- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 17.03. | China Pushes Advanced Photoresist as Xuzhou B&C Targets KrF and ArF; Mass Production in 5 Years | ||
| 17.03. | Samsung Reportedly Ends Galaxy Z Tri-Fold as Memory Costs Rise; Smartphone Margins at Risk | ||
| 17.03. | MLCC Giant Murata Reportedly Confirms April 1 Price Hike on Key Components | ||
| 17.03. | SK hynix Showcases AI Memory at GTC; Chairman Warns Wafer Shortage May Last Until 2030 | ||
| 17.03. | Key GTC Takeaways: How Samsung, Micron, Intel & More Power NVIDIA's Vera Rubin and Feynman | ||
| 17.03. | NVIDIA Jetson Thor and Robotics: The Real Challenge of Multimodal AI | ||
| 17.03. | "Everyone Raising a Lobster": How OpenClaw Reshapes the Computing and Chip Landscape | ||
| 17.03. | NPE Patent Trolls Reportedly Turn Up Pressure on Samsung and SK hynix Amid HBM Boom | ||
| 16.03. | Korean Expert Predicts "Chinese ASML" by 2030; Hua Hong Said to Join SMIC at 7nm | ||
| 16.03. | Meta Reportedly Eyes 20% Job Cuts, Largest Since 2023; ASML Plans 1,700 Layoffs | ||
| 16.03. | Micron Plans 2nd Tongluo Facility After PSMC P5 Acquisition; Construction to Start by FY26 | ||
| 16.03. | UMC, VIS, PSMC Reportedly Eye Mature-Node Price Hikes Up to 10% From Apr.; IC Costs May Rise | ||
| 16.03. | NVIDIA GTC Could Spotlight CPUs for Agent AI with Intel Partnership and CPU Racks Highlighted | ||
| 16.03. | China Completed the World's First 35-micron Ultra-Thin Wafer Process and Packaging & Testing Production Line | ||
| 16.03. | Iran Conflict Threatens Helium for Chip: China's Domestic Supply Push in Focus | ||
| 13.03. | Intel Reportedly Says CPU Supply Tightness Is Affecting All Customers; Chromebooks Hit Hard | ||
| 13.03. | Hybrid Bonding Leader BESI Reportedly Draws Takeover Interest; Lam, Applied Materials Rumored | ||
| 13.03. | China's No.3 Foundry Nexchip to Hike Prices 10% from June, Following SMIC, Hua Hong | ||
| 13.03. | Samsung and NVIDIA Team Up on Ferroelectric NAND R&D, Key Step Toward 1000-Layer NAND | ||
| 13.03. | Samsung Reportedly Asks Execs to Fly Economy as Mobile Risks Worst-Ever Q1 on Memory Costs | ||
| 13.03. | Micron Reportedly Schedules March 26 Tool Move-In at PSMC Tongluo Fab, Signaling Next Deal Phase | ||
| 13.03. | NVIDIA May Offer First Look at Feynman at GTC 2026, TSMC A16 and Taiwan Supply Chain in Focus | ||
| 13.03. | SerDes Wars Heat Up: Broadcom, Marvell, MediaTek Battle for AI Interconnect Supremacy | ||
| 12.03. | India Reportedly Eyes Smartphone Export Incentives as Apple Said to Make Quarter of iPhones There | ||
| 12.03. | Google Makes First Appearance in Samsung's Top Five Clients in 2025 amid Soaring TPU Demand |
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