| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 | ||
| Fr | Apple Price Hikes Erode Neo's Cost Edge as Xbox Cites 2.5x Memory Surge for New Increase | ||
| Fr | Apple Reportedly Reshapes M-Series by Skipping M6 Pro and Max, Shifting High-End Chips to M7 in 2027 | ||
| Fr | YOFC Achieved World's First 1.2Tb/s Per-Wavelength Transmission Over Hollow-Core Fiber | ||
| Fr | Micron Reportedly Acknowledges China's Memory Progress While Noting Output Remains Largely Domestic | ||
| Do | Qualcomm Reportedly Plans China AI Chip Push With Export-Control-Compliant Custom Chips | ||
| Do | Decoding Micron's SCAs: Reportedly 20% of DRAM Output, Toward 50% of Long-Term Memory Revenue | ||
| Do | MLCC Turns From Electronic Rice Into a Gold-Like Rally, With Quotes Reportedly Updating Every 30 Minutes | ||
| Do | Micron Profit Surges 15-Fold as Margin Nears 85%; HBM4 Revenue Exceeds $1B | ||
| Do | ASE Targets FOPLP Mass Production by End-2026, Launches 15 Expansion Projects This Year Amid AI Boom | ||
| Mi | Kioxia Executive Pay Reportedly Surges Multiple-Fold, Converging toward Samsung and SK hynix Peer Levels | ||
| Mi | [Insights] Memory Spot Price Update: DRAM Buyers Resist Higher Quotes as Mainstream DDR4 Prices Gain 0.28% | ||
| Mi | ASUS Reportedly Sees Q3 PC Prices Rise by Around 5%, With Cumulative Gain Reaching 30% Since 4Q25 | ||
| Mi | UMC May Net Profit Surges 203% YoY as Utilization Strength Drives Earnings Upside | ||
| Mi | UNT Unveiled Plans to Expand Wafer Production with CNY 3B, Partly for Optical Interconnect Applications | ||
| Mi | Samsung Unveils UFS 5.0 Storage, Claims Industry's Fastest with 10.8GB/s Speeds | ||
| Di | STMicroelectronics Reportedly Set for Second MCU Price Hike This Year, Effective June 28 | ||
| Di | MediaTek Seen Raising Prices 10-20%, Reportedly Wins TPU v9 Orders on SerDes Shift | ||
| Di | Memory Giants Split on HBM4 Strategy: Samsung HBM4 Sales Reportedly Tops $1B, SK hynix Slows Ramp | ||
| Di | Source Photonics to Expand Optical Chip and Module Production | ||
| Di | SK hynix Reported Design Hiring Surge Tightens Chip Talent Market, Raises Samsung Concerns | ||
| Mo | SanDisk Goes Beyond HBF: Patent Bonds Processor onto NAND Tile, with HBM Stacks on Shared Interposer | ||
| Mo | Top Five Japanese Chip Toolmakers Reportedly See 10% China Sales Drop in FY25, Led by Front-End Weakness | ||
| Mo | TSMC Reportedly Cuts 28nm Output by Over 25% Since Early 2026 as Advanced Node Push Accelerates | ||
| Mo | Innoscience's Current Products are not Affected by Both Rulings of the Munich Regional Court |