| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 29.06. | Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans | ||
| 26.06. | Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 | ||
| 26.06. | Apple Price Hikes Erode Neo's Cost Edge as Xbox Cites 2.5x Memory Surge for New Increase | ||
| 26.06. | Apple Reportedly Reshapes M-Series by Skipping M6 Pro and Max, Shifting High-End Chips to M7 in 2027 | ||
| 26.06. | YOFC Achieved World's First 1.2Tb/s Per-Wavelength Transmission Over Hollow-Core Fiber | ||
| 26.06. | Micron Reportedly Acknowledges China's Memory Progress While Noting Output Remains Largely Domestic | ||
| 25.06. | Qualcomm Reportedly Plans China AI Chip Push With Export-Control-Compliant Custom Chips | ||
| 25.06. | Decoding Micron's SCAs: Reportedly 20% of DRAM Output, Toward 50% of Long-Term Memory Revenue | ||
| 25.06. | MLCC Turns From Electronic Rice Into a Gold-Like Rally, With Quotes Reportedly Updating Every 30 Minutes | ||
| 25.06. | Micron Profit Surges 15-Fold as Margin Nears 85%; HBM4 Revenue Exceeds $1B | ||
| 25.06. | ASE Targets FOPLP Mass Production by End-2026, Launches 15 Expansion Projects This Year Amid AI Boom | ||
| 24.06. | Kioxia Executive Pay Reportedly Surges Multiple-Fold, Converging toward Samsung and SK hynix Peer Levels | ||
| 24.06. | [Insights] Memory Spot Price Update: DRAM Buyers Resist Higher Quotes as Mainstream DDR4 Prices Gain 0.28% | ||
| 24.06. | ASUS Reportedly Sees Q3 PC Prices Rise by Around 5%, With Cumulative Gain Reaching 30% Since 4Q25 | ||
| 24.06. | UMC May Net Profit Surges 203% YoY as Utilization Strength Drives Earnings Upside | ||
| 24.06. | UNT Unveiled Plans to Expand Wafer Production with CNY 3B, Partly for Optical Interconnect Applications | ||
| 24.06. | Samsung Unveils UFS 5.0 Storage, Claims Industry's Fastest with 10.8GB/s Speeds | ||
| 23.06. | STMicroelectronics Reportedly Set for Second MCU Price Hike This Year, Effective June 28 | ||
| 23.06. | MediaTek Seen Raising Prices 10-20%, Reportedly Wins TPU v9 Orders on SerDes Shift | ||
| 23.06. | Memory Giants Split on HBM4 Strategy: Samsung HBM4 Sales Reportedly Tops $1B, SK hynix Slows Ramp | ||
| 23.06. | Source Photonics to Expand Optical Chip and Module Production | ||
| 23.06. | SK hynix Reported Design Hiring Surge Tightens Chip Talent Market, Raises Samsung Concerns | ||
| 22.06. | SanDisk Goes Beyond HBF: Patent Bonds Processor onto NAND Tile, with HBM Stacks on Shared Interposer | ||
| 22.06. | Top Five Japanese Chip Toolmakers Reportedly See 10% China Sales Drop in FY25, Led by Front-End Weakness | ||
| 22.06. | TSMC Reportedly Cuts 28nm Output by Over 25% Since Early 2026 as Advanced Node Push Accelerates |