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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 05.12. | Innoscience Scores Major Patent Win Against Infineon as ITC Rules No Infringement | ||
| 05.12. | Chinese Semiconductor Equipment Maker PSR Completed Series A Funding | ||
| 05.12. | China's AI Toy Market Surges With 30+ Funding Rounds and Hot Launches From Huawei and UBTECH | ||
| 04.12. | TSMC Speeds Advanced Packaging: AP7 Targets 2026 Output; Arizona P6 Eyed for U.S. Packaging Hub | ||
| 04.12. | SK hynix Unveils Organizational Restructure with Dedicated HBM Taskforce in the Americas | ||
| 04.12. | Intel to Retain Networking and Edge Division After Spinoff Review as Financial Outlook Improves | ||
| 04.12. | Micron to End Crucial Consumer Memory by Feb 2026, Redirects Supply to Enterprise amid AI Surge | ||
| 04.12. | China's MTC Achieved Small-Batch Shipment of DFB Photonic Chips | ||
| 04.12. | onsemi Partners With China's Innoscience on Low/Mid-Voltage GaN, Sampling Expected in 1H26 | ||
| 03.12. | SanDisk, Samsung Reportedly Delay NAND Delivery, Hitting Transcend with 50-100% Price Spike | ||
| 03.12. | Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply | ||
| 03.12. | [Insights] Memory Spot Price Update: NAND Prices Adjusted Daily as Sellers Renege on Deals | ||
| 03.12. | China Claims New Architecture Using 14nm Logic and 18nm DRAM Could Match NVIDIA 4nm GPUs | ||
| 03.12. | Japan Rumored to Curb Photoresist Exports as China Targets 40% Self-Sufficiency by 2026 | ||
| 03.12. | China Guangdong to Build World's Largest 12-Inch Optical SiC Production Base | ||
| 03.12. | U.S. Invests $150M in xLight as Gelsinger-Led Startup Targets More Precise EUV Lasers Than ASML | ||
| 02.12. | Samsung MX Faces Galaxy S26 Cost Pressure as Memory Division Reportedly Sticks to Quarterly Pricing | ||
| 02.12. | Intel to Inject $208M in Malaysia to Expand Chip Packaging Amid Soaring Demand | ||
| 02.12. | Memory Price Rally May Run Past 2028 as Samsung, SK hynix Reportedly Cautious on Expansion | ||
| 02.12. | TSMC's C.C. Wei Reportedly Set for First China Trip in Over 2 Years, Meeting Alibaba, Local Chip Firms | ||
| 02.12. | Micron to Build a New Memory Chip Plant in Japan with USD 9.6B | ||
| 02.12. | Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC | ||
| 01.12. | Intel Reportedly Taps Amkor's Songdo Facility for EMIB Packaging in First-Ever Outsourcing Move | ||
| 01.12. | TSMC Unveils Custom C-HBM4E Details: N3P Logic Dies Reportedly Target 2× Efficiency Gain | ||
| 01.12. | TechFuture Awards 2025 Winners Announced -Driving Innovation and Shaping Intelligent Future |
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