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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 01.09. | MediaTek Ramps Up Advanced Packaging Push as TSMC Veteran Shang Hou Calls for More Talent | ||
| 31.08. | TSMC: SoIC, CoWoS Drive 50× Compute by 2029; Silicon Photonics to Top 50% of Transceiver Market by 2027 | ||
| 31.08. | SK hynix Reportedly Weighs Intel for HBM4E Base Dies amid TSMC Cost Pressure and Supply Diversification | ||
| 31.08. | SEMICON Taiwan Highlights AI Infrastructure, CPO; Google AI Chief Technologist to Make Asia Keynote Debut | ||
| 31.08. | CXMT Gross Margin Hits 87% in Q2 to Rival Memory Giants, as LPDDR6 Mass Production Reportedly Begins | ||
| 31.08. | Powertech Plans NT$70B Push for World's First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC | ||
| 31.08. | Intel's Advanced Packaging, Led by EMIB-T, Reportedly Set to Hit Its Stride in 2029; DRAM Manufacturing Ruled Out | ||
| 28.08. | Apple Foldable Screen Repair Could Top $1,155, Nearly Twice Galaxy Z Fold 8 | ||
| 28.08. | Micron Taiwan Strike Vote Possible in Sept. as ~80% Union Back Action Over Bonus Gap With Samsung, SK hynix | ||
| 28.08. | Trump Reportedly Eyes Broad Chip Tariffs on End Products; Consumer Demand Could Face Further Pressure | ||
| 28.08. | SK hynix Breaks Ground on Indiana Packaging Plant, Eyes HBM4E by 3Q29; CEO Sees Tight Supply Through 2030 | ||
| 28.08. | TSMC-Linked VIS' Fab 3 Fire Puts Further Pressure on Tight 8-Inch Capacity | ||
| 28.08. | HBF Promises Massive Capacity but Could Reportedly Cost More Than HBM, With Bandwidth at Just ~60% of HBM | ||
| 28.08. | YMTC Deepens Supplier Ties as 17 IC Firms Commit RMB 6B in Wuhan, With AMEC Among Key Players | ||
| 27.08. | Qualcomm Reportedly Enlists Samsung, SK hynix as HBC Memory Partners; TSMC Eyes Packaging Role | ||
| 27.08. | Apple's First Ternus-Era Launch Event Set for Sept. 9, Foldable May Debut; Standard iPhone 18 Eyed for 2027 | ||
| 27.08. | Kioxia Reportedly Plans JPY 1T+ NAND Fab in Japan, Operations Eyed for 2029 or Later | ||
| 27.08. | NVIDIA's Supply Commitments Soar to $279B as Memory Costs Surge; New NVHBM Boosts Bandwidth 30% | ||
| 27.08. | Apple Suppliers Diverge in 1H26: Lens Profit Halves on Rising Memory Costs, Luxshare Revenue Jumps 40% | ||
| 27.08. | Samsung Electro-Mechanics, LG Innotek Ramp Up AI Substrate Capacity as 1H Utilization Reportedly Nears 90% | ||
| 26.08. | Samsung's 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027 | ||
| 26.08. | South Korea's DRAM Prices Reportedly Soar 12.5-Fold in 3 Years, Outpacing Gold | ||
| 26.08. | Apple Unveils M6, Its First 2nm Chip Built by TSMC, With 30% AI GPU Compute Boost vs. M5 | ||
| 26.08. | OpenAI Debuts Jalapeño AI Inference Chip, with Samsung Reportedly Supplying HBM4 | ||
| 26.08. | Mercedes-Benz Expands Micro LED Headlamps to C-Class Lineup |
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