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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 10.04. | Samsung Reportedly Bets on Vietnam with $4B Chip Packaging Push; Amkor Expands Presence | ||
| 10.04. | AI Compute Prices Rise Across China: Tencent Joins Alibaba, Baidu in Hikes; Zhipu Raises Prices Again | ||
| 10.04. | Samsung Reportedly Tops 2,000 Patent Approvals in China in Q1 as AI Memory and Advanced Chips Drive Surge | ||
| 09.04. | Samsung 2nm Exynos 2700 Benchmark Reportedly Surfaces, Signals Potential Efficiency Edge Over Qualcomm | ||
| 09.04. | Taiwanese module maker Transcend Reportedly Sees 40-50% DDR5 Price surge in Q2 as DDR4, NAND Shortages Persist | ||
| 09.04. | U.S. Moves to Tighten China Chip Tool Exports, Targets DUV to Slow SMIC and Peers' Advanced Node Push | ||
| 09.04. | From Annual Deals to 3-5 Year LTAs: Samsung and SK hynix Reportedly Reset Big Tech Memory Contracts | ||
| 09.04. | Samsung Reportedly Plans Galaxy Z Fold 8 and "Wide Fold" to Expand Lineup; Potential Specs Emerge | ||
| 09.04. | [Insights] Early April Panel Prices: Large-Size TV Panels Gain, Rising IC Costs Point to Further MNT Price Increases | ||
| 08.04. | Decoding Impact: Asia Chipmakers Move to Tackle Helium Strain as Intel Gains Relative Buffer | ||
| 08.04. | Apple Reportedly Sources Glass Substrate Samples Directly, Signaling Further In-House AI Server Chip Push | ||
| 08.04. | [Insights] Memory Spot Price Update: DRAM Extends Gradual Downtrend on Contained Selling Pressure; DDR4 Drops 1.18% | ||
| 08.04. | Intel Joins Tesla TeraFab, May Provide Design and Manufacturing Strength, Signaling Foundry Momentum | ||
| 08.04. | SK hynix Begins Shipping Industry-First 321-Layer QLC cSSD; Supplies Dell in April | ||
| 08.04. | Samsung Reportedly Solves SOCAMM2 Warpage, May Gain Edge Over Micron, SK hynix in Mass Production Timeline | ||
| 08.04. | Potential Supply Disruptions of Tungsten Hexafluoride from Japan: Implications for the Semiconductor Industry | ||
| 07.04. | Apple Mac mini, Mac Studio Delivery Times Reportedly Stretch to 5 Months Amid Memory Crunch | ||
| 07.04. | Decoding DeepSeek V4: How Huawei's Ascend 950 PR Is Powering China's Push to Break CUDA Dependence | ||
| 07.04. | TSMC March Revenue May Hit Record High; Geopolitics, Samsung Rivalry in Focus Ahead of Earnings Call | ||
| 07.04. | Intel Advanced Packaging Reportedly Gains Traction vs. TSMC as Google, Amazon Weigh EMIB Adoption | ||
| 07.04. | Samsung Sees Explosive 755% Profit Growth as Q1 Tops Full-Year 2025 Earnings amid Memory Boom | ||
| 07.04. | AIXTRON to Build New Manufacturing Facility in Malaysia | ||
| 07.04. | Two Key Breakthroughs Advance Full-Color Micro LED Microdisplays | ||
| 06.04. | SUMCO Delays Construction of Two Silicon Wafer Fabs Amid Market Shift | ||
| 06.04. | LG Display Rumored to develop Micro LED Inspection and Repair Technologies |
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