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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 10:15 | Marvell Reportedly Taps TSMC's Sub-3nm, Photonics Tech for Next-Gen ASICs | ||
| 06:14 | Malaysia's AI Chip Curbs Shake Server Supply Chains, May Hit Super Micro and Taiwan's Wiwynn | ||
| 06:14 | NVIDIA's China H20 Sales to Resume After U.S. Commitment, Samsung Poised to Gain from HBM3 Supply | ||
| 05:14 | Rare Earth Rush: China's June Exports Reportedly Hit Highest Level Since 2009 | ||
| 03:15 | Apple Rumored to be Developing 7 In-House Chips | ||
| 02:15 | LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028 | ||
| Mo | Japan Reportedly Demands Golden Share in Rapidus as Condition for JPY 100 Billion Investment | ||
| Mo | Broadcom Reportedly Scraps $1 Billion Chip Investment in Spain | ||
| Mo | Intel on the Move: Nova Lake Reportedly Tapes Out on TSMC's 2nm, with 18A Yields Gaining Speed | ||
| Mo | Intel Raises Oregon Layoffs to 2,400; Reportedly to Cut 4,000 Nationwide by Mid-July | ||
| Mo | Stronger Taiwan Dollar Weighs on TSMC's Q3 Outlook: 5 Key Questions Before July 17 Earnings Call | ||
| Mo | MLS Plans to Acquire 18.77% Stake in BridgeLux from Epistar | ||
| Mo | China's Final 12-Inch Fab AMS Collapses-Another Casualty in Ongoing Chip Project Failures | ||
| Fr | Tariff Uncertainty Could Put Malaysia's Chip Expansion on Ice | ||
| Fr | LG Innotek Unveils Copper Post Substrate Tech for Slimmer Smartphones | ||
| Fr | SK hynix Reportedly Raises DDR4/ LPDDR4X Contract Prices by 20% as Q3 Demand Stays Strong | ||
| Fr | Huawei Reportedly Looks to Sell Ascend 910B in UAE, Saudi Arabia, and Thailand | ||
| Fr | Samsung Reportedly Secures Exclusive OLED Panel Deal for Apple's 2026 Foldable iPhone | ||
| Fr | Marelli Initiated U.S. Chapter 11 Proceedings, Market Landscape to be Reshaped | ||
| Fr | Is the GaN Foundry Model Facing Trouble? China's Innoscience Weighs In as TSMC Plans 2027 Exit | ||
| Do | TSMC Revenue Plunges 17.7% MoM in June as Strong Taiwan Dollar Hits Foundry Sector | ||
| Do | Intel's Harsh Wake-Up Call: CEO Reportedly Says It's No Longer a Top 10 Chipmaker | ||
| Do | Chinese EDA Consolidation Falters as Empyrean Drops Xpeedic Acquisition | ||
| Do | TSMC Reportedly to Break Ground on U.S. Advanced Packaging Plants in 2028, Starting with SoIC | ||
| Do | Cadence to Expand Collaboration with Samsung Foundry |
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