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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | [Exclusive] Memory Crunch Hits PCs: Dell Hikes Prices 15-20% Mid-December, Lenovo from January 2026 | ||
| Fr | US Lawmakers Seek 30-Month Ban on Advanced AI Chips to China, Hitting NVIDIA H200 and Blackwell | ||
| Fr | Inside Huawei's Patent Playbook: GPU Dominance and Sub-2nm Ambitions Under Sanctions | ||
| Fr | UMC Teams With Polar to Boost 8-Inch Output, Accelerating U.S. Manufacturing After Intel Partnership | ||
| Fr | Intel Eyes EMIB to Ramp up in 2H26; 18A-P/18A-PT Moves Toward External Adoption | ||
| Fr | Innoscience Scores Major Patent Win Against Infineon as ITC Rules No Infringement | ||
| Fr | Chinese Semiconductor Equipment Maker PSR Completed Series A Funding | ||
| Fr | China's AI Toy Market Surges With 30+ Funding Rounds and Hot Launches From Huawei and UBTECH | ||
| Do | TSMC Speeds Advanced Packaging: AP7 Targets 2026 Output; Arizona P6 Eyed for U.S. Packaging Hub | ||
| Do | SK hynix Unveils Organizational Restructure with Dedicated HBM Taskforce in the Americas | ||
| Do | Intel to Retain Networking and Edge Division After Spinoff Review as Financial Outlook Improves | ||
| Do | Micron to End Crucial Consumer Memory by Feb 2026, Redirects Supply to Enterprise amid AI Surge | ||
| Do | China's MTC Achieved Small-Batch Shipment of DFB Photonic Chips | ||
| Do | onsemi Partners With China's Innoscience on Low/Mid-Voltage GaN, Sampling Expected in 1H26 | ||
| Mi | SanDisk, Samsung Reportedly Delay NAND Delivery, Hitting Transcend with 50-100% Price Spike | ||
| Mi | Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply | ||
| Mi | [Insights] Memory Spot Price Update: NAND Prices Adjusted Daily as Sellers Renege on Deals | ||
| Mi | China Claims New Architecture Using 14nm Logic and 18nm DRAM Could Match NVIDIA 4nm GPUs | ||
| Mi | Japan Rumored to Curb Photoresist Exports as China Targets 40% Self-Sufficiency by 2026 | ||
| Mi | China Guangdong to Build World's Largest 12-Inch Optical SiC Production Base | ||
| Mi | U.S. Invests $150M in xLight as Gelsinger-Led Startup Targets More Precise EUV Lasers Than ASML | ||
| Di | Samsung MX Faces Galaxy S26 Cost Pressure as Memory Division Reportedly Sticks to Quarterly Pricing | ||
| Di | Intel to Inject $208M in Malaysia to Expand Chip Packaging Amid Soaring Demand | ||
| Di | Memory Price Rally May Run Past 2028 as Samsung, SK hynix Reportedly Cautious on Expansion | ||
| Di | TSMC's C.C. Wei Reportedly Set for First China Trip in Over 2 Years, Meeting Alibaba, Local Chip Firms |
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