| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 27.02. | March Price Wave Looms Amid Memory Crunch: Lenovo, Acer, Samsung, Chinese Phone Makers in Action | ||
| 26.02. | Meizu Reportedly Eyes March Smartphone Exit After Scrapping Launch Amid Memory Costs Surge | ||
| 26.02. | Apple Reportedly Eyes Chinese Memory as Leverage Against Samsung, SK hynix Amid Rising Costs | ||
| 26.02. | Samsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAM | ||
| 26.02. | SK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030 | ||
| 26.02. | Memory Giants' HBM Cleanroom Race: Samsung & SK hynix Fast-Track, Micron Acquires | ||
| 26.02. | China's Chip Materials Drive Intensifies as Photoresist Leader Red Avenue Seeks Hong Kong IPO | ||
| 25.02. | Xiaomi Doubles Down on Chips; Trademark Filing Reportedly Signals Potential Memory Entry | ||
| 25.02. | SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration | ||
| 25.02. | China Reportedly Aims to Boost 7nm, 5nm Output Fivefold in Two Years, Driven by SMIC, Hua Hong | ||
| 25.02. | NVIDIA GTC 2026 in Focus: Feynman Reportedly on TSMC A16, Samsung & SK hynix to Showcase HBM4 | ||
| 25.02. | MediaTek CEO Flags Memory as One of XPU Bottlenecks, Now Making Up 50% of Costs | ||
| 25.02. | South Korean Fabless Sector Hit by 2025 Losses as AI Lifts Foundry Costs and China Competition Grows | ||
| 24.02. | NVIDIA, Apple Reportedly Court Korean HBM, NAND Talent with Six-Figure Pay Amid AI Memory Boom | ||
| 24.02. | Samsung Electro-Mechanics Reportedly Weighs Double-Digit MLCC Price Hike in April Amid AI Demand | ||
| 24.02. | Apple Reportedly Brings Mac Mini Back to U.S., Taps Foxconn for Assembly Later in 2026 | ||
| 24.02. | ASML Reportedly Demonstrates EUV Light Source That Could Lift Chip Output 50% by 2030 | ||
| 24.02. | Japan Reportedly Offers Half-Cost Fabs and Full Subsidies, Yet Samsung and SK hynix Stay Cautious | ||
| 24.02. | [Sponsored Content] NVIDIA Jetson in Action: How Advantech and AIRECO Are Rewriting the Rules of Recycling with AI | ||
| 24.02. | Lenovo Reportedly Signals March Price Hikes on Select Commercial Devices Amid Memory Shortage | ||
| 23.02. | Samsung Reportedly Lifts Galaxy S26 Ultra 1TB 20% on Memory Costs, Entry Model Up 5.8% | ||
| 23.02. | TSMC Speeds up Expansion in Taiwan: up to 10 Fabs Reportedly under Construction or Starting in 2026 | ||
| 23.02. | PSMC Joins Intel, SoftBank's ZAM Initiative to Manufacture AI Memory, Eyeing an Alternative to HBM | ||
| 23.02. | Global DDR5 Pricing Update: Europe Reportedly Eases, China's KingBank 32GB Hits Premium Tier | ||
| 23.02. | Cold LED Screens Gain Traction, with LED Driver ICs put to the Limelight |