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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 04.06. | SK Group Chair Chey Tae-won Meets TSMC Chairman C.C. Wei After Two Years, HBM, Advanced Packaging in Focus | ||
| 04.06. | Applied Materials Eyes 25% Southeast Asia Hiring Growth, Mostly in Singapore, Advances Packaging Efforts | ||
| 04.06. | LSTC's Research Breakthrough Clarifies Sub-2nm Process Variations, Supporting Rapidus's 1.4nm Ambitions | ||
| 03.06. | [Insights] Memory Spot Price Update: DDR4 and DDR5 Extend Gains, Though Higher Quotes Temper Procurement Demand | ||
| 03.06. | South Korea's Chip Exports to China Surge 243% YoY in May as Beijing's AI Push Fuels Memory Demand | ||
| 03.06. | Intel Won't Discontinue Raptor Lake DDR4 Models, Supports Lower-Memory Configurations Amid Shortages | ||
| 03.06. | Kioxia Targets ¥470B Yearly Capex in FY26-28, Up 66% from FY25, Reportedly Weighing Third Kitakami Fab and M&A | ||
| 03.06. | China Launches 8-Inch GaN-on-Silicon Micro LED IDM Production Line | ||
| 03.06. | Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs | ||
| 02.06. | Intel Lip-Bu Tan Reflects on Taiwan's Semiconductor Journey, Highlights AI and 18A Roadmap at COMPUTEX | ||
| 02.06. | SK Chair Sees Memory Shortage Through 2030, Eyes Capacity Doubling and Stronger TSMC, Taiwan Ties | ||
| 02.06. | YMTC Consumer Brand ZHITAI Unveils Three SSDs at COMPUTEX, Powered by Xtacking 3D NAND | ||
| 02.06. | Samsung Unveils HBM5 Model for the First Time at Computex, Production Reportedly Seen Around 2028 | ||
| 02.06. | MediaTek and Qualcomm Race for Bigger AI Roles Through NVIDIA N1X, ASICs, and Dragonfly | ||
| 02.06. | Samsung Accelerates U.S. Expansion as Taylor Fab Targets 2027 Start, HQ Reportedly Moves to Texas in 2026 | ||
| 02.06. | [Sponsored Content] When AI Is No Longer Just a Model: Advantech and Spingence Build a Practical "Closed-Loop Path" for AI Deployment | ||
| 02.06. | Samsung Display's Pilot Line for Micro LED Smartwatch Displays Under Construction | ||
| 02.06. | Nexperia China Says MOSFET, Logic IC Supply Chains Complete as Independent Operations Largely in Place | ||
| 01.06. | U.S. Moves to Block AI Chip Exports to Overseas Chinese Units as Loophole May Have Fueled Large Shipments | ||
| 01.06. | NVIDIA Enters PC Market with RTX Spark Featuring MediaTek-Co-Designed N1X CPU on TSMC 3nm | ||
| 01.06. | Intel Advances Glass Substrate Push with 3DGS, US$3.3 Billion India Plant Set for Five-to-Six-Year Buildout | ||
| 01.06. | Vera Rubin Buildout: NVIDIA Reportedly Pushes TSMC Above 20% Revenue Share, Power, Cooling Suppliers Benefit | ||
| 01.06. | COMPUTEX 2026 Preview: From Intel Budget AI CPUs to CPO Momentum Fueled by NVIDIA Vera Rubin | ||
| 01.06. | UNISOC and SmartSens Announce Strategic Push into Micro LED Optical Interconnects | ||
| 01.06. | Japan-U.S. NAND Alliance Steps Up Investment as Kioxia-SanDisk Capex Reportedly Rises 40% YoY |
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