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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 06.08. | Xiaomi, OPPO Invest in MicroPowerChip as China's Smartphone Makers Expand In-House Power Chip Footprint | ||
| 06.08. | InP Shortage Emerges as AI Optical Interconnect Bottleneck | ||
| 05.08. | [Insights] Early August Panel Prices: TV Price Declines Moderate; MNT and NB Stay Flat as Cost Pressures Persist | ||
| 05.08. | TSMC Reportedly Expands Outsourcing of Key CoWoS Front-End Step to OSATs Amid Rising NVIDIA, ASIC Demand | ||
| 05.08. | [Insights] Memory Spot Price Update: DRAM Spot Price Gains Slow, While DDR4 and DDR3 Continue Uptrend | ||
| 05.08. | U.S. Export Curbs Backfire? Samsung, SK hynix Reportedly Mull AMEC's Tools as China Fab Backup | ||
| 05.08. | Samsung Unveils Industry-First 400+ Layer V10 BV-NAND; Memory Density Up 58% vs. V9 | ||
| 05.08. | Qualcomm's Sep. Chip Price Hikes Revealed, Premium Flagships Face Steepest 10-15% Increase | ||
| 05.08. | "Compute Metals" Skyrocket in Price | ||
| 05.08. | Samsung Expected to Showcase zHBM at FMS 2026, a Next-Gen 3D Memory Architecture with 4X Bandwidth | ||
| 04.08. | NVIDIA RTX 50 Prices in Korea May Rise Up to 30% From Aug. on Higher TSMC Wafer and GDDR7 Memory Costs | ||
| 04.08. | CXMT Reportedly Eyes Second Beijing 12-inch DRAM Fab; HP, Asus, and Acer Said to Begin Limited Use | ||
| 04.08. | PSMC Reportedly Becomes Intel's Exclusive EMIB Silicon Capacitor Supplier; UMC May See Order Boost | ||
| 04.08. | SK hynix, SanDisk Debut HBF Standard to Challenge AI Memory Bottlenecks with Google, Tenstorrent Support | ||
| 04.08. | Across-the-Board 30% Price Hike: MLCC Price Surge Intensifies | ||
| 04.08. | Kioxia Steps Up AI NAND Competition With South Korean Rivals, Eyes PCIe 6.0 and UFS 5.0 Mass Production | ||
| 03.08. | Samsung Foundry Eyes 2H26 Full Utilization as HBM4 Base Dies and U.S. Orders Fuel Turnaround Hopes | ||
| 03.08. | AMEC Targets 60% High-End Market Coverage Within Five Years as China's Chip Equipment Ambitions Grow | ||
| 03.08. | TSMC 3nm Monthly Wafer Starts to Hit 180K by Early 4Q26 on Strong Demand, 2-3 Months Ahead of Expectations | ||
| 03.08. | MediaTek Advances 400G SerDes on 2nm, Targeting Google TPU v10 and Meta AI ASIC Orders | ||
| 03.08. | ZJ Innolight Debuts on HKEX in Record IPO as InP Substrate Bottleneck Intensifies | ||
| 03.08. | Kumamoto Fab Restart Update: TEL, Sony Resume Operations; TSMC's JASM Fab 1 Under Inspection after M7.1 Quake | ||
| 31.07. | Kioxia 1QFY26 Gross Margin Hits 80%; Reaffirms 50% LTA Target for 2028 | ||
| 31.07. | DDR5 MRDIMMs Gain Momentum; Renesas Unveils 16,000 MT/s Chipset as AMD Reportedly Eyes Adoption | ||
| 31.07. | NAND's 2026 Playbook: Samsung, SK hynix Chase Upgrades and SSD Mix Over Volume |
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