- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 09.09. | [Insights] Memory Spot Price Update: DDR4 Mainstream Rises 1.78% on 2Gx8 Orders; DDR5 Demand Remains Limited | ||
| 09.09. | Micron Among Potential Buyers for Display Maker JDI's Mobara Fab; Sale Price Reportedly Around KRW 500B | ||
| 09.09. | The Race to 2028: Samsung, SK hynix Set High-NA EUV Timelines for DRAM as Micron Stays Tight-Lipped | ||
| 09.09. | CXMT Speeds up Talent Push as R&D Workforce Reportedly Surges 60% YoY to Nearly 78% of SK hynix's | ||
| 09.09. | Samsung Taylor Fab Reportedly Fully Booked for 2nm by Tesla, Broadcom, Arm; Fab 2 Preparations Accelerate | ||
| 08.09. | [Insights] Early September Panel Prices: TV, MNT, NB Prices Seen Flat; NB Demand May Weaken Further in 4Q | ||
| 08.09. | ASML Expands High-NA EUV Push with TSMC, Samsung and Intel; 12-inch Photomask Pilot Line Set for 2031 | ||
| 08.09. | Huawei Reportedly Backs China's DUV Drive, with 12 Systems Targeted by End-2026; SMIC Testing Underway | ||
| 08.09. | Samsung Reportedly Eyes In-House Silicon Photonics PIC Testing by End-2026 with TSMC-Qualified Tools | ||
| 08.09. | CXMT Starts LPDDR6 Mass Production at 12,800Mbps; Open to Global Customers as Apple Ties Draw Attention | ||
| 08.09. | CATL Invest in Starksemi, a Hint at the Deployment of GaN-Based Micro LED | ||
| 08.09. | Huawei, Xiaomi Unveil New Foldables on Same Day With LogicFolding Kirin 9050 Pro, 3nm XRING O3 | ||
| 07.09. | SK hynix 1c DRAM Reportedly to Overtake 1b as Main Process in 1Q27 as It Prepares for HBM4E | ||
| 07.09. | Apple Said to Have Signed NAND LTA with Kioxia Seen as Likely Partner; Foldable iPhone Memory Suppliers in Focus | ||
| 07.09. | Huawei Addresses Tau Scaling Heat Concerns as Kirin 2026 Tests Show ~55% Higher Density but Lower Power | ||
| 07.09. | TSMC's 3nm Reportedly to Overtake 5nm as Top Revenue Node in 2H26; Output Value Could Top NT$400B | ||
| 07.09. | TCL Outlines Strategic Roadmap for Optical Communications | ||
| 07.09. | Kioxia Reportedly to Sample CXL Modules Soon, Reaffirms Strong NVIDIA CMX Ties | ||
| 04.09. | U.S. Chip Tariffs Could Hinge on Investment Scale: What's at Stake for TSMC, Samsung, SK hynix? | ||
| 04.09. | ASML Japan to Boost Workforce 40% by 2030 to Support Rapidus, TSMC Advanced Chip Push | ||
| 04.09. | Apple's iPhone 18 Lineup Takes Shape: Prices Seen Rising 10-20%, Foldable May Start Above US$2,000 | ||
| 04.09. | Samsung Electro-Mechanics Secures KRW 1.07 Trillion Long-Term MLCC Supply Deal for AI Servers | ||
| 04.09. | China's 2nd-largest Foundry Hua Hong Unveils US$2B Wuxi Expansion, Adding 55K Wafers/M and 30% More Capacity | ||
| 04.09. | Micron Reportedly to Add 60K HBM Wafers/M, Reaching 100K by Year-End to Narrow Gap With Rivals | ||
| 03.09. | Korean Power Utility Reportedly Asks Samsung, SK hynix to Prepay ~5 Years of Power Bills Worth KRW 25T |
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