Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
08:15 | SK hynix Unveils World's First 321-Layer QLC NAND, Targets 1H26 Commercial Launch | ||
06:14 | U.S. to Acquire 10% Intel Stake, Yet Foundry Future Rests on Customer Demand | ||
03:15 | Google's Hardware Play: AI in Focus, Flip-Style Foldable and Tablet Can Wait | ||
02:15 | Apple's First Foldable iPhone Set for 2026 as Hinge Suppliers Compete | ||
Fr | China's New Rare Earth Rules Require Monthly Product Flow Reporting | ||
Fr | NVIDIA Reportedly Asks Samsung, Amkor, and Foxconn to Pause H20 Production Amid China Talks | ||
Fr | Jensen Huang Visits Taiwan as Rubin Trial Production Nears, Six Chips Reportedly Taped Out | ||
Fr | Intel Reportedly Starts Glass Substrate Licensing, Offering Potential Boost to Samsung and Absolics | ||
Fr | Trump Reportedly Spares TSMC, Micron from Equity Grabs after Chipmakers Ramp U.S. Investment | ||
Fr | Foxconn: AR Glasses Could Enter Mass Production as Early as Next Year | ||
Fr | Japan's Power Chip Lead Reportedly Shrinks to 3 Years, Challenged by Chinese Rivals | ||
Do | China Accelerates AI Chip Independence Drive, Reportedly Aiming 70% Self-Sufficiency by 2027 | ||
Do | Samsung Reportedly Passes NVIDIA HBM4 Prototype Test, 30% HBM3E Price Cut to Challenge SK hynix | ||
Do | Intel's Jaguar Shores Reportedly Breaks Cover, Showcasing 18A and HBM4 on Rack-scale AI solution | ||
Do | Intel Reportedly Offers Discounted Equity to Additional Investors After SoftBank Investment | ||
Do | U.S. Eyes TSMC Stake: Legal Hurdles, Shareholder Concerns, and What's at Play | ||
Do | Chinese Research Team Achieves New Breakthrough in Semiconductor, Based on DRAM Principle | ||
Do | Samsung Reportedly Seizes on Intel Talent Exodus, Hiring Glass Substrate and Packaging Experts | ||
Mi | [Insights] Memory Spot Price Update: DRAM Trading Gradually Loses Steam as DDR5, DDR4 Drop Slightly | ||
Mi | Decoding SoftBank's Intel Gamble: Son's Bold Move to Connect ARM and Chip Manufacturing | ||
Mi | NVIDIA May Raise H20 Prices to Shield Profits but Confronts China's Domestic Chip Push | ||
Mi | Meta Reshapes AI Division in Superintelligence Push Amid Talent War and Heavy Spending | ||
Mi | U.S. Reportedly Mulls Stakes in CHIPS Act Recipients after Intel, Raising Risks for TSMC, Samsung | ||
Mi | India's First Compound Semiconductor Wafer Fab Gets Approval | ||
Mi | Chip Equipment Makers Ride AI Boom but Face 5% Q2 Revenue Decline on China Slowdown |