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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 12.09. | Samsung Reportedly Expands 1c DRAM Capacity for HBM4, Targeting 60K Wafers Monthly in 2025 | ||
| 12.09. | Micron Reportedly Reveals Detailed Site Plan for New York Fab, November Land Clearing Expected | ||
| 11.09. | Kioxia Reportedly Eyes 2027 Launch for NVIDIA-Partnered AI SSDs with 100x Speed Boost | ||
| 11.09. | Amazon Reportedly Plans Late-2026 Debut of First AR Glasses, Taking On Meta | ||
| 11.09. | China's Naura Posts 8x SEMES Profit in 1H25, Shaking Korea's Chip Equipment Sector | ||
| 11.09. | Taiwan DRAM Makers Reportedly Eye 20-50% Q4 Contract Price Hikes amid DDR4 Supply Squeeze | ||
| 11.09. | SK hynix Partners with Naver Cloud to Test CXL, PIM Memory Tech, Reportedly Eyes Major CSPs | ||
| 11.09. | South Korea to Double SiC Self-Sufficiency to 20% by 2030 Amid Chip Independence Push | ||
| 10.09. | Intel Reportedly Reaffirms Glass Substrate Roadmap, Pilot Line Rumored in 2025 | ||
| 10.09. | [Insights] Memory Spot Price Update: SanDisk's 10% Price Hike Meets Demand-Side Resistance | ||
| 10.09. | Synopsys Reportedly to Cut 10% Staff by FY26; China, Foundry Woes Expected Through 4Q | ||
| 10.09. | TSMC Reportedly Speeds Advanced Packaging Ramp to Three Quarters, Stresses Local Equipment | ||
| 10.09. | Decoding Apple's Latest Silicon: How A19, A19 Pro, C1X, and N1 Power the iPhone 17 Lineup | ||
| 10.09. | Samsung Reportedly to Build Panels for Apple's First OLED MacBook, Debut Expected 4Q26 | ||
| 10.09. | Ant Group Accelerates Semiconductor Investment Push | ||
| 09.09. | Samsung Reportedly Prepping Notebooks with Intel's Panther Lake, Shipment Logs Reveal | ||
| 09.09. | Samsung Confirms First Tri-Fold Phone by Year-End, Initial Shipments May Be Limited | ||
| 09.09. | China's YMTC Launches $3B Wuhan Phase III Venture, Signaling NAND Expansion Ambitions | ||
| 09.09. | Intel's Former Interim Co-CEO Michelle Johnston Holthaus to Depart Amid Leadership Shakeup | ||
| 09.09. | Silicon Photonics in the Spotlight: TSMC Lifts the Curtain on COUPE at SEMICON Taiwan | ||
| 09.09. | AMD May Return to GPU Arena with the Launch of 2.5D/3.5D Chiplet-Based GPU | ||
| 09.09. | TSMC Eyes Breakthroughs in SiC Thermal Management | ||
| 08.09. | U.S. Reportedly Mulls Annual Site License on Exports to Samsung, SK hynix China Fabs | ||
| 08.09. | Qualcomm Questions Intel's Adequacy, Undermining Team Blue's Foundry Ambitions | ||
| 08.09. | NVIDIA Reportedly Taps Samsung to Double GDDR7 Supply for China-Targeted RTX PRO 6000D |
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