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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 03.09. | AUO Sells Singapore Plant to Western Digital for NT$8.75B Amid Shift to Advanced Packaging, Micro LED CPO | ||
| 03.09. | TSMC Equipment Demand Reportedly Jumps 90% in Just Over Half a Year; Substrate Capacity Faces AI Squeeze | ||
| 03.09. | Broadcom Targets $115B AI Revenue in FY27, Nearly 2X FY26; Singapore Fab to Ease Key Substrate Bottleneck | ||
| 03.09. | InP Gains Traction: Sumitomo Initiates Epitaxial Wafer Mass Production, Wuhan Tianyuan Enters Market | ||
| 03.09. | China's Chip Tool Push: AMEC Expands 3D Memory Equipment; Wellrun Targets Key Metrology Gap | ||
| 02.09. | Google Says Memory Tops 75% of Server BOM; TPU-Software Dual Strategy Targets Memory Wall | ||
| 02.09. | China's DUV Could Reach High-Volume Production in 2-5 Years; EUV Reportedly Unlikely Within a Decade | ||
| 02.09. | [Insights] Memory Spot Price Update: DDR5, DDR4 Demand Weakens, but Firm Supplier Quotes Support Elevated Prices | ||
| 02.09. | TSMC Eyes Chip-Level Microchannel Cooling as AI System Power Could Rise 6× in Five Years | ||
| 02.09. | SK hynix's China eSSD Business Hits Turning Point as Intel NAND Deal Restrictions Near Expiry by End-2026 | ||
| 02.09. | RF Chipmaker Maxscend Announces Strategic Expansion into Optical Interconnects | ||
| 02.09. | SK hynix Reportedly Weighs Japan Memory Plant; U.S. Pressure, Korean Approval Could Complicate Plans | ||
| 01.09. | Samsung Unveils Memory Roadmap at SEMICON: HBM5 Targets 2× HBM4E Performance, zHBM 8× Boost | ||
| 01.09. | Intel CFO Says 14A Defect Reduction Fastest Since 22nm; Customer Talks Reportedly Grow Ahead of 2028 Ramp | ||
| 01.09. | ASML Advances High-NA EUV Toward HVM as 10 Systems Reportedly Go Live at 4 Customers | ||
| 01.09. | HBM3E Spot Prices Said to Be 4-5× LTA Levels, with Samsung Reportedly Locking 70% of Capacity Through 2031 | ||
| 01.09. | NVIDIA's First Investment in a Taiwan-Listed Firm in Spotlight: What the MediaTek Deal Means for the AI Race | ||
| 01.09. | JSG Achieved Breakthrough in 12-inch SiC Crystal Growth | ||
| 01.09. | MediaTek Ramps Up Advanced Packaging Push as TSMC Veteran Shang Hou Calls for More Talent | ||
| 31.08. | TSMC: SoIC, CoWoS Drive 50× Compute by 2029; Silicon Photonics to Top 50% of Transceiver Market by 2027 | ||
| 31.08. | SK hynix Reportedly Weighs Intel for HBM4E Base Dies amid TSMC Cost Pressure and Supply Diversification | ||
| 31.08. | SEMICON Taiwan Highlights AI Infrastructure, CPO; Google AI Chief Technologist to Make Asia Keynote Debut | ||
| 31.08. | CXMT Gross Margin Hits 87% in Q2 to Rival Memory Giants, as LPDDR6 Mass Production Reportedly Begins | ||
| 31.08. | Powertech Plans NT$70B Push for World's First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC | ||
| 31.08. | Intel's Advanced Packaging, Led by EMIB-T, Reportedly Set to Hit Its Stride in 2029; DRAM Manufacturing Ruled Out |
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