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Aktuelle News von TrendForce

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  • letzte 200 News
ZeitAktuelle Nachrichten
15.05.TSMC Plans to Sell 8.1% Stake in Vanguard to Focus Resources on Core Businesses
15.05.Kioxia Reportedly Forecasts 48-Fold April Quarter Profit Jump, Eyes U.S. ADS Listing Amid Memory Boom
15.05.Samsung Reportedly Begins Preemptive Strike Measures on May 14, Shifts Product Mix Toward HBM
15.05.SMIC Q1 Net Profit Up 5%, Misses Forecasts; Smartphone-Related Revenue Share Hits Lowest Since 2021
15.05.Applied Sees >30% Equipment Growth, >50% Packaging Surge in 2026; China Remains Top Market in 2Q
15.05.Rohm Reportedly Warns of Delays in Talks with Toshiba and Mitsubishi Electric After Denso Exit
15.05.Samsung Reportedly Develops New Mobile HBM Packaging With Copper Pillars, Boosting Bandwidth by 15%-30%
14.05.U.S. Reportedly Approves NVIDIA H200 Sales to 10 Chinese Firms Including Alibaba, ByteDance, but Deals Stall
14.05.Foxconn to Boost 2026 Capex by 30%; CPO Switches Reportedly Set for Q3 Mass Production
14.05.TSMC Sees AI Wafer Demand Rising 11x From 2022-2026, Targets CoWoS With 24 HBM Stacks in 2029
14.05.Samsung SSD Prices Reportedly Surge Up to 300% in Japan, Kioxia Also Posts Gains as Market Divergence Widens
14.05.China's Wide Bandgap Chip Players Diverge, as GaN RF Surges; SiC Profitability Under Pressure
14.05.SK hynix CEO Reportedly to Meet Bill Gates, Deepening AI Memory Ties Amid Microsoft ASIC Push
13.05.[Insights] Memory Spot Price Update: DRAM Spot Market Strengthens Post-Holiday as DDR4 Leads Demand
13.05.Samsung Strike Seen Contained on Revenue Impact, with Price Support and Order Shift Risks to SK hynix, Micron
13.05.Decoding Googlebook Chip Partners: Intel Confirms Role, Qualcomm and MediaTek Also Reportedly in Play
13.05.Snapdragon 8 Elite Gen 6 Pro Reportedly Priced Above US$300 on TSMC 2nm, Risking Adoption
13.05.MLC NAND Spot Prices Reportedly Triple Since Late 2025 as Samsung, Kioxia Exit Supply
13.05.Samsung Electronics Rumored to Adjust Micro LED TV Manufacturing Strategy
13.05.Iran Disruptions Reportedly Push Key Resin Materials Up 40% Since Mar., Fueling CCL Hikes Amid AI Demand
12.05.Samsung Reportedly Plans Galaxy S26 Tactical Military Phone Later This Year; Apple Also Eyes Entry
12.05.TI Reportedly Raises Power Component Prices 5-15% in July; De-China Shift Fuels Upcycle Momentum
12.05.MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push
12.05.China Memory Module Maker POWEV Advances DDR5 Push as 64GB RDIMM Reportedly Enters Volume Production
12.05.[Sponsored Content] From Single-Task to Multi-Functional: Advantech Empowers ADATA in Developing Multi-Robot Collaborative AI AMRs