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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11:14 | Meta Targets 1H27 Deployment for New TSMC-Made AI Chip, Claims Efficiency Edge Over NVIDIA | ||
| 10:15 | [Insights] Memory Spot Price Update: DRAM Spot Cools as DDR5 Inquiries Slow, 2Gx8 DDR4 Prices Retreat | ||
| 10:15 | SK hynix Reportedly Explores Leasing Intel's Ohio Fab, Could Produce Memory in U.S. for First Time | ||
| 06:14 | Samsung Reportedly Shifts Cheonan Capacity to HBM Packaging, Outsource Conventional Memory Modules | ||
| 05:14 | Intel CEO Flags AI Supply Squeeze: Memory Prices Up 5-7x, Its CPUs Meet Just 50% of Demand | ||
| 03:15 | Samsung Electro-Mechanics, Qualcomm Reportedly Develop Organic Bridge Packaging, Target Intel EMIB Alternative | ||
| 02:15 | Hanmi Semiconductor Reportedly Receives Terafab Packaging Tool Order, Eyes HBM TC Bonder Supply | ||
| Di | MediaTek's Dimensity 9600 Pro, Built on TSMC 2nm, Reportedly Hits Record $220, Closing In on Qualcomm | ||
| Di | Micron Taiwan Union Reportedly Seeks 15% Profit Share After New Reward Plan; Warns of Strike Vote | ||
| Di | ASE's SPIL Reportedly Nears Arizona Expansion as TSMC, Amkor Step Up U.S. Advanced Packaging Push | ||
| Di | Kioxia Reportedly Weighs $10B U.S. Listing in 2027; Toshiba Cuts Stake to 12.84% | ||
| Di | South Korea Expands Espionage Law to Combat Chip Tech Leaks; China Led Overseas Cases at 54.5% | ||
| Di | China's Empyrean Reportedly Cuts Chip Design Task from 4 Weeks to One with AI, Eyes New EDA Opening with Tau Law | ||
| Mo | Anthropic CEO Calls for Slower AI Progress but Flags China Risk; OpenAI Reportedly Rules Out 2026 IPO | ||
| Mo | SanDisk Reportedly Hunts for HBM, LPDDR Talent in Korea as AI Memory Race Heats Up | ||
| Mo | TSMC Reportedly Targets 22% 2nm, 16%+ 3nm Capacity Boost by Mid-2027; CoWoS to Double by 2028 | ||
| Mo | Kepler Claims HBM Alternative Without EUV Using GlobalFoundries' 28nm Fabs, 2027 Production | ||
| Mo | China's High-Purity Quartz Reportedly Qualifies for 300mm DRAM Production, Boosting Materials Localization | ||
| Fr | Samsung-Qualcomm 2nm Deal May Slip to 2027; Foundry Resists Lower Pricing as Process Stabilizes | ||
| Fr | Samsung Electro-Mechanics' MLCC Revenue Seen Topping KRW 8T in 2027; Murata EOL May Reshape Market | ||
| Fr | Micron Unveils Record Rewards: Taiwan Staff Get NT$1M Bonus, Up to 68 Months of Compensation | ||
| Fr | Huawei Unveils 7.2Tbps Near-packaged Optics Module, Challenging NVIDIA and Broadcom's CPO Push | ||
| Fr | Samsung, CXMT Reportedly Supply LPDDR5X for Chinese AI Phone as Domestic Memory Enters Flagship Supply Chain | ||
| Fr | Renesas to Raise Prices Again From Jan. 2027, Citing Rising Material, Energy and Manufacturing Costs | ||
| Do | Chinese AI Chipmakers Reportedly Hike Prices on HBM Costs, Huawei 950DT Up as Much as 50% |
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