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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 01.12. | Samsung Reportedly Supplies 60%+ of Google TPU HBM3E, Set to Remain Primary Supplier in 2026 | ||
| 01.12. | Intel Gains Momentum: 18A Eyes Apple, EMIB Reportedly Tapped for Google-MediaTek TPUs | ||
| 01.12. | Gold and CCL Price Surge Squeezes Substrate Makers as AI Fuels Demand for High-Value PCBs | ||
| 01.12. | Onsemi to Receive €450M Government Grant for Advanced SiC Power Device Fab in Czech Republic | ||
| 28.11. | Nittobo Expands Glass-Fiber Output with Nan Ya; Nan Ya to Handle 20% by 2027 Amid AI Surge | ||
| 28.11. | NVIDIA Might Stop Bundling VRAM with GPUs amid Memory Crunch, Squeezing Smaller Board Partners | ||
| 28.11. | Korean Researcher Says HBM9 Could Arrive in 2040, With Performance Said to Reach 60× HBM4 | ||
| 28.11. | Tantalum Capacitor Rally on AI: Panasonic Reportedly Hikes 15-30%, Yageo Rides Wave | ||
| 28.11. | Baidu Reportedly Launches Its Biggest Layoffs in Years as It Overhauls Its AI Business | ||
| 28.11. | U.S., Japan Rumored Mulling Joint NAND Fab, with Kioxia, SanDisk Likely In | ||
| 28.11. | Hong Kong Reportedly Joins Silicon Race with RISC-V Data Center Chip, Eyes 1Q26 Mass Production | ||
| 28.11. | Samsung Reportedly Unveils NAND Tech to Cut Power by 96% amid Research Unit Shake-Up | ||
| 27.11. | China Presses EU to Step In on Nexperia, Reiterates Discontent with the Dutch | ||
| 27.11. | China's Zhonghao Xinying Claims TPU 1.5× Faster than NVIDIA A100 Amid Google TPU Buzz | ||
| 27.11. | Samsung Reportedly Targets HBM4 Price Parity with SK hynix Amid Strong NVIDIA Demand | ||
| 27.11. | AI Memory Showdown: SK hynix Unveils 48 Gb/s GDDR7 and LPDDR6; Samsung Showcases HBM4 | ||
| 27.11. | Intel Stands Firm on Lo Hire Amid TSMC Trade Secret Dispute: CEO Vows Support, Dismisses Claims | ||
| 27.11. | GlobalFoundries Moves on GaN: TSMC and Navitas Ties Position U.S. as New GaN Production Hub | ||
| 27.11. | 64GB DDR5 RAM Reportedly Now Pricier Than a PlayStation 5 Amid Soaring Memory Costs | ||
| 26.11. | Beyond Ex-VP Lo, Intel Is Reportedly Poaching TSMC Arizona Engineers With 20-30% Higher Salaries | ||
| 26.11. | South Korea's HBM Lead Reportedly Under Strain as TSMC and Adeia Dominate Hybrid Bonding IP | ||
| 26.11. | Huawei Launches New Mate 80 Series with Kirin 9030, Rumored 7nm 9-Core Chip With 35% Gain | ||
| 26.11. | Rapidus Reportedly Eyes 2029 1.4nm Production with 2nd Hokkaido Fab to Catch Foundry Giants | ||
| 26.11. | SiC Raw Materials See a Price Increase While 6-Inch Substrate Kicks off a Price War | ||
| 26.11. | Memory Boom in China Reportedly Spurs Opportunities for Korean Makers Hanmi, SEMES |
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