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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 17.07. | Memory Patent War Escalates: Kioxia Hit With $229M Viasat Verdict; Samsung Faces Netlist ITC Probe | ||
| 17.07. | Micron Expands Long-Term Memory Deals with 7 Auto Clients; Qualcomm, Harman Draw Attention | ||
| 17.07. | How Much Memory Does a Modern Vehicle Need? Smart Cars May Pack 100GB+ DRAM, Up to 1.5TB NAND | ||
| 17.07. | Intel's Abandoned German Fab Site: Could Memory Startup FMC Be the Next Contender? | ||
| 16.07. | TSMC A14 Validation Nears 90% of Target; Customer Interest Builds Ahead of 2028 Mass Production | ||
| 16.07. | TSMC Welcomes Intel's EMIB for More Market Flexibility; CEO Jokes About Memory Makers' Margin Boom | ||
| 16.07. | TSMC Boosts Arizona Investment by US$100B, Plans 4 More Fabs for 2nm and Advanced Packaging | ||
| 16.07. | TSMC Lifts 2026 Capex 15% to $60-64B, Hikes Sales Outlook to Over 40% Despite Q3 Margin Dip | ||
| 16.07. | TSMC 2Q26 Net Income Soars 77% YoY to NT$706.6B Record; Gross Margin Beats Forecast at 67.7% | ||
| 16.07. | CXMT IPO Could Raise Up to RMB 66.6B; How Founder Zhu Yiming Built China's DRAM Challenger | ||
| 16.07. | ASML Reportedly Seeks Higher Tool Prices as TSMC Pushes Back; Mature DUV Tools Could See 10% Hike | ||
| 16.07. | China's IC Export Value Nearly Doubles to US$177B in 1H26; Memory Price Boom Seen Behind the Surge | ||
| 15.07. | ASML Raises 2026 Guidance for Second Time This Year; Taiwan Sales Share Climbs to 30% | ||
| 15.07. | Samsung Galaxy Z Fold 8 May End Free Storage Upgrades on Rising Memory Costs; Flex Titanium Debuts | ||
| 15.07. | Intel Might Build Up to 90% of Nova Lake Compute Tiles on 18A, Scaling Back TSMC's Planned Role | ||
| 15.07. | PSMC Reportedly Secures Intel EMIB Certification for Silicon Capacitors, Eyes 10K 12-inch Wafer Capacity by 2027 | ||
| 15.07. | AR Boom Attracts New Entrants From Apparel, Home Appliances and Audio Industries | ||
| 15.07. | Korean and Japanese Researchers Unveil New AI Memory Architectures to Address HBM Thermal Limits | ||
| 14.07. | China's Dongfang Suanxin Unveils HBM-Free 14nm AI Chip, Claims Higher Memory Bandwidth Than NVIDIA H200 | ||
| 14.07. | UMC Announces First Delivery of Mass-Produced Silicon Photonics Wafers from Singapore 12-Inch Fab | ||
| 14.07. | SK hynix Reportedly Starts Yongin Y1 Equipment Orders, Moves Up Phase 1 Opening to Feb. 2027 | ||
| 14.07. | Samsung Steps Up Hiring Across Entire HBM Process to Accelerate HBM4 Ramp and HBM4E/HBM5 Development | ||
| 14.07. | Intel Pours €5B Into Ireland Fab, Doubling Down on Intel 3 as Europe's Most Advanced Chip Node | ||
| 14.07. | Huawei, Baidu and Industry Partners Launch China's First NPO Optical Interconnect Multi-Source Agreement | ||
| 14.07. | China's Yuanjiwei Eyes 5nm-Equivalent Chips Without EUV by 2029, Debuts World's 1st 2D Semiconductor Pilot Line |
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