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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | Samsung Reportedly Targets 7 Million Foldable Units in 2026 on Z Fold 7 Momentum | ||
| Fr | Applied Materials Flags a 2026 China Fab Spending Drop Amid Tougher U.S. Export Rules | ||
| Fr | Nexperia China Wafer Stock May Run Out by Mid-December; Carmakers Reportedly Seeking Workarounds | ||
| Fr | U.S. Layoffs in October Reportedly Hit 20-Year High, with Major Tech Firms Leading 2025 Cuts | ||
| Fr | SMIC Posts 29% Year-on-Year Jump in Q3 Profit, Warns of Softer Q4 Margins | ||
| Fr | Samsung Reportedly May Elevate Galaxy Veteran Roh Tae-moon to Vice Chairman in Major Shake-Up | ||
| Do | Kioxia Quarterly Profit Tumbles 62% YoY, But Signals Bottom with Record 3QFY25 Sales Forecast | ||
| Do | HBM4E Seen Hitting 40% of 2027 Market; Samsung, SK hynix Reportedly Aim for 1H26 Completion | ||
| Do | Baidu Rolls Out Kunlun Roadmap, M100 & M300 AI Chips Arrive 2026-2027 | ||
| Do | Synopsys Reportedly to Slash 10% of Workforce After $35 Billion Ansys Acquisition | ||
| Do | NAND Giants Reportedly Cut Output in 2H25 as Prices Surge; Samsung Mulls 20-30% Hike in 2026 | ||
| Do | China's A-Share Chip Firms Reportedly Pour ¥68B into R&D in Q1-Q3 2025 Amid Domestic Push | ||
| Do | Samsung Reportedly Eyes Foundry Profitability by 2027 with 20% Market Share | ||
| Mi | SMIC Reportedly Rations Output as China Faces Widening AI Chip Crunch | ||
| Mi | SK hynix Reportedly Poised for Over 70% Operating Margin for General-Purpose DRAM amid Tight Supply | ||
| Mi | [Insights] Memory Spot Price Update: DRAM Chip Spot Prices Surpass Modules, Signaling Imminent Surge | ||
| Mi | ASML Unveils New Hwaseong Campus, Deepening Ties with Samsung and SK hynix | ||
| Mi | AMD's AI Chips Power Data Center Revenue: $100B Expected in 5 Years with 60% CAGR | ||
| Mi | South Korean Industrial Power Rates Reportedly Soar 75% 2021-25, Squeezing Chip and Display Sectors | ||
| Mi | TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea's DB HiTek | ||
| Di | GlobalFoundries Licenses TSMC's 650V, 80V GaN Tech in Sign of Foundry Leader's Retreat | ||
| Di | SK hynix Reportedly Eyes 321-Layer QLC NAND in 2H26; Future of Solidigm IPO Uncertain | ||
| Di | Intel CTO and AI Chief Departs for OpenAI; CEO Lip-Bu Tan Steps In to Lead AI Push | ||
| Di | Memory Price Surge: Macronix NOR Flash Reportedly +30% in 1Q26, SanDisk NAND Up in Nov. | ||
| Di | SK hynix, Samsung, and SanDisk Bet on HBF - The Next Battleground in Memory Sector |
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