Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
30.07. | Sony Reportedly Plans to Sell Communication Chip Division Valued at USD 300 Million | ||
30.07. | Apple to Close China Retail Store for the First Time Amid Market Headwinds | ||
29.07. | NVIDIA Reportedly Adds 300K H20 Orders on China Demand Surge - TSMC, Memory Makers in Focus | ||
29.07. | TSMC's Senior Executive Wei-Jen Lo Retires After 21 Years, Marking Leadership Transition | ||
29.07. | Huawei Led Chinese AI Army to Counter U.S. Curbs with New Model-Chip Alliance | ||
29.07. | Chinese AI Chip Unicorns Enflame, MetaX Unveil Next-Gen Chips Shortly After NVIDIA's H20 Return | ||
29.07. | Samsung to Produce Tesla's AI6 Chips, Escalating 2nm Race with TSMC | ||
29.07. | Micron Unveils First 256Gb Radiation-Hardened Flash Memory with Full Space Certification | ||
29.07. | AMD Killer Switches Sides: Former Intel China President Joins Team Red | ||
28.07. | SK hynix Rumored to Boost 2025 Capex by 30% on 2026 HBM Demand Visibility | ||
28.07. | Mature Node Orders Reportedly to Drop 30% in 2H25-UMC, VIS, PSMC Under Pressure | ||
28.07. | TSMC's Arizona Fab Reportedly Meets Only 7% of U.S. Chip Demand for Now Despite Expansion Push | ||
28.07. | Intel Spins off Network and Edge Unit to Sharpen Focus on Core Strategy After $2.9B Q2 Loss | ||
28.07. | Samsung Scores Massive $17B Foundry Win, Ignites Rumors on Tesla as Potential Client | ||
28.07. | Non-FMM OLED: A Battle among China, Japan, and Korea | ||
28.07. | HBM Hybrid Bonder Demand Reportedly Rising in 2H25, as BESI and ASMPT Eye Growth | ||
25.07. | Intel Earnings Call Highlights: 18A Lifecycle, Product Roadmap, and AI & ASIC Strategies | ||
25.07. | TSMC Reportedly Delays Kumamoto 2nd Fab Launch to 2029 Amid U.S. Expansion Push | ||
25.07. | Trump's Action Plan Drives U.S. AI Effort, with TSMC Arizona Reportedly at Forefront | ||
25.07. | Intel Earnings Call Bombshell: Could Exit Advanced Nodes if 14A Fails, Eyes TSMC Outsourcing Beyond 18A | ||
25.07. | Tesla LED Drive-in Cinema Begins Trial Operation in Los Angeles | ||
25.07. | Samsung Reportedly Weighs Carbon Fiber in Next-Gen Foldable Amid China Supply Risks | ||
24.07. | Tsinghua University Breaks Ground on EUV Photoresist in China's Semiconductor Push | ||
24.07. | Intel Earnings Call Preview: 14A Strategy, Foundry Challenges, and More | ||
24.07. | Trump's AI Action Plan Launches, But Key Details Like Chip Location Verification Remain Unclear |