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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 03.03. | Israel Unrest Disrupts Tower; Orders Reportedly Shift to Vanguard, PSMC, Lifting Mature-Node Pricing | ||
| 03.03. | Intel Unveils Xeon 6+ Clearwater Forest at MWC with 18A Chiplet Design and Foveros Direct 3D | ||
| 03.03. | Samsung Reportedly Targets HBM4E Power Bottleneck with Structural Overhaul, Slashes Defects 97% | ||
| 03.03. | China's Smartphone Market Divides: Honor, Vivo at MWC vs Reported Memory-Driven Price Hikes This Week | ||
| 02.03. | Rapidus Reportedly Secures ¥167.6B Private Funding; 60 Clients in Talks, 10 Receive Initial Quotes | ||
| 02.03. | TSMC's 2025 Overseas Split: China Leads Profits, Arizona Turns Profitable, Japan Losses Widen | ||
| 02.03. | Huawei to Show Atlas 950 SuperPoD Overseas for First Time, Challenges NVIDIA on Cluster Scale | ||
| 02.03. | Taiwan's Phison Reportedly Follows Key Suppliers Kioxia, Sandisk with New Prepayment Policy | ||
| 02.03. | Only 1nm, Record-Low Power Consumption: Peking University Team Achieves Chip Breakthrough | ||
| 02.03. | [Insights] AI Power Demand Drives HVDC Shift in Data Centers; Full-Stack Integration Emerges as Key | ||
| 27.02. | SJ Semiconductor Reportedly Wins IPO Nod as China Bets on Advanced Packaging | ||
| 27.02. | March Price Wave Looms Amid Memory Crunch: Lenovo, Acer, Samsung, Chinese Phone Makers in Action | ||
| 26.02. | Meizu Reportedly Eyes March Smartphone Exit After Scrapping Launch Amid Memory Costs Surge | ||
| 26.02. | Apple Reportedly Eyes Chinese Memory as Leverage Against Samsung, SK hynix Amid Rising Costs | ||
| 26.02. | Samsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAM | ||
| 26.02. | SK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030 | ||
| 26.02. | Memory Giants' HBM Cleanroom Race: Samsung & SK hynix Fast-Track, Micron Acquires | ||
| 26.02. | China's Chip Materials Drive Intensifies as Photoresist Leader Red Avenue Seeks Hong Kong IPO | ||
| 25.02. | Xiaomi Doubles Down on Chips; Trademark Filing Reportedly Signals Potential Memory Entry | ||
| 25.02. | SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration | ||
| 25.02. | China Reportedly Aims to Boost 7nm, 5nm Output Fivefold in Two Years, Driven by SMIC, Hua Hong | ||
| 25.02. | NVIDIA GTC 2026 in Focus: Feynman Reportedly on TSMC A16, Samsung & SK hynix to Showcase HBM4 | ||
| 25.02. | MediaTek CEO Flags Memory as One of XPU Bottlenecks, Now Making Up 50% of Costs | ||
| 25.02. | South Korean Fabless Sector Hit by 2025 Losses as AI Lifts Foundry Costs and China Competition Grows | ||
| 24.02. | NVIDIA, Apple Reportedly Court Korean HBM, NAND Talent with Six-Figure Pay Amid AI Memory Boom |
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