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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 29.08. | SMIC 1H25 Net Profit Rises 35.6%, 7nm Capacity Reportedly to Double in 2026 | ||
| 29.08. | Intel CFO Says Trump Deal Prevents It From Selling Its Loss-Making Foundry | ||
| 29.08. | Broadcom Reportedly Boosts 2026 CoWoS Orders with Foundries on Strong ASIC Demand | ||
| 29.08. | GlobalFoundries Reportedly Cuts U.S. Jobs, Says CHIPS Act Funding Involves No Equity | ||
| 29.08. | SK hynix Launches Industry-First High-K EMC Mobile DRAM with 3.5x Higher Thermal Conductivity | ||
| 28.08. | Intel Faces Another Executive Exodus: Advanced Packaging Director Leaves for Analog Devices | ||
| 28.08. | Samsung Reportedly Weighs Intel Packaging Investment, Glass Substrate Tie-Up to Challenge TSMC | ||
| 28.08. | TSMC's 2nm Leak Update: 3 Engineers Indicted for Stealing Core Tech, Facing Up to 14 Years | ||
| 28.08. | China Reportedly to Triple AI Chip Output Next Year With Fabs Serving Huawei, Cutting NVIDIA Reliance | ||
| 28.08. | NVIDIA Growth Risk Looms as Revenue Expansion Hits Two-Year Low, China Hurdles Cloud Outlook | ||
| 28.08. | LED Maker Ennostar Disposes of NT$450M Stake in Micro LED Company PlayNitride | ||
| 28.08. | Huawei's 5nm Kunpeng 930 Leak Raises Big Question: TSMC or SMIC Behind it? | ||
| 27.08. | Is Cambricon the Next NVIDIA or Unsustainable Growth Story? Three Key Risks Behind the Epic Rally | ||
| 27.08. | Meta's Superintelligence Labs Reportedly Hit by Exits After Aggressive AI Hiring Push | ||
| 27.08. | Apple Reportedly Plots Bold iPhone Makeover, Foldable Coming in 2026, Boosting TSMC | ||
| 27.08. | Intel's Clearwater Forest Unveils 18A Backside Power at Hot Chips; TSMC's Super Power Rail to Follow | ||
| 27.08. | Nikon Announces Yokohama Plant Closure as Precision Equipment Business Weakens | ||
| 27.08. | U.S. Proposes Major Critical Minerals Update, Adding Copper, Potash, and Silicon to Draft List | ||
| 26.08. | TSMC Reportedly Fast-Tracks U.S. Packaging Plants for 2H26 Construction, 2028 Production | ||
| 26.08. | Malaysia Unveils First Homegrown AI Chip MARS1000 on 7nm | ||
| 26.08. | Intel Filing Cautions U.S. Stake Could Weigh on Future Funding, Overseas Business | ||
| 26.08. | Huawei Enters Global AI Memory Race with Upcoming AI SSD on August 27 | ||
| 26.08. | U.S. Could Break China's Grip on Critical Minerals through Mine Waste Recovery, Study Says | ||
| 25.08. | SK hynix Unveils World's First 321-Layer QLC NAND, Targets 1H26 Commercial Launch | ||
| 25.08. | U.S. to Acquire 10% Intel Stake, Yet Foundry Future Rests on Customer Demand |
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