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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 29.05. | From 800 VDC to GPU Core: Innoscience All-GaN Technology Provides Key Solutions to High-Density AI Power Delivery for the NVIDIA MGX Ecosystem | ||
| 29.05. | TSMC Says Energy Efficiency Is Emerging as a Higher Priority Than Computing Power in AI Chip Design | ||
| 29.05. | MediaTek CEO Reaffirms TSMC as Key Long-Term Partner amid Samsung's Reported Push for Foundry Orders | ||
| 29.05. | NVIDIA Jensen Huang Calls Huawei's Tau Scaling Law a Breakthrough, But Sees No Challenge to TSMC | ||
| 29.05. | Samsung Starts Shipping Industry-First HBM4E Samples 3 Months After HBM4 Ramp; Performance Up 20%+ | ||
| 29.05. | AIXTRON Received Multiple Orders from Lumentum Due to AI Optical Communication Boom | ||
| 29.05. | Chinese Researchers Produced SiC Epitaxial Film over 300µm in Thickness | ||
| 28.05. | ByteDance Reportedly Develops In-House CPUs Amid Supply Tightness; Explores Both Arm and RISC-V | ||
| 28.05. | Broadcom Partners With FuriosaAI on 2nm AI Chip Reportedly Made by TSMC; Sampling Expected in 1H28 | ||
| 28.05. | Intel Reportedly to Adopt Silicon Capacitors in 2027 to Improve EMIB Power Stability for Google's v8e | ||
| 28.05. | Peking Univ. Unveils EDA for Huawei LogicFolding; Kirin 2026 Reportedly Eyes 3nm-Class Performance | ||
| 28.05. | Foldable iPhone Case Leak: Early Design Hints at Key Hardware Specs - Dual Cameras and Slim Profile | ||
| 28.05. | US AI Firm Fabric.AI to Demonstrate Micro LED Optical Interconnect Platform by Late 2026 | ||
| 28.05. | UMC Reportedly to Raise Prices Selectively in 2H26, with Broader and Potentially Larger Increases in 2027 | ||
| 27.05. | Infineon Announces Second 2026 Price Hike Effective July 1 Amid Rising Supply Chain Costs, Strong Demand | ||
| 27.05. | [Insights] Memory Spot Price Update: DDR5 Spot Price Gains Narrow Amid Sluggish Trading; DDR4 Rebounds | ||
| 27.05. | TSMC Reportedly Eyes Up to 15% 3nm Price Hike in 2H26, Further 5%-10% Seen in 2027 Amid AI, ASIC Demand | ||
| 27.05. | Inside Micron's $1 Trillion Market Cap Leap: A Global Fab Expansion Overview Across the U.S. and Asia | ||
| 27.05. | China Reportedly Tightens Overseas Travel Rules for AI Talent at Private Firms Like Alibaba and DeepSeek | ||
| 27.05. | Chinese Equipment Maker Achieves Breakthrough in SiC Laser Lift-Off Technology | ||
| 27.05. | China's Chip Push Extends Beyond State Efforts, From Xiaomi's 3nm SoC to NIO Autonomous Driving Chips | ||
| 26.05. | China's Unitree Robotics Reportedly Posts 52% YoY Q1 Profit Slump Ahead of 4.2 Billion Yuan IPO Review | ||
| 26.05. | Rapidus Reportedly Taps Lam Research Panel-Level Packaging System for 600mm Square Glass Interposer Push | ||
| 26.05. | Alchip Says Key Customer's AI Chip Enters Mass Production in May; ASICs Seen Outpacing GPU CAGR | ||
| 26.05. | Intel Reportedly Eyes World's First Glass Substrate Output at Rio Rancho; Offers Silicon Photonics to Customers |
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