- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 19.08. | SK hynix Reportedly Builds Silicon Valley HBM Team to Boost Customer Co-Design With U.S. Big Tech | ||
| 19.08. | Korea's Next-Gen OLED Push Gains Steam With LG FLiPP, Samsung Wide View Debuts | ||
| 19.08. | [Insights] Memory Spot Price Update: 3Q DRAM Spot Volumes Seen Staying Low; DDR4 Prices Up 0.67% This Week | ||
| 19.08. | Intel EMIB-T Push Gains Momentum as TSMC CoWoS Crunch Drives Spillover; Unimicron, ASE Stand to Benefit | ||
| 19.08. | Chip Equipment Crunch Reportedly Pushes Lead Times to 24 Months, Giving China's Toolmakers a Boost | ||
| 19.08. | Fujian to Build IC and Optoelectronics Industry Clusters in 15th Five-Year Plan, Targeting RMB 300 Billion in Total Output Value | ||
| 19.08. | ZHITAI Launches Ti600s SSD with YMTC's Xtacking 4.0 QLC NAND, Random Write Performance Up 114% | ||
| 18.08. | Samsung Reportedly Eyes Another Wide Fold for 2027 After Fold8 Success; Memory Costs Still Weigh on Mobile | ||
| 18.08. | CXMT DDR5 Reportedly Tops 9,000 MT/s on AMD Platform, Narrowing Performance Gap With Global Leaders | ||
| 18.08. | MLCC Lead Times Diverge as High-End Products Stretch to 5-10 Months; Tightness May Extend Into 2027 | ||
| 18.08. | NVIDIA Vera Rubin Spillover from HBM to NAND: CMX Fuels TLC Spot Price Rebound from June Dip | ||
| 18.08. | The Second Half of the AR Glasses Race Begins | ||
| 18.08. | Glass Substrate War Heats up: Shinko Electric Advances 22-Layer Product; Samsung Reportedly Faces Ramp-Up Uncertainty | ||
| 17.08. | Samsung, SK hynix 1H26 Chip Facility Investment Up 35%; NVIDIA Not Among Samsung's Top Five Customers | ||
| 17.08. | China Rare-Earth Curbs Send Japan Dysprosium Imports Down 82% in 1H26; Chip Supply Chain Feels Squeeze | ||
| 17.08. | Germany DDR5 Prices Near 5X YoY in August; China Reportedly Sees 14% WoW Jump as Global Rally Continues | ||
| 17.08. | TSMC Arizona Profit Soars 663% YoY in 1H26; U.S. Earnings Pull Back 8.2% QoQ in 2Q as Depreciation Bites | ||
| 17.08. | Vertilite to Build InP Laser Chip Base in China's Changzhou with RMB 5 Billion | ||
| 17.08. | China's Top Two Foundries Hit Capacity Crunch: What's Next for SMIC and Hua Hong's Expansion Plans? | ||
| 14.08. | Samsung May Repurpose R&D Line for Foundry, Targeting 2nm HBM Base Dies for Future NVIDIA Demand | ||
| 14.08. | Nanya Tech Reportedly Eyes Yunlin, Pingtung Fabs for 1d DRAM, Custom Memory, Investment to Top NT$300B | ||
| 14.08. | SMIC 2Q26 Gross Margin Hits 25.3%, Eyes 26%-28% in 3Q as AI Spillover, Pricing Momentum Build | ||
| 14.08. | Sandisk Reportedly Tapes Out First HBF Product, Targets 2027 Samples and 2028 Production | ||
| 14.08. | ZJ InnoLight Subsidiary Takes Stake in PCB Giant Avary Holding | ||
| 14.08. | YMTC Reportedly Invests in SOI Micro, Backing an Alternative Chipmaking Approach Without EUV |
Sie erhalten auf FinanzNachrichten.de kostenlose Realtime-Aktienkurse von und sowie Kurse und Daten von ARIVA.DE AG.