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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 25.12.25 | Japan Develops 10nm Nanoimprint Technology, with Potential to Tackle EUV Bottleneck | ||
| 25.12.25 | Price Hikes Hit Mature Nodes: SMIC, TSMC Affiliate VIS Reportedly Raise BCD Prices 10% | ||
| 24.12.25 | [Insights] Memory Spot Price Update: Kingston Leads DRAM Surge as DDR4, DDR5 and Modules Hold Strong | ||
| 24.12.25 | Intel Fab 52 Reportedly Rivals TSMC Arizona Phase 1 and 2 Combined Capacity on More Advanced 18A | ||
| 24.12.25 | Apple Reportedly Sources 60-70% of iPhone 17 LPDDR5X from Samsung, Eyeing iPhone 18 Volumes | ||
| 24.12.25 | Samsung, SK hynix Reportedly Plan ~20% HBM3E Price Hike for 2026 as NVIDIA H200, ASIC Demand Rises | ||
| 24.12.25 | SMIC Reportedly Raises Prices by 10%, Memory Products Lead the Way | ||
| 24.12.25 | Intel Reportedly Plans Major CPU Roadmap Shifts: From Hammer Lake to NVIDIA Collaboration | ||
| 24.12.25 | [Insights] Early December Panel Prices: TV Panels Expected to Rise in January on Memory Supply Concerns | ||
| 23.12.25 | Top PC Maker, Likely HP or Lenovo, Reportedly Locks in Memory Supply following Supplier Visits | ||
| 23.12.25 | ByteDance Reportedly to Boost 2026 AI Spend to $23B, Plans Preliminary 20K H200 Chips Order | ||
| 23.12.25 | Memory Price Surge Reportedly to Push Samsung, SK hynix Gross Margins Above TSMC in 4Q25 | ||
| 23.12.25 | Samsung Set to Benefit from TSMC's 'N-2' Rule as AMD, Google Eye U.S. 2nm Production | ||
| 23.12.25 | Amazon to Restructure AI Teams, Led by Veteran AWS Leadership | ||
| 23.12.25 | Samsung Reportedly Preps 4:3 "Wide Fold" Phone to Take On Apple, Launch Set for Fall 2026 | ||
| 22.12.25 | Xiaomi 17 Ultra Price Hike Reportedly Confirmed: Memory Crunch Forces Notable Increase | ||
| 22.12.25 | Micron, SanDisk Reportedly Turn to PSMC to Fast-Track Memory Output Amid Tight Supply | ||
| 22.12.25 | China's Moore Threads Unveils Huashan AI Chip, Reportedly Takes Aim at NVIDIA's Hopper | ||
| 22.12.25 | U.S. Think Tank Flags DUVi Loopholes as China Pushes Toward Advanced Chips Using Multipatterning | ||
| 22.12.25 | TSMC's Bold Pivot: Kumamoto Fab 2 Reportedly Leaps from 6nm to 2nm amid JASM Losses | ||
| 22.12.25 | DNP Advances TGV Glass Substrates, Eyes Early-2026 Sample Shipments, FY2028 Mass Production | ||
| 22.12.25 | GF, onsemi Join Forces to Co-Develop GaN Power Devices, Accelerating Ambitions with Samples Due 1H26 | ||
| 19.12.25 | SK hynix Reportedly Expands U.S. Footprint with New Seattle Office Near NVIDIA and Amazon | ||
| 19.12.25 | Samsung Unveils Exynos 2600: Industry-First 2nm GAA AP With 113% AI Performance Uplift | ||
| 19.12.25 | Analog Devices Reportedly Plans 10-30% Price Hike from Feb. 2026, Following TI's Lead |
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