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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 18.07. | Intel Reportedly Drops Hybrid Architecture for 2028 Titan Lake, Go All in on 100 E-Cores | ||
| 18.07. | HBM Prices Reportedly Face Double-digit Drop Risks in 2026, Posing Challenges for SK hynix | ||
| 18.07. | South Korean to Spend USD 350M on Next-Gen iLED Display Tech | ||
| 18.07. | Samsung Reportedly Sends Chip Team to Texas, Sparking Rumors of U.S. Client Deals | ||
| 17.07. | TSMC Accelerates 2nd Arizona Fab Production; Ramp-Up Schedules for Japan, Germany Undisclosed | ||
| 17.07. | TSMC Raises 2025 Sales Growth to 30%, Forecasts 8% QoQ USD Revenue Growth amid Exchange Headwinds | ||
| 17.07. | TSMC Reports Record Q2 Profit, EPS at NT$15.36 Despite Strong Taiwan Dollar | ||
| 17.07. | NAND Flash Price Hikes Reportedly Set for Q3, with Supply Shortage Likely Stretching Into 2026 | ||
| 17.07. | Trump Sets 19% Tariff on Indonesia, Giving Edge to Taiwan's Foxconn, Pegatron | ||
| 17.07. | ASML Confirms First High-NA EUV EXE:5200 Shipment, Reportedly Prepping for Intel's 14A in 2027 | ||
| 17.07. | Korea-Based PNT to Make Inroads in Chip Glass Substrate Field | ||
| 17.07. | NVIDIA Reportedly to Procure Up to 800,000 SOCAMM Modules in 2025 for AI Product | ||
| 16.07. | ASML Warns of Stalled 2026 Growth as Geopolitical Risks Threaten Decade-Long Run | ||
| 16.07. | Ahead of TSMC Earnings: 10 Brokers Weigh in on Q3 Outlook, Currency Pressures, Capex Plans & More | ||
| 16.07. | [Insights] Memory Spot Price Update: Prices Slightly Cool Off After Recent Surge, with DDR4 Leading the Drop | ||
| 16.07. | U.S. Backs MP Materials With Price Guarantees to Curb China's Rare Earth Grip; Apple Locks In Supply | ||
| 16.07. | NVIDIA H20 Sales Restart Sparks Buzz: Likely Inventory Sell-Off; New Blackwell GPU for China Expected | ||
| 16.07. | VITURE Unveiled New Micro OLED XR Smart Glasses | ||
| 16.07. | Hanmi Reportedly Eyes Hybrid Bonders by 2027, Says TC Bonders Sufficient for HBM4, HBM5 | ||
| 15.07. | Marvell Reportedly Taps TSMC's Sub-3nm, Photonics Tech for Next-Gen ASICs | ||
| 15.07. | Malaysia's AI Chip Curbs Shake Server Supply Chains, May Hit Super Micro and Taiwan's Wiwynn | ||
| 15.07. | NVIDIA's China H20 Sales to Resume After U.S. Commitment, Samsung Poised to Gain from HBM3 Supply | ||
| 15.07. | Rare Earth Rush: China's June Exports Reportedly Hit Highest Level Since 2009 | ||
| 15.07. | Apple Rumored to be Developing 7 In-House Chips | ||
| 15.07. | LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028 |
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