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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 08:15 | Huawei Reportedly Plans 2026 Ascend 950 Sales in South Korea, Targeting Cluster-Level Deployments | ||
| 08:15 | AI Reportedly to Consume 20% of Global DRAM Wafer Capacity in 2026, HBM and GDDR7 Lead Demand | ||
| 05:14 | China's SMEE Reportedly Wins RMB 110M Lithography Tool Contract Amid Domestic Push | ||
| 04:14 | TSMC Dismisses Nanjing Risks as VEU Expires, Flags Global Advanced Capacity for Chinese Clients | ||
| 02:14 | Automakers Race Into the Emerging AI Glasses Arena | ||
| 01:15 | Key Highlights to Watch at CES 2026: From Intel Panther Lake to Qualcomm's Snapdragon X2 Elite | ||
| Do | Japan Develops 10nm Nanoimprint Technology, with Potential to Tackle EUV Bottleneck | ||
| Do | Price Hikes Hit Mature Nodes: SMIC, TSMC Affiliate VIS Reportedly Raise BCD Prices 10% | ||
| Mi | [Insights] Memory Spot Price Update: Kingston Leads DRAM Surge as DDR4, DDR5 and Modules Hold Strong | ||
| Mi | Intel Fab 52 Reportedly Rivals TSMC Arizona Phase 1 and 2 Combined Capacity on More Advanced 18A | ||
| Mi | Apple Reportedly Sources 60-70% of iPhone 17 LPDDR5X from Samsung, Eyeing iPhone 18 Volumes | ||
| Mi | Samsung, SK hynix Reportedly Plan ~20% HBM3E Price Hike for 2026 as NVIDIA H200, ASIC Demand Rises | ||
| Mi | SMIC Reportedly Raises Prices by 10%, Memory Products Lead the Way | ||
| Mi | Intel Reportedly Plans Major CPU Roadmap Shifts: From Hammer Lake to NVIDIA Collaboration | ||
| Mi | [Insights] Early December Panel Prices: TV Panels Expected to Rise in January on Memory Supply Concerns | ||
| Di | Top PC Maker, Likely HP or Lenovo, Reportedly Locks in Memory Supply following Supplier Visits | ||
| Di | ByteDance Reportedly to Boost 2026 AI Spend to $23B, Plans Preliminary 20K H200 Chips Order | ||
| Di | Memory Price Surge Reportedly to Push Samsung, SK hynix Gross Margins Above TSMC in 4Q25 | ||
| Di | Samsung Set to Benefit from TSMC's 'N-2' Rule as AMD, Google Eye U.S. 2nm Production | ||
| Di | Amazon to Restructure AI Teams, Led by Veteran AWS Leadership | ||
| Di | Samsung Reportedly Preps 4:3 "Wide Fold" Phone to Take On Apple, Launch Set for Fall 2026 | ||
| Mo | Xiaomi 17 Ultra Price Hike Reportedly Confirmed: Memory Crunch Forces Notable Increase | ||
| Mo | Micron, SanDisk Reportedly Turn to PSMC to Fast-Track Memory Output Amid Tight Supply | ||
| Mo | China's Moore Threads Unveils Huashan AI Chip, Reportedly Takes Aim at NVIDIA's Hopper | ||
| Mo | U.S. Think Tank Flags DUVi Loopholes as China Pushes Toward Advanced Chips Using Multipatterning |
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