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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 31.07. | ASE Again Raises 2026 CapEx to Record US$10.5B; Eyes 2x Leading-Edge Advanced Packaging Revenue by 2027 | ||
| 31.07. | TSMC Reportedly Develops EMIB-like Packaging with Kinsus to Prevent Potential Customer Shift to Intel | ||
| 31.07. | Israel Reportedly Withdraws $425M Intel Grant as Kiryat Gat Expansion Remains Uncertain | ||
| 31.07. | Samsung to Start Taylor Fab 2 Build by End-2026, Targets 2030 Mass Production; Eyes 1.4nm Expansion | ||
| 30.07. | Ahead of Cook's Final Apple Earnings Call: Rising Memory Costs and Potential Sep. iPhone Price Hike in Focus | ||
| 30.07. | Samsung Targets 60-70% Capacity Under LTAs; Five Key Customers Reportedly Include AWS, Microsoft, Google | ||
| 30.07. | TSMC's 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028 | ||
| 30.07. | Samsung's DS Unit Delivers 99.7% of Q2 Profit amid Memory Boom; HBM4 Revenue Reportedly to Triple in Q3 | ||
| 30.07. | Mass Production and Capacity Expansion Accelerate, Reshaping the Foundry Landscape in Silicon Photonics | ||
| 30.07. | Intel Reportedly to Cut 103 Jobs in Mid-August After DCAI Layoff News Emerges | ||
| 29.07. | Samsung Electro-Mechanics Lifts MLCC Prices 30% Starting Aug. 1; Taiyo Yuden Reportedly Eyes Sept. 1 Hike | ||
| 29.07. | [Insights] Memory Spot Price Update: DRAM Spot Prices Rise Slightly as DDR3, DDR4 and DDR5 Inquiries Pick Up | ||
| 29.07. | U.S. Unveils Bans Targeting Chinese Robots, Power Inverters; Unitree, Sungrow Poised to Be Hit | ||
| 29.07. | 7.1 Kumamoto Earthquake: TSMC Confirms JASM Safe; TEL Halts Plants as Chip Supply Chain Assesses Impact | ||
| 29.07. | SK hynix Posts Record 2Q Results but Misses Estimates Reportedly Due to Conservative Pricing; Completes 10 LTAs | ||
| 29.07. | Chinese Advanced Packaging Firms Kicks-Start a New Round of Capacity Expansion | ||
| 29.07. | China's Semiconductor Sector Attracts Billions in Industrial Investment Funds | ||
| 28.07. | China's Lens, BOE Advance Glass Substrates as Taiwan's Supply Chain Prepares for TSMC's CoPoS | ||
| 28.07. | NVIDIA Reportedly Halves Vera Rubin SOCAMM Capacity as Memory Costs Near 29% of System BOM | ||
| 28.07. | China Reportedly Mass-Produces Immersion DUV Tools; SMIC, Hua Hong, CXMT Deliveries Expected This Year | ||
| 28.07. | Shenzhen Adds Two RMB 10-Billion Semiconductor Projects Targeting AI Servers and 12-Inch Wafers | ||
| 28.07. | Samsung Display Revives Asan OLED Expansion Plan with KRW 67 Trillion | ||
| 27.07. | Q2 Memory Earnings Preview: What to Watch From Samsung, SK hynix, and Kioxia | ||
| 27.07. | CXMT's 471% STAR Debut Makes It China's Top Listed Firm, Reshaping Global Memory Dynamics | ||
| 27.07. | TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom |
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