- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 02:15 | SJ Semiconductor Reportedly Wins IPO Nod as China Bets on Advanced Packaging | ||
| 01:15 | March Price Wave Looms Amid Memory Crunch: Lenovo, Acer, Samsung, Chinese Phone Makers in Action | ||
| Do | Meizu Reportedly Eyes March Smartphone Exit After Scrapping Launch Amid Memory Costs Surge | ||
| Do | Apple Reportedly Eyes Chinese Memory as Leverage Against Samsung, SK hynix Amid Rising Costs | ||
| Do | Samsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAM | ||
| Do | SK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030 | ||
| Do | Memory Giants' HBM Cleanroom Race: Samsung & SK hynix Fast-Track, Micron Acquires | ||
| Do | China's Chip Materials Drive Intensifies as Photoresist Leader Red Avenue Seeks Hong Kong IPO | ||
| Mi | Xiaomi Doubles Down on Chips; Trademark Filing Reportedly Signals Potential Memory Entry | ||
| Mi | SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration | ||
| Mi | China Reportedly Aims to Boost 7nm, 5nm Output Fivefold in Two Years, Driven by SMIC, Hua Hong | ||
| Mi | NVIDIA GTC 2026 in Focus: Feynman Reportedly on TSMC A16, Samsung & SK hynix to Showcase HBM4 | ||
| Mi | MediaTek CEO Flags Memory as One of XPU Bottlenecks, Now Making Up 50% of Costs | ||
| Mi | South Korean Fabless Sector Hit by 2025 Losses as AI Lifts Foundry Costs and China Competition Grows | ||
| Di | NVIDIA, Apple Reportedly Court Korean HBM, NAND Talent with Six-Figure Pay Amid AI Memory Boom | ||
| Di | Samsung Electro-Mechanics Reportedly Weighs Double-Digit MLCC Price Hike in April Amid AI Demand | ||
| Di | Apple Reportedly Brings Mac Mini Back to U.S., Taps Foxconn for Assembly Later in 2026 | ||
| Di | ASML Reportedly Demonstrates EUV Light Source That Could Lift Chip Output 50% by 2030 | ||
| Di | Japan Reportedly Offers Half-Cost Fabs and Full Subsidies, Yet Samsung and SK hynix Stay Cautious | ||
| Di | [Sponsored Content] NVIDIA Jetson in Action: How Advantech and AIRECO Are Rewriting the Rules of Recycling with AI | ||
| Di | Lenovo Reportedly Signals March Price Hikes on Select Commercial Devices Amid Memory Shortage | ||
| Mo | Samsung Reportedly Lifts Galaxy S26 Ultra 1TB 20% on Memory Costs, Entry Model Up 5.8% | ||
| Mo | TSMC Speeds up Expansion in Taiwan: up to 10 Fabs Reportedly under Construction or Starting in 2026 | ||
| Mo | PSMC Joins Intel, SoftBank's ZAM Initiative to Manufacture AI Memory, Eyeing an Alternative to HBM | ||
| Mo | Global DDR5 Pricing Update: Europe Reportedly Eases, China's KingBank 32GB Hits Premium Tier |
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