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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 20.05. | Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments | ||
| 20.05. | Joint Team Led by Shanghai AI Lab Cracks Stable Production Challenge for Photoresist | ||
| 20.05. | NVIDIA Reportedly Plans GPU-Direct Storage for Vera Rubin, Raising Expectations for HBF Beyond HBM | ||
| 19.05. | Intel 18A Yields Up 7%-8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages | ||
| 19.05. | SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review | ||
| 19.05. | China's AMEC Reportedly Produces Some of the Most Advanced Etching Tools; SMIC Purchased 800+ Machines | ||
| 19.05. | Anhydrous Hydrogen Fluoride Supply Tightens, Raising Concerns Across Semiconductor Materials Chain | ||
| 19.05. | Apple Cuts China iPhone 17 Pro Prices by ¥1,000; Huawei, Xiaomi Follow - What's Behind the Discounts? | ||
| 18.05. | First Intel Wildcat Lake Laptops Near Launch; Reportedly Built on 18A, Taking Aim at Apple's MacBook Neo | ||
| 18.05. | TSMC Targets 2H26 COUPE on Substrate; NVIDIA Could Eye Long-Term Substrate Deals Amid CPO Push | ||
| 18.05. | Memory 1Q26 Price Surge: Samsung Flags 146% ASP Jump, SK hynix Sees Mid-60% DRAM Gains | ||
| 18.05. | YC Chem Reportedly First in Industry to Supply Glass Substrate Photoresists; Customer Targets End-2026 Mass Production | ||
| 18.05. | China's Rare Earth Compound Exports Fell 17% in Value; Alternative Supply Chains Gain Momentum | ||
| 15.05. | TSMC Plans to Sell 8.1% Stake in Vanguard to Focus Resources on Core Businesses | ||
| 15.05. | Kioxia Reportedly Forecasts 48-Fold April Quarter Profit Jump, Eyes U.S. ADS Listing Amid Memory Boom | ||
| 15.05. | Samsung Reportedly Begins Preemptive Strike Measures on May 14, Shifts Product Mix Toward HBM | ||
| 15.05. | SMIC Q1 Net Profit Up 5%, Misses Forecasts; Smartphone-Related Revenue Share Hits Lowest Since 2021 | ||
| 15.05. | Applied Sees >30% Equipment Growth, >50% Packaging Surge in 2026; China Remains Top Market in 2Q | ||
| 15.05. | Rohm Reportedly Warns of Delays in Talks with Toshiba and Mitsubishi Electric After Denso Exit | ||
| 15.05. | Samsung Reportedly Develops New Mobile HBM Packaging With Copper Pillars, Boosting Bandwidth by 15%-30% | ||
| 14.05. | U.S. Reportedly Approves NVIDIA H200 Sales to 10 Chinese Firms Including Alibaba, ByteDance, but Deals Stall | ||
| 14.05. | Foxconn to Boost 2026 Capex by 30%; CPO Switches Reportedly Set for Q3 Mass Production | ||
| 14.05. | TSMC Sees AI Wafer Demand Rising 11x From 2022-2026, Targets CoWoS With 24 HBM Stacks in 2029 | ||
| 14.05. | Samsung SSD Prices Reportedly Surge Up to 300% in Japan, Kioxia Also Posts Gains as Market Divergence Widens | ||
| 14.05. | China's Wide Bandgap Chip Players Diverge, as GaN RF Surges; SiC Profitability Under Pressure |
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