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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 16.01. | U.S. Commerce Secretary Lutnick Reportedly to Attend Micron's $100B Clay Fab Groundbreaking | ||
| 15.01. | TSMC Addresses Speculations of a 20% Wafer ASP Increase, Says Price Is Not the Main Profit Driver | ||
| 15.01. | TSMC Flags Significantly Higher Capex Over Next 3 Years; Arizona 4th Fab, Packaging Site in Works | ||
| 15.01. | TSMC Q1 Revenue Guidance Hits $35.8B, Up 38% YoY; Unveils Record $56B Capex for 2026 | ||
| 15.01. | OpenAI Reportedly to Deploy Custom AI Chip on TSMC N3 by End-2026, Second-Gen Planned for A16 | ||
| 15.01. | TSMC 2025 Q4 Net Profit Soars 35% YoY to Record NT$505.7B, EPS Hits NT$19.5 | ||
| 15.01. | Trump Targets NVIDIA H200, AMD MI325X with 25% Tariff; U.S. Infrastructure Spared | ||
| 15.01. | Global 8-Inch Wafer Market Tightens: Samsung Giheung S7, TSMC Closures Put China Fabs in Spotlight | ||
| 15.01. | Shanghai Launched New Plan, Highlighting the Development of IC, Key Equipment and Photoresists | ||
| 15.01. | Google Reportedly to Develop High-End Pixel Phones From Scratch in Vietnam Amid China Diversification | ||
| 14.01. | [Insights] Memory Spot Price Update: DRAM Surges as Sellers Hold Back Inventory, Mainstream DDR4 Up 10% | ||
| 14.01. | ASE Buys NT$2.8B Zhunan Facility, Packaging Orders Reportedly Span NVIDIA, AMD, and More | ||
| 14.01. | NVIDIA Reportedly Pivots to 8GB RTX 5060 amid Memory Crunch, Older GPUs Back in Play | ||
| 14.01. | 8-Inch Foundries May Raise Prices 5-20%, Benefiting UMC, PSMC, Vanguard | ||
| 14.01. | TSMC Earnings Preview: $150B Capex Over Next Three Years Tops Five Key Focuses | ||
| 14.01. | Global Players Vie for 12-Inch SiC Single-Crystal Substrates Amid Semiconductor Materials Innovation | ||
| 14.01. | GigaDevice Goes Public in Hong Kong: Founder Bets on China's Memory Future | ||
| 13.01. | Intel Reportedly Reaffirms 14A Commitment as Lip-Bu Tan Hints at Possible Customer Interest | ||
| 13.01. | Meizu Reportedly Scraps Meizu 22 Air as Memory Costs Drive Price Hikes Across Chinese Brands | ||
| 13.01. | SK hynix to Build Cheongju Advanced Packaging Fab, Boosting HBM Output by 2027 | ||
| 13.01. | SK hynix May Stick With MR-MUF for HBM4 16-High Despite ASMPT TC Bonder Orders | ||
| 13.01. | TSMC Reportedly Plans 5 More Fabs in Arizona Under U.S. Trade Deal, Investment Could Top $100B | ||
| 13.01. | Chinese Research Team Achieved New Advances in Lithographic Manufacturing Technology | ||
| 13.01. | LG Reportedly Delays Glass Substrate Commercialization to 2030 on Demand Uncertainty | ||
| 12.01. | China's Domestic Chip Equipment Adoption Beats 2025 Target at 35%, Led by NAURA, AMEC |
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