Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
Mo | NVIDIA Reportedly Plans RTX 50 Series Price Cut in China This Month amid Weak Sales | ||
Mo | Meta Reportedly Teams Up with Broadcom, Taps Quanta for Next-Gen ASIC-powered AI servers | ||
Mo | NVIDIA Picks Innoscience as Sole Chinese Supplier for 800 VDC Power-Unpacking the GaN Giant | ||
Mo | Intel's Chip Packaging Expert Jumps to Samsung Amid Reported Glass Substrate Retreat | ||
Mo | South Korea Posts Record July Chip Exports, Up 31.6% YoY on HBM and DDR5 Demand | ||
Mo | Samsung Bets on Local Chip Firm Rebellions and Israeli Startup Teramount to Ride the AI Wave | ||
Fr | Chipmaking Tool Giants TEL, KLA Flag Weak China Demand in 2025 Amid Trade Tensions | ||
Fr | Intel NEX Spinoff Reportedly Draws Ericsson's Interest, with $100M+ Investment on the Table | ||
Fr | Tesla Taps Samsung for A16 Chips-Reportedly Set for Supercomputer and Robots, Not Cars | ||
Fr | U.S. Slaps 20% Tariff on Taiwan: Foundries Unscathed, Downstream Burned-Section 232 Looms | ||
Fr | Alibaba Unveils Quark AI Glasses to Take On Meta and Xiaomi, Launch Set for Year-End | ||
Fr | Intel's Ohio Plant Dilemma: Build at High Cost - or Pay Back Billions in Government Aid | ||
Do | Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions | ||
Do | Chinese Regulators Reportedly Summon NVIDIA Over H20 Chip Backdoor Security Risks | ||
Do | Memory Giants Unite at SEMICON Taiwan as SK hynix's Young HBM Head Steals Spotlight | ||
Do | ASML Tools Reportedly Exempt from U.S. Tariff, Easing Costs for Intel, Samsung, and TSMC | ||
Do | Samsung Chip Division Profit Plunges 90% in Q2; H2 Hopes on HBM3E, 2nm | ||
Do | Groq Cuts 2025 Revenue Projection by USD 1.5B, Dealing Blow to Samsung Foundry | ||
Do | MediaTek Gears Up for 2nm Tape-Out in Sep; ASIC Reportedly to Boost 2026 Revenue | ||
Mi | NVIDIA's Reported 300K H20 Order Signals China CSP Boom, Boosts Taiwan AI Server Makers | ||
Mi | Samsung Reportedly Mulls Taylor Expansion, Advanced Packaging in Sight After Tesla Deal | ||
Mi | [Insights] Memory Spot Price Update: NAND Spot Market Shows Recovery Signs on Rising 3Q25 Price Expectations | ||
Mi | CoWoP: A Game-Changer Beyond CoWoS-Or Just Hype? PCB Makers Stay Skeptical | ||
Mi | Sony Reportedly Plans to Sell Communication Chip Division Valued at USD 300 Million | ||
Mi | Apple to Close China Retail Store for the First Time Amid Market Headwinds |