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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11.11. | GlobalFoundries Licenses TSMC's 650V, 80V GaN Tech in Sign of Foundry Leader's Retreat | ||
| 11.11. | SK hynix Reportedly Eyes 321-Layer QLC NAND in 2H26; Future of Solidigm IPO Uncertain | ||
| 11.11. | Intel CTO and AI Chief Departs for OpenAI; CEO Lip-Bu Tan Steps In to Lead AI Push | ||
| 11.11. | Memory Price Surge: Macronix NOR Flash Reportedly +30% in 1Q26, SanDisk NAND Up in Nov. | ||
| 11.11. | SK hynix, Samsung, and SanDisk Bet on HBF - The Next Battleground in Memory Sector | ||
| 11.11. | SK hynix Reportedly Explores High-Bandwidth Storage Stacking NAND and DRAM | ||
| 10.11. | Samsung Reportedly Eyes Feb. 2026 Galaxy S26 Launch; Ultra Model May Stick With Qualcomm | ||
| 10.11. | TSMC CoWoS Capacity Crunch Reportedly Pushes U.S. AI Chipmakers to Powertech Through 2027 | ||
| 10.11. | Micron's New York Megafabs Reportedly Face 2-3 Year Delay, First Now Set for Late 2030 | ||
| 10.11. | TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens | ||
| 10.11. | Samsung LPDDR6 Memory Specs Unveiled: 10.7Gbps Speed on 12nm; Reportedly Eyes 14 Gbps | ||
| 10.11. | Decoding China's Lithography Push to Challenge ASML: From SiCarrier to Alternative EUV Paths | ||
| 10.11. | ASML's Magic Uncovered: Tech and Partners Behind Its EUV Edge China Can't Replicate | ||
| 07.11. | Samsung Vice Chairman Chung Hyun-ho Retires; Permanent Business Support Office Replaces TF | ||
| 07.11. | AMD Flags Intel-NVIDIA Deal Risks; Key Team Blue AI Executive Reportedly Moves to Rival | ||
| 07.11. | SanDisk: NAND Undersupply Extends Beyond 2026 as Customers Seek 2027 Supply | ||
| 07.11. | Google Unveils 7th-Gen TPU Ironwood with 9,216-Chip Superpod, Taking Aim at NVIDIA | ||
| 07.11. | TSMC Reportedly Alerts Clients to 8-10% Sub-5nm Price Hike in 2026, Apple A- & M-Series Chips Affected | ||
| 07.11. | [Insights] China's Chip Equipment Industry Rides 2025 IPO Wave to Boost Localization | ||
| 07.11. | Two New SiC Wafer Fabs Announced New Construction Phase | ||
| 06.11. | Nexperia Refuses to Guarantee China Chip Quality Amid Misconduct, Payment Row | ||
| 06.11. | Japan Ramps Up Photoresist Investment for 2nm Chips - Tokyo Ohka Kogyo, JSR Lead the Charge | ||
| 06.11. | SoftBank Reportedly Explored Marvell Deal; Talks Fell Through but Interest Might Resurface | ||
| 06.11. | Qualcomm Expects to Supply 75% of Galaxy S26 amid Samsung's Exynos Comeback Drive | ||
| 06.11. | China's Memory Market Reportedly Sees Daily Price Hikes; 16GB DDR4 Module Soars 160% in October |
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