toshiba to Double AI Data Center HDD Capacity by FY2027 With $380M Expansion as AI Storage Demand Surges | ||
| 02.10. | Micron Taiwan Investment Tops NT$1.6T as Four-Site Expansion Accelerates; Nanya Adds Pingtung Project | ||
| 02.10. | AMOLED Display Driver Leader Viewtrix Expands into Optical Communications |