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Aktuelle News von TrendForce

  • 24 h
  • letzte 200 News
ZeitAktuelle Nachrichten
27.04.MicroLED Gains Focus as Seoul Semiconductor Plans $180M AR Investment, Aledia Reports Breakthrough
24.04.Japan Photoresist Suppliers Flag Shortage Amid >40% Middle East Naphtha Reliance, Risks for Chipmakers
24.04.Samsung Reportedly Produces Sub-10nm 10a DRAM Working Die Using 4F Square, VCT, Targets 2028 Production
24.04.ASML's 1,700 Job Cuts Reportedly Target Management Roles; Summer Hiring Freeze Planned
24.04.Samsung, Kingston Reportedly Lift SSD Prices by Over 10%, More Hikes Likely in Coming Weeks
24.04.Intel Says AI Inference Pushes CPU Ratio From 1:8 Toward 1:1; 18A Yield Target Advanced to Mid-Year
24.04.Huawei Launches AI Glasses as Meta Leads the Market; Samsung, Apple Reportedly Eye 2026-2027 Entry
24.04.JEDEC Previews LPDDR6 Enhancements, Develops SOCAMM2 Standard for AI Memory
23.04.Micron Reportedly Urges Tighter U.S. Chip Equipment Curbs on China; Toolmakers Seek Relief
23.04.TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027
23.04.Intel Tapped as Tesla Wins First 14A Customer Spot in Terafab Push
23.04.AI Ignites Global VC and Startup Boom: Energy and AI Emerge as Dual Engines for Propelling Taiwan's Innovations
23.04.SK hynix Reports 5x 1Q26 Profit Surge; Operating Margin Hits 72%, Outpacing TSMC and Micron
23.04.Yuanjie's Share Price Surpasses Kweichow Moutai's, Hinting at a Boom in Optical Chip Demand
23.04.China OSAT SJ Semiconductor Reportedly Raises RMB 5B in IPO, Largest A-Share Offering of 2026 So Far
22.04.Samsung Xi'an NAND Output Reportedly Dips 5%-6% Amid 200+ Layer Shift; Disruptions May Extend into Next Year
22.04.SK hynix Breaks Ground on P&T7 Advanced Packaging Fab in Cheongju, Wafer-level Packaging Set for 2028 Ramp
22.04.Server CPU Prices Up as Much as 20% Since March; Intel May Raise Prices Another 8%-10% in 2H26
22.04.PSMC Raises DRAM and NAND Prices in Mar-Apr; Micron and Intel EMIB Programs Reported to Advance
22.04.DeepSeek Rumored to Raise USD 300 Million at Over USD 10 Billion Valuation
22.04.SK hynix Reportedly Breaks Ground on First U.S. Advanced Packaging Plant in Indiana, Eyes 2H28 Production
21.04.Micron Enters 3GB GDDR7 Race, With Production Underway but Still Trails in Speed
21.04.Qualcomm CEO in Korea, May Tap Samsung's 2nm for Snapdragon 8 Elite 2; Meets SK hynix for Memory
21.04.Apple to End Intel Mac Support with macOS 27, Deepening Shift to In-House M-Series Chips
21.04.Kioxia, TEL and Photoresist Makers in Focus After Magnitude 7.7 Japan Earthquake; Supply Chain Impact Mixed