- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 23.02. | [Insights] The AI Memory Squeeze: Why Japan's Consumer Electronics Face a New Reality | ||
| 20.02. | [Insights] AI-Driven Memory Boom Ripples Through Hardware Markets, From Price Hikes to Product Delays | ||
| 20.02. | China Reportedly Ramps Up Chip Tool Push, Sets 70% Target by 2027; SMEE, NAURA at Forefront | ||
| 19.02. | Japanese Paper Maker Oji Holdings Reportedly Develops EUV Photoresist for 2nm Chips | ||
| 19.02. | Apple Foldable Rumors Roundup: Tougher Screen Layer, Crease-Free Display, and Massive Battery | ||
| 18.02. | Breaking HBM Barriers: Samsung's zHBM vs. Intel's Z-Angle Memory | ||
| 18.02. | Japan's Chip Push in Spotlight: IBM Backs Rapidus as Funding Momentum Builds | ||
| 17.02. | After Foldables, Are 7-Inch Phones Coming Back? Huawei, vivo Reportedly Eye Bigger Displays | ||
| 17.02. | SK hynix, Samsung Showcase LPDDR6 at ISSCC as Qualcomm Reportedly Eyes Samsung's LPDDR6X | ||
| 16.02. | ASML's High-NA EUV for 2027-28: Which Giants Are Betting Big-Intel, Samsung, SK hynix or TSMC? | ||
| 16.02. | Rising Costs and Demand Drive China's LLM Price Jump: Zhipu GLM-5 Hikes 30% in First 2026 Increase | ||
| 13.02. | NVIDIA May Relax HBM4 Specs as Samsung and SK hynix Reportedly Face Capacity, Yield Limits | ||
| 13.02. | Kioxia Posts Record ¥543.6B Q3 FY25 Revenue, Confirms 2026 NAND Fully Booked | ||
| 13.02. | Applied Materials Guides April Quarter Above Estimates; Sees 20%+ Semi Growth in 2026, DRAM Leads | ||
| 13.02. | DeepSeek Expands Context Tenfold as Zhipu Rolls Out New Model in China's AI Race | ||
| 13.02. | Intel Reportedly Backs Out of 300mm Wafer Deal With Tower; Production Could Move to Japan | ||
| 12.02. | Samsung Delivers First-Ever Commercial HBM4, Boosting Speeds from 11.7 Gbps to 13 Gbps | ||
| 12.02. | US Reportedly Hits Applied Materials with $252M Penalty for Illegally Sending Chip Equipment to SMIC | ||
| 12.02. | Panel Maker Innolux Fab 5 Reportedly Eyed by ASE, OSAT Firms - Micron Out of Picture | ||
| 12.02. | Samsung Galaxy S26 Launch Feb. 25 Reportedly with Exynos 2600, Snapdragon; Memory Costs Hit Pricing | ||
| 12.02. | Micron Dismisses Sidelined Rumors, Confirms HBM4 Shipping a Quarter Early, Speeds Over 11 Gbps | ||
| 12.02. | MediaTek Ventures into Micro LED Optical Communication | ||
| 12.02. | SK hynix Unveils AI Chip Architecture with HBF, Reportedly Boosts Performance per Watt by Up to 2.69× | ||
| 11.02. | [Insights] Memory Spot Price Update: Lunar New Year Slows DRAM Spot Trading; Price Gap Narrows | ||
| 11.02. | First Look at ZAM: SAIMEMORY Unveils Vertical Memory at Intel's Japan Event |
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