- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 26.08. | China Flash Unveils 28nm NOR Flash with 2Gb Capacity, Reportedly Reaching Industry's Most Advanced Node | ||
| 25.08. | U.S. May Push Near-Total ASML China Ban on DUV Sales and Servicing Amid China Domestic Lithography Push | ||
| 25.08. | Intel Unveils Three AI Architectures at Hot Chips 2026, Diamond Rapids Taps In-House 18A-P and Advanced Packaging | ||
| 25.08. | Xiaomi XRING O3 Reportedly Features CXMT LPDDR6, TSMC 3nm, May Expand TSMC Ties to AI and Auto Chips | ||
| 25.08. | NVIDIA's Reported 15% Server Hike Boosts Samsung, SK hynix, With HBM Prices Potentially Up 50%+ in 2027 | ||
| 25.08. | [Insights] Tantalum Prices Nearly Triple on AI Demand, Supply Disruptions; EV Capacitor Lead Times Reportedly Top 1 Year | ||
| 25.08. | Micron Warns AI Memory Wall Worsens; Cites HBM in 17% of Meta Llama 3 Training Interruptions | ||
| 24.08. | Xiaomi Unveils 3nm XRING O3, Reportedly First Mobile Chip to Support LPDDR6; Debuts on Xiaomi 18 Fold | ||
| 24.08. | YMTC Eyes Record RMB 33B STAR Market IPO Fundraising; 1Q26 NAND Gross Margin Surges to 78.73% | ||
| 24.08. | NVIDIA Reportedly Eyes More Than 15% Price Hikes for Vera Rubin, Grace Blackwell Servers in Early 2027 | ||
| 24.08. | Hot Chips 2026: Samsung's zHBM Claims 70% Power-Efficiency Gain; SK hynix Evaluates Intel EMIB | ||
| 24.08. | Coherent Samples 300 mm SiC Substrates for Next-Gen AI Cooling | ||
| 24.08. | Micron's Sanand Assembly & Test Plant Gets Boost With 12-Hour Shifts, First in Gujarat | ||
| 21.08. | Unitree Sees Embodied AI 'ChatGPT Moment' in 2-3 Years at Earliest, Flags AI Model Limitations | ||
| 21.08. | Rapidus Scales Up Advanced Packaging, Targets 8-Reticle Interposers With 600mm Panels by 2030 | ||
| 21.08. | STMicroelectronics Plans Third 2026 Price Hike for August 23; Power Device Lead Times Reportedly Hit 52 Weeks | ||
| 21.08. | From Pricing War to Pricing Power: Behind Samsung Foundry's Reported up to 15% Price Hikes | ||
| 21.08. | Intel and Memory: A History of Exits, and a New Bid to Return | ||
| 21.08. | Chip Packaging Experts Flag Heat as AI's Biggest Bottleneck; AI-Driven Design, CPO and STCO May Help | ||
| 20.08. | Samsung to Break Ground on KRW 6T Onyang HBM Fab in Sept., P5 Eyes Triple-Fab Shift as Expansion Accelerates | ||
| 20.08. | SK hynix Unveils CPO Roadmap, Looks Beyond HBM to AI Infrastructure | ||
| 20.08. | Intel May Tap TSMC N2X for Some Razor Lake Chips in 2027, Depending on 18A-P Performance | ||
| 20.08. | Marvell, AMD Reportedly Shake Up Google TPU Race, Putting Broadcom, MediaTek Under Pressure | ||
| 20.08. | Lam Research, PSK Clash Over Bevel Etcher Patent as Korea Patent Suits Mount | ||
| 20.08. | Japan's Socionext Adds Intel's 18A-P to Foundry Mix Alongside TSMC |
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