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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 08.09. | Tesla Reportedly Advances In-House Chip Plans as Musk Hails AI5 Design Review | ||
| 08.09. | Apple Watch Ultra Reportedly Chooses Taiwan's MediaTek for 5G Modems in Landmark Supply Win | ||
| 08.09. | [Insights] Panel Prices in Early September: TV Expected to Hold Steady Amid Year-End Demand Prep | ||
| 08.09. | SK hynix May Secure NVIDIA HBM4 Deal by Sep., Samsung Reportedly Trails in Testing | ||
| 05.09. | China's Chip Tool Maker SiCarrier Reportedly Hits RMB65B Valuation, Secures Billion-Yuan Orders | ||
| 05.09. | Intel Reportedly Sets 2026 as Key Test for 14A, But Might Rely on TSMC "Forever" | ||
| 05.09. | NVIDIA-MediaTek GB10 Collaboration Fuels $73B Acquisition Rumor-Why It May Not Happen | ||
| 05.09. | Apple Reportedly Plans iPhone 17 Price Hike, Potentially Cutting Entry-Level Pro | ||
| 05.09. | Broadcom Reportedly Secures $10B Custom AI Chip Order from New Client, Lifts 2026 AI Sales Forecast | ||
| 05.09. | TSMC to Implement a Significant Price Hike | ||
| 05.09. | Huawei's Bold Return: Mate XTs Debuts Kirin 9020 After Four Years of Chip Silence | ||
| 04.09. | Chinese Cloud Giants Reportedly Pursue NVIDIA's H20 Despite Pressure, Eye B30A as Good Deal | ||
| 04.09. | Xiaomi Reportedly Plans XRING O2 for 2026, Staying With TSMC's 3nm Rather Than 2nm | ||
| 04.09. | Resonac Teams up with Applied Materials, TEL and Other Chip Giants on Panel-level Interposers | ||
| 04.09. | Google Reportedly Courts Smaller CSPs to Host TPUs, Taking Aim at NVIDIA | ||
| 04.09. | Samsung Reportedly Plans Exynos 2600 in Galaxy S26 Models, Reducing Qualcomm Reliance | ||
| 04.09. | China's Chip Industry Surges in 1H25 - 38 A-Share Listed Firms Reportedly Post Growth | ||
| 04.09. | First Intel 18A-Based Panther Lake Laptop Unveiled: Acer Leads with 16-Inch Ultralight Model | ||
| 03.09. | Intel Loses Silicon Photonics Lead to TSMC as Patent Filings Reportedly Plummet Since 2023 | ||
| 03.09. | Alibaba's Ant Group, ByteDance Back InnoStar, Boosting China's Memory Chip Drive | ||
| 03.09. | [Insights] Memory Spot Price Update: DDR4 Prices Outpace DDR5 as Memory Giants' EOL Impact Lingers | ||
| 03.09. | SK Hynix Leads the Pack to Introduce ASML's High-NA EUV System for Memory Production | ||
| 03.09. | US to End TSMC Nanjing Waiver by End-2025: Decoding the Impact on the Foundry and Supply Chain | ||
| 03.09. | San'an Announced 8-inch SiC Chip Production Line Commissioning Completed | ||
| 03.09. | Nikon Reportedly Aims Doubled Wafer Alignment Sales by FY27 as 3D Stacking, Wafer Bonding Rise |
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