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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 13.01. | Meizu Reportedly Scraps Meizu 22 Air as Memory Costs Drive Price Hikes Across Chinese Brands | ||
| 13.01. | SK hynix to Build Cheongju Advanced Packaging Fab, Boosting HBM Output by 2027 | ||
| 13.01. | SK hynix May Stick With MR-MUF for HBM4 16-High Despite ASMPT TC Bonder Orders | ||
| 13.01. | TSMC Reportedly Plans 5 More Fabs in Arizona Under U.S. Trade Deal, Investment Could Top $100B | ||
| 13.01. | Chinese Research Team Achieved New Advances in Lithographic Manufacturing Technology | ||
| 13.01. | LG Reportedly Delays Glass Substrate Commercialization to 2030 on Demand Uncertainty | ||
| 12.01. | China's Domestic Chip Equipment Adoption Beats 2025 Target at 35%, Led by NAURA, AMEC | ||
| 12.01. | Micron Reportedly Sees Memory Crunch Through 2028; OEMs Keep Consumer Reach Despite Crucial Exit | ||
| 12.01. | TSMC May Reallocate Select 45-90nm Mature-Node Capacity to CoWoS-Related Production | ||
| 12.01. | Memory OSAT Prices Reportedly Jump 30%, Led by Powertech, Micron's Key Supplier | ||
| 12.01. | Leather Tycoon Eyes Hong Kong-Based Wide-Bandgap Hub, Moves to Acquire Power Chip Firm | ||
| 12.01. | China's Iluvatar CoreX Reportedly to Unveil 2026-28 GPU Roadmap, Targeting NVIDIA H200, B200 | ||
| 09.01. | NVIDIA Fuels HBM4 Race: 12-Layer Ramps, 16-Layer Push by SK hynix, Samsung, and Micron | ||
| 09.01. | Tokyo Electron Reportedly Raises FY26 CapEx 48% to Record High, Bets on DRAM Etching Demand | ||
| 09.01. | Apple Hardware Chief John Ternus May Become Next CEO as Board Reportedly Prepares for Transition | ||
| 09.01. | TSMC Reportedly Plans Mature-Node Tool Shift to Singapore, Accelerates Exit as Arizona Expands | ||
| 09.01. | Moutai, Guoxin Micro, Empyrean Set up New Firms Related to IC Manufacturing | ||
| 09.01. | China Opens Anti-Dumping Investigation into Key Chip Material Dichlorosilane from Japan | ||
| 08.01. | NVIDIA Reportedly Tightens H200 Payment Terms Despite Possible Q1 Approval from China | ||
| 08.01. | China Memory Buyers Reportedly Fade as a Box of DDR5 Is Said to Cost as Much as a Shanghai Home | ||
| 08.01. | TSMC Reportedly Suspends New 3nm Kick-offs, Steers Customers to 2nm to Optimize Costs | ||
| 08.01. | Micron to Break Ground on U.S.'s Largest Chip Plant in New York on Jan. 16 After Years of Delays | ||
| 08.01. | Samsung's Q4 Profit Soars 208% to Record 20 Trillion Won on Memory Rally and Foundry Turnaround | ||
| 08.01. | China Foundry Push Accelerates with Nexchip RMB 35.5B Phase IV, Hua Hong's RMB 8.2B Deal | ||
| 08.01. | 2025 China Chip IPO Surge: 30 A-Share Filings Target Nearly RMB 100B; HK Listings Accelerate |
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