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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 19.12.25 | U.S. Council: NVIDIA-Huawei AI Chip Gap Could Reach 17× by 2H27, Yet H200 Exports Risk Aiding China | ||
| 19.12.25 | China's Chipmaking Tool Giant AMEC Eyes Sizone Acquisition to Broaden CMP Equipment Reach | ||
| 19.12.25 | Chinese GPU Makers Pick up Pace in Going Public | ||
| 19.12.25 | China's EDA Firm Empyrean Commits RMB 100M to Investment Fund, Takes 7.78% Stake in S2C | ||
| 18.12.25 | TSMC Reportedly Accelerates Arizona 2nd Fab, Eyes 3Q26 Tool Install, 2027 3nm Production | ||
| 18.12.25 | Micron Reveals Three Culprits Behind Memory Crunch-and Why It Won't Ease Soon | ||
| 18.12.25 | SOCAMM2 War Heats Up: Samsung Reportedly Delivers Samples to NVIDIA, Ramping Early 2026 | ||
| 18.12.25 | China Reportedly Builds EUV Prototype Using Older ASML Components, Eyes 2028 Chipmaking | ||
| 18.12.25 | Micron Hikes CapEx to $20B with 2026 HBM Supply Fully Booked; HBM4 Ramps 2Q26 | ||
| 18.12.25 | Apple Reportedly to Bring WMCM Packaging to A20 Series, Boosting iPhone 18 Thermal Efficiency | ||
| 18.12.25 | Meta Reportedly Taps Korea's Sapien Semiconductors for Micro LED AR Glasses Backplanes | ||
| 17.12.25 | Murata Reportedly to Mass Produce AI Server Power Modules in 2026, Targets ¥50B by FY27 | ||
| 17.12.25 | Rapidus Reportedly to Unveil Glass Substrate Interposer Prototype, Eyes 2028 Production | ||
| 17.12.25 | Apple Reportedly Pushes In-House AI Chip, Eyes 2027 Server Deployment; Foxconn to Gain | ||
| 17.12.25 | Kingston Warns NAND Prices Have Surged 246% Since Early 2025, Signals More Price Hikes Ahead | ||
| 17.12.25 | European Commission Approves EUR 623M in German State Aid to Support Construction of Two Chip Fabs | ||
| 17.12.25 | Samsung Unveils Sub-10nm DRAM Breakthrough with InGaO, Reportedly Eyes 0a/0b Adoption | ||
| 16.12.25 | Intel Completes First 2nd-Gen High-NA EUV Acceptance Testing; ASML Eyes 2027-28 Mass Production | ||
| 16.12.25 | Samsung Reportedly Denies Plans to Halt Consumer SATA III SSDs Amid Tight NAND Supply | ||
| 16.12.25 | Acer and ASUS Reportedly to Pass Surging Memory Costs to PCs in 1Q26, Hot on Dell's Heels | ||
| 16.12.25 | Intel Appoints Trump Official as Senior VP of Government Affairs, Deepening Washington Ties | ||
| 16.12.25 | SK hynix, Samsung Reportedly Deliver Paid HBM4 Samples to NVIDIA Ahead of 1Q26 Contracts | ||
| 16.12.25 | South Korea to Pour KRW 700 Trillion in Future Chip Industry | ||
| 16.12.25 | China A-Share Firms Reportedly Scrap 20+ M&A Deals in Nov-Dec; Chip Sector Impacted | ||
| 15.12.25 | Dell Reportedly Plans 10-30% Hikes on Commercial PCs From Dec. 17 as Memory Prices Surge |
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