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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 18.09. | Intel Rumored to Build Tesla Chips on 18A; Gaudi 3 Sees Early Momentum in Dell Servers | ||
| 18.09. | South Korea Launches First 8-Inch SiC Plant in Busan, Annual Output Projected at 30K Wafers | ||
| 18.09. | Samsung Reportedly Outsources Photomasks for the First Time, Eyes New Masks Tech for EUV | ||
| 17.09. | [Insights] Memory Spot Price Update: DDR4 Spot Prices Surge Amid Tight Supply, Buyers Struggle to Keep Pace | ||
| 17.09. | Alibaba T-Head PPU Lands China Unicom Deal, Reportedly Matches NVIDIA H20 Performance | ||
| 17.09. | SMIC Said to Test Chinese-Made DUV Lithography Tool from SiCarrier Affiliate Amid AI Chip Push | ||
| 17.09. | NVIDIA RTX6000D Reportedly Fails to Gain Traction in China, Stock Surplus Looms | ||
| 17.09. | SanDisk Reportedly Sees NAND Shortage Until 2026; Ongoing Price Opportunities Across Board | ||
| 17.09. | HBM Market Heats Up as Three Giants Clash, with HBM4 at the Center | ||
| 17.09. | Tencent Reportedly Says No Plans for In-House AI Chips, Pledges to Use Domestic Options | ||
| 16.09. | Samsung Reportedly Delays V9 QLC NAND to 1H26 as SK hynix Hits 321 Layers in August | ||
| 16.09. | Kioxia Stock Jumps 70% on NAND Shortage; SK hynix Reaps Stake Gains | ||
| 16.09. | TSMC 2nm Gains Steam: MediaTek Completes First 2nm Tape-Out as Apple Preps A20, M6, R2 | ||
| 16.09. | Intel Completes Altera Stake Sale; Trims 2025 Operating Expense Target to $16.8B | ||
| 16.09. | Silicon Carbide Battle Rekindled by Industry Giants: Wolfspeed, Samsung Make Waves | ||
| 16.09. | Microsoft Uses Micro LED to Build an Analog Optical Computer | ||
| 16.09. | Samsung Reportedly Set to Start Exynos 2600 Mass Production by September's End | ||
| 15.09. | Beijing Says NVIDIA Violated Anti-Monopoly Law, Potential Fines Up to 10% of China Sales | ||
| 15.09. | Western Digital Raises HDD Prices Amid Soaring Demand, Shipping Delays of Up to 10 Weeks | ||
| 15.09. | NVIDIA May Be Among the First to Adopt TSMC A16 for 2028 Feynman Architecture | ||
| 15.09. | NVIDIA Rumored to Ditch SOCAMM1 for Next-Gen SOCAMM2, Opening Door for Samsung, SK hynix | ||
| 15.09. | Amazon Reportedly Cutting Jobs at AWS Greater China, Up to 30% of Staff Affected | ||
| 15.09. | China Opens Analog Chip Dumping Probe Against TI, Broadcom and Others Over 300% Margin | ||
| 15.09. | Infineon Reportedly Set to Build RISC-V Auto MCUs at TSMC Dresden Fab, Mass Production in 2028 | ||
| 15.09. | What Comes After HBM? NAND-Stacked HBF May Power AI's Future |
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