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Aktuelle News von TrendForce

  • 24 h
  • letzte 200 News
ZeitAktuelle Nachrichten
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12.03.Meta's In-House AI Chip Push: Four New Accelerators Gear Up Amid Memory Crunch by 2027
12.03.Chinese Scientists Advances Lithium Tantalate-Silicon Nitride Heterogeneous Integrated Photonic Chips
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11.03.China IC Exports Hit 304.7B Yuan in Jan-Feb 2026, Up Nearly 70% as AI Lifts Mature-Node
11.03.NVIDIA Reportedly May Revive RTX 3060 on Samsung 8nm Amid China Curbs, TSMC Constraints
11.03.Applied Materials Teams Up with Micron, SK hynix for Next-Gen DRAM, HBM and NAND Development
11.03.Micro LED CPO Goes Viral and Several LED Companies Reveal Development Progresses
11.03.China's Lisuan to Launch 6nm Gaming GPU on March 12, Targeting NVIDIA RTX
10.03.Chinese Smartphone Price Hikes Begin; OPPO Adjusts From Mar. 16, Reportedly Up to ¥500
10.03.Samsung Groq Orders May Jump ~70% to 15K Wafers; Tesla Reportedly Delays Other Foundry Clients
10.03.Nexperia China Reportedly Launches 12-inch Chip Production, Defying Dutch Parent
10.03.SK hynix Develops 1c LPDDR6 DRAM with 33% Speed Gain, 20% Power Savings; Ships in 2H26
10.03.ROHM Secures GaN Technology License from TSMC, to Build Production Line by 2027
10.03.Beyond HBM: Samsung, SK hynix Reportedly Explore Next-Gen AI Memory That Could Challenge NVIDIA
09.03.Texas Instruments Reportedly Set to Raise Prices Again from April 1, Hikes Could Reach 85%
09.03.Apple Reportedly Boosts iPhone Fold Inventory Build 20% Amid Strong Confidence, Lifting Foxconn, TSMC
09.03.NAND Giant YMTC Reportedly Debuts First Commercial PCIe 5.0 SSD Using In-house Xtacking Flash
09.03.Middle East Energy Turmoil Raises Chip Risks, Spotlight on TSMC Power Use and Bromine for DRAM
09.03.Samsung, SK hynix Reportedly Tapped as NVIDIA Rubin HBM4 Suppliers; Shipments Could Start in March
09.03.Beyond Computing Power: AI Hardware Selection as a New Enterprise Challenge
09.03.China GPU Race Intensifies: Cambricon Turns Profitable in 2025; Moore Threads, MetaX Narrow Losses
09.03.Samhwa Paint Enters Semiconductor Materials with Melt Master Batch in Samsung AP Packaging