- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 10:15 | Qualcomm Reportedly Enlists Samsung, SK hynix as HBC Memory Partners; TSMC Eyes Packaging Role | ||
| 09:14 | Apple's First Ternus-Era Launch Event Set for Sept. 9, Foldable May Debut; Standard iPhone 18 Eyed for 2027 | ||
| 06:14 | Kioxia Reportedly Plans JPY 1T+ NAND Fab in Japan, Operations Eyed for 2029 or Later | ||
| 04:14 | NVIDIA's Supply Commitments Soar to $279B as Memory Costs Surge; New NVHBM Boosts Bandwidth 30% | ||
| 03:14 | Apple Suppliers Diverge in 1H26: Lens Profit Halves on Rising Memory Costs, Luxshare Revenue Jumps 40% | ||
| 02:15 | Samsung Electro-Mechanics, LG Innotek Ramp Up AI Substrate Capacity as 1H Utilization Reportedly Nears 90% | ||
| Mi | Samsung's 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027 | ||
| Mi | South Korea's DRAM Prices Reportedly Soar 12.5-Fold in 3 Years, Outpacing Gold | ||
| Mi | Apple Unveils M6, Its First 2nm Chip Built by TSMC, With 30% AI GPU Compute Boost vs. M5 | ||
| Mi | OpenAI Debuts Jalapeño AI Inference Chip, with Samsung Reportedly Supplying HBM4 | ||
| Mi | Mercedes-Benz Expands Micro LED Headlamps to C-Class Lineup | ||
| Mi | China Flash Unveils 28nm NOR Flash with 2Gb Capacity, Reportedly Reaching Industry's Most Advanced Node | ||
| Di | U.S. May Push Near-Total ASML China Ban on DUV Sales and Servicing Amid China Domestic Lithography Push | ||
| Di | Intel Unveils Three AI Architectures at Hot Chips 2026, Diamond Rapids Taps In-House 18A-P and Advanced Packaging | ||
| Di | Xiaomi XRING O3 Reportedly Features CXMT LPDDR6, TSMC 3nm, May Expand TSMC Ties to AI and Auto Chips | ||
| Di | NVIDIA's Reported 15% Server Hike Boosts Samsung, SK hynix, With HBM Prices Potentially Up 50%+ in 2027 | ||
| Di | [Insights] Tantalum Prices Nearly Triple on AI Demand, Supply Disruptions; EV Capacitor Lead Times Reportedly Top 1 Year | ||
| Di | Micron Warns AI Memory Wall Worsens; Cites HBM in 17% of Meta Llama 3 Training Interruptions | ||
| Mo | Xiaomi Unveils 3nm XRING O3, Reportedly First Mobile Chip to Support LPDDR6; Debuts on Xiaomi 18 Fold | ||
| Mo | YMTC Eyes Record RMB 33B STAR Market IPO Fundraising; 1Q26 NAND Gross Margin Surges to 78.73% | ||
| Mo | NVIDIA Reportedly Eyes More Than 15% Price Hikes for Vera Rubin, Grace Blackwell Servers in Early 2027 | ||
| Mo | Hot Chips 2026: Samsung's zHBM Claims 70% Power-Efficiency Gain; SK hynix Evaluates Intel EMIB | ||
| Mo | Coherent Samples 300 mm SiC Substrates for Next-Gen AI Cooling | ||
| Mo | Micron's Sanand Assembly & Test Plant Gets Boost With 12-Hour Shifts, First in Gujarat | ||
| Fr | Unitree Sees Embodied AI 'ChatGPT Moment' in 2-3 Years at Earliest, Flags AI Model Limitations |
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