| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 09.12.25 | Samsung Reportedly Speeds Up U.S. Hiring as Tesla Prepares for AI5 Production | ||
| 09.12.25 | Japan Earthquake Impact: TEL and Rapidus Unharmed, Spotlight Turns to Kioxia Kitakami Fabs | ||
| 09.12.25 | Intel Emerges as Key Customer for Tata's $14B Chip Fab and OSAT Buildout in India | ||
| 09.12.25 | Trump Greenlights NVIDIA H200 Export to China: Chip Reportedly 6x H20 Power, with 25% Fee | ||
| 09.12.25 | Over CNY 10 Billion is Poured into China's Integrated Circuit Sector | ||
| 09.12.25 | Baidu Reportedly Explores Kunlunxin Spinoff and Listing Amid a Surge in China Chip IPOs | ||
| 08.12.25 | UMC Licenses imec's iSiPP300 to Advance Silicon Photonics, Eyes 2026-27 Risk Production | ||
| 08.12.25 | [Insights] Early December Panel Prices: Brands Increase Orders, Suggesting TV Downtrend May End Early | ||
| 08.12.25 | Apple Reportedly May Lose Custom Silicon Chief Johny Srouji Amid Executive Exodus | ||
| 08.12.25 | Smartphone Memory Levels Reportedly Plunge Below 4 Weeks, Low-End Devices in the Crosshairs | ||
| 08.12.25 | SK hynix Reportedly Accelerates Hybrid Bonding for 300-Layer V10 NAND, Eying 2027 Mass Production | ||
| 08.12.25 | TSMC's CoWoS-L/ S Reportedly Fully Booked, OSAT Partners Step up with ASE's CoWoP in Focus | ||
| 08.12.25 | Chinese Eastern Institute of Technology Ningbo Highlights Key Fields like IC and AI | ||
| 08.12.25 | Tokyo Electron Sees AI-Driven Sales Hitting 40% by FY2026, Offsetting China Slowdown | ||
| 05.12.25 | [Exclusive] Memory Crunch Hits PCs: Dell Hikes Prices 15-20% Mid-December, Lenovo from January 2026 | ||
| 05.12.25 | US Lawmakers Seek 30-Month Ban on Advanced AI Chips to China, Hitting NVIDIA H200 and Blackwell | ||
| 05.12.25 | Inside Huawei's Patent Playbook: GPU Dominance and Sub-2nm Ambitions Under Sanctions | ||
| 05.12.25 | UMC Teams With Polar to Boost 8-Inch Output, Accelerating U.S. Manufacturing After Intel Partnership | ||
| 05.12.25 | Intel Eyes EMIB to Ramp up in 2H26; 18A-P/18A-PT Moves Toward External Adoption | ||
| 05.12.25 | Innoscience Scores Major Patent Win Against Infineon as ITC Rules No Infringement | ||
| 05.12.25 | Chinese Semiconductor Equipment Maker PSR Completed Series A Funding | ||
| 05.12.25 | China's AI Toy Market Surges With 30+ Funding Rounds and Hot Launches From Huawei and UBTECH | ||
| 04.12.25 | TSMC Speeds Advanced Packaging: AP7 Targets 2026 Output; Arizona P6 Eyed for U.S. Packaging Hub | ||
| 04.12.25 | SK hynix Unveils Organizational Restructure with Dedicated HBM Taskforce in the Americas | ||
| 04.12.25 | Intel to Retain Networking and Edge Division After Spinoff Review as Financial Outlook Improves |