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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 21.04. | Intel-Backed Firm Breaks Ground on India's 1st 3D Packaging Plant, Targeting ~70K Glass Substrates Annually | ||
| 21.04. | China Memory Expansion Lifts Domestic Equipment Suppliers: AMEC, Wuhan Jingce, Hwatsing, ACM in Focus | ||
| 20.04. | Huawei Unveils Pura 90 Pro Max with HyperSpace Memory, 12GB RAM Said to Match 16GB Performance | ||
| 20.04. | Chinese LED Leader Sanan's $239M Acquisition of Dutch Firm Lumileds Falls Through Amid U.S. Pushback | ||
| 20.04. | Germany DDR5 Prices Rise in April, Reportedly Led by 48GB Modules with Strongest Gains | ||
| 20.04. | Intel Foundry Said to Boost Equipment Orders by 50%+ YoY; 14A May Draw Major Customers by Year-End | ||
| 20.04. | SK hynix Starts Mass Production of 192GB SOCAMM2, Tapping 1c DRAM and NVIDIA Rubin Optimization | ||
| 20.04. | Samsung Electro-Mechanics and LG Innotek Step Up CPO Push, Reportedly Testing Substrate Component Samples | ||
| 20.04. | Semiconductor Packaging and Testing Capacity Race Intensifies as ASE, Samsung and Amkor Announced New Moves | ||
| 17.04. | Intel Recruits 30-Year Samsung Foundry Veteran with Sales Expertise to Drive Customer Growth | ||
| 17.04. | UMC Set to Hike Prices in 2H26, Pricing Tied to Mix, Capacity and Long-Term Deals | ||
| 17.04. | Samsung's Taylor Fab Reportedly Nears 90% Readiness as Tesla Chip Push Advances; LPDDR6 Ties Emerge | ||
| 17.04. | U.S. Reportedly Considers Softening Proposed China Chip Tool Bill, but Still Includes Curbs on ASML DUV | ||
| 17.04. | NVIDIA H100 Rentals in China Reportedly Up 20%-30% as Token Demand Surges, H-Series Also Rises | ||
| 17.04. | M&A in Optical Communications Field: Credo to Acquire DustPhotonics | ||
| 17.04. | Beyond Helium, 8 Material Risks May Hit Korea's Chip Supply Chain; Israeli Bromine Imports at 97.5% | ||
| 16.04. | TSMC Says CoWoS Offers Industry's Largest Reticle-Size Packaging Amid Intel EMIB Rivalry; CoPoS Advances | ||
| 16.04. | TSMC on Terafab: No Shortcuts in Foundry; Reportedly Confirms Next-Gen NVIDIA LPU Project amid Samsung Rivalry | ||
| 16.04. | TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 | ||
| 16.04. | TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%-67.5%, Capex at Top End of $52-56B | ||
| 16.04. | TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% | ||
| 16.04. | Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 | ||
| 16.04. | TSMC 1Q Profit Seen Up ~50% to Record; Meta-Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 | ||
| 16.04. | San'an Announced Three Advances in Optical Communications Business | ||
| 16.04. | Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited |
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