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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 03:14 | Samsung Reportedly Trims 2026 Foldable Target to 5-6M Units for Galaxy Z Fold8, Flip8 and Wide Fold | ||
| 02:15 | Onsemi Reportedly Plans Up to 300 Job Cuts in Czech Plant as Low-cost Chinese SiC Competition Intensifies | ||
| Fr | [Insights] Early June Panel Prices: TV Demand Weakens; MNT Price Gains Lose Momentum, NB Stays Flat | ||
| Fr | HBF Spurs Equipment Race; Hanmi Semiconductor Eyes First TC Bonder Deliveries in 2H26 | ||
| Fr | SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion | ||
| Fr | Motherboard and Module Makers Reportedly Expand DDR4 Platforms Amid Rising DDR5 Costs | ||
| Fr | Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows | ||
| Fr | Laser Annealing Adoption May Broaden with Wolfspeed, Samsung SiC Push and 400-Layer NAND Expansion | ||
| Fr | Samsung, SK hynix Plan New Heat Dissipation Technologies Starting HBM5: Three Memory Makers' Approaches in Focus | ||
| Do | Intel Says 18A May Reach Strong Margins by 2027; Notebook Chips on the Node Mark Fastest Ramp in 5 Years | ||
| Do | Broadcom Stops Short of Raising FY2027 US$100B AI Chip Sales Target Despite Google, Meta Commitments | ||
| Do | TSMC Rejects High-NA EUV Investment Concerns, Confirms Purchase for R&D Use | ||
| Do | SK Group Chair Chey Tae-won Meets TSMC Chairman C.C. Wei After Two Years, HBM, Advanced Packaging in Focus | ||
| Do | Applied Materials Eyes 25% Southeast Asia Hiring Growth, Mostly in Singapore, Advances Packaging Efforts | ||
| Do | LSTC's Research Breakthrough Clarifies Sub-2nm Process Variations, Supporting Rapidus's 1.4nm Ambitions | ||
| Mi | [Insights] Memory Spot Price Update: DDR4 and DDR5 Extend Gains, Though Higher Quotes Temper Procurement Demand | ||
| Mi | South Korea's Chip Exports to China Surge 243% YoY in May as Beijing's AI Push Fuels Memory Demand | ||
| Mi | Intel Won't Discontinue Raptor Lake DDR4 Models, Supports Lower-Memory Configurations Amid Shortages | ||
| Mi | Kioxia Targets ¥470B Yearly Capex in FY26-28, Up 66% from FY25, Reportedly Weighing Third Kitakami Fab and M&A | ||
| Mi | China Launches 8-Inch GaN-on-Silicon Micro LED IDM Production Line | ||
| Mi | Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs | ||
| Di | Intel Lip-Bu Tan Reflects on Taiwan's Semiconductor Journey, Highlights AI and 18A Roadmap at COMPUTEX | ||
| Di | SK Chair Sees Memory Shortage Through 2030, Eyes Capacity Doubling and Stronger TSMC, Taiwan Ties | ||
| Di | YMTC Consumer Brand ZHITAI Unveils Three SSDs at COMPUTEX, Powered by Xtacking 3D NAND | ||
| Di | Samsung Unveils HBM5 Model for the First Time at Computex, Production Reportedly Seen Around 2028 |
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