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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 25.08. | Google's Hardware Play: AI in Focus, Flip-Style Foldable and Tablet Can Wait | ||
| 25.08. | Apple's First Foldable iPhone Set for 2026 as Hinge Suppliers Compete | ||
| 22.08. | China's New Rare Earth Rules Require Monthly Product Flow Reporting | ||
| 22.08. | NVIDIA Reportedly Asks Samsung, Amkor, and Foxconn to Pause H20 Production Amid China Talks | ||
| 22.08. | Jensen Huang Visits Taiwan as Rubin Trial Production Nears, Six Chips Reportedly Taped Out | ||
| 22.08. | Intel Reportedly Starts Glass Substrate Licensing, Offering Potential Boost to Samsung and Absolics | ||
| 22.08. | Trump Reportedly Spares TSMC, Micron from Equity Grabs after Chipmakers Ramp U.S. Investment | ||
| 22.08. | Foxconn: AR Glasses Could Enter Mass Production as Early as Next Year | ||
| 22.08. | Japan's Power Chip Lead Reportedly Shrinks to 3 Years, Challenged by Chinese Rivals | ||
| 21.08. | China Accelerates AI Chip Independence Drive, Reportedly Aiming 70% Self-Sufficiency by 2027 | ||
| 21.08. | Samsung Reportedly Passes NVIDIA HBM4 Prototype Test, 30% HBM3E Price Cut to Challenge SK hynix | ||
| 21.08. | Intel's Jaguar Shores Reportedly Breaks Cover, Showcasing 18A and HBM4 on Rack-scale AI solution | ||
| 21.08. | Intel Reportedly Offers Discounted Equity to Additional Investors After SoftBank Investment | ||
| 21.08. | U.S. Eyes TSMC Stake: Legal Hurdles, Shareholder Concerns, and What's at Play | ||
| 21.08. | Chinese Research Team Achieves New Breakthrough in Semiconductor, Based on DRAM Principle | ||
| 21.08. | Samsung Reportedly Seizes on Intel Talent Exodus, Hiring Glass Substrate and Packaging Experts | ||
| 20.08. | [Insights] Memory Spot Price Update: DRAM Trading Gradually Loses Steam as DDR5, DDR4 Drop Slightly | ||
| 20.08. | Decoding SoftBank's Intel Gamble: Son's Bold Move to Connect ARM and Chip Manufacturing | ||
| 20.08. | NVIDIA May Raise H20 Prices to Shield Profits but Confronts China's Domestic Chip Push | ||
| 20.08. | Meta Reshapes AI Division in Superintelligence Push Amid Talent War and Heavy Spending | ||
| 20.08. | U.S. Reportedly Mulls Stakes in CHIPS Act Recipients after Intel, Raising Risks for TSMC, Samsung | ||
| 20.08. | India's First Compound Semiconductor Wafer Fab Gets Approval | ||
| 20.08. | Chip Equipment Makers Ride AI Boom but Face 5% Q2 Revenue Decline on China Slowdown | ||
| 19.08. | NVIDIA Reportedly Develops China-Focused Blackwell AI Chip, with Test Samples Possibly in Sep. | ||
| 19.08. | TEL President Reportedly Set for September Taiwan Visit to Meet TSMC Execs After 2nm Data Leak |
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