- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11:15 | MLCC Giant Murata Reportedly to Decouple China Rare Earth Supply in 3 Years as Risks Rise | ||
| 10:15 | Kioxia Reportedly to End Slim NAND Packages, Final Shipments due March 2027 | ||
| 08:15 | imec Secures ASML's Most Advanced EXE:5200 High-NA EUV for Sub-2nm; 4Q26 Qualification Target | ||
| 05:14 | AMD Secures Samsung HBM4 for MI455X; Deal May Tie Partial AI Chip Shift to Samsung Foundry | ||
| 04:14 | Micron Ramps FY26 Capex to $25B, Signs First 5-Year Customer Deal | ||
| 02:14 | China Achieves 14-Inch SiC Breakthrough, Intensifying Global Large-Wafer Competition | ||
| 01:14 | [Insights] NVIDIA Expands Robotics Ecosystem at GTC as Physical AI Moves Toward Large-Scale Deployment | ||
| Mi | Memory Giant Shifts Strategy: Samsung Reportedly Eyes 3-5 Year Contracts to Stabilize Supply | ||
| Mi | [Insights] Memory Spot Price Update: DRAM Spots Pause Amid Samsung's March DDR4 Freeze | ||
| Mi | Samsung Reportedly Eyes 2nm Base Die for HBM5, 1d DRAM HBM5E; HBM4 to Exceed 50% of Output | ||
| Mi | NVIDIA Rubin Ultra and Feynman Reportedly to Boost TSMC SoIC; Besi, Applied Materials, TEL to Benefit | ||
| Mi | NVIDIA's China-Ready LPUs Could Launch as Early as May; H200 Production Restarts | ||
| Mi | World's First 6-Inch InP Photonic Chip Industrial Wafer Fab Broke Ground | ||
| Mi | Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026, EMIB Update | ||
| Di | China Pushes Advanced Photoresist as Xuzhou B&C Targets KrF and ArF; Mass Production in 5 Years | ||
| Di | Samsung Reportedly Ends Galaxy Z Tri-Fold as Memory Costs Rise; Smartphone Margins at Risk | ||
| Di | MLCC Giant Murata Reportedly Confirms April 1 Price Hike on Key Components | ||
| Di | SK hynix Showcases AI Memory at GTC; Chairman Warns Wafer Shortage May Last Until 2030 | ||
| Di | Key GTC Takeaways: How Samsung, Micron, Intel & More Power NVIDIA's Vera Rubin and Feynman | ||
| Di | NVIDIA Jetson Thor and Robotics: The Real Challenge of Multimodal AI | ||
| Di | "Everyone Raising a Lobster": How OpenClaw Reshapes the Computing and Chip Landscape | ||
| Di | NPE Patent Trolls Reportedly Turn Up Pressure on Samsung and SK hynix Amid HBM Boom | ||
| Mo | Korean Expert Predicts "Chinese ASML" by 2030; Hua Hong Said to Join SMIC at 7nm | ||
| Mo | Meta Reportedly Eyes 20% Job Cuts, Largest Since 2023; ASML Plans 1,700 Layoffs | ||
| Mo | Micron Plans 2nd Tongluo Facility After PSMC P5 Acquisition; Construction to Start by FY26 |
Sie erhalten auf FinanzNachrichten.de kostenlose Realtime-Aktienkurse von und sowie Kurse und Daten von ARIVA.DE AG.