- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11:14 | China's Robot Maker Unitree Heads for IPO at RMB 60.99B Valuation, Backed by DeepSeek and Tencent | ||
| 11:14 | Memory Giants Race Ahead: SK hynix Targets 2029 Yongin Y2 Cleanroom; Samsung Advances P5, P5 Fab 2 | ||
| 09:14 | TSMC and Researchers Overcome 2D Semiconductor Bottleneck with Epitaxial Interface Engineering | ||
| 06:14 | Winbond Says Customers Seek LTAs Through 2030; Adata Expects Even Tighter DRAM Supply in 2027 | ||
| 06:14 | SK hynix's U.S. NAND Unit Solidigm Reportedly Eyes Nasdaq - But Debt and Aging Fabs Cloud the Path | ||
| 03:14 | 18 Chinese Enterprises Accelerate Positions in Glass Core Substrate Market | ||
| 02:15 | China's Big Fund Phase III Pivot: From Fab-Building to Advanced Packaging, Equipment, and AI Chips | ||
| 02:15 | Tesla's Terafab Takes Shape in Texas with $16.8B First Phase; Memory Engineering Hiring Signals DRAM Push | ||
| Do | Samsung Reportedly Eyes Galaxy S27/S28 DDI Dual Sourcing Beyond System LSI Amid Rising Memory Costs | ||
| Do | Nittobo Raises FY2027 Net Profit Forecast by JPY 3B; No Further T-Glass Price Hikes Planned | ||
| Do | Nanya Tech Unveils Up to US$10.7B Fab 5A Investment Plan Through 2029; Targets 10nm-Class DRAM with EUV | ||
| Do | Sandisk's Gross Margin Guidance Flatlines at 83-85%: What's Inside Its New Business Model Contracts? | ||
| Do | Xiaomi, OPPO Invest in MicroPowerChip as China's Smartphone Makers Expand In-House Power Chip Footprint | ||
| Do | InP Shortage Emerges as AI Optical Interconnect Bottleneck | ||
| Mi | [Insights] Early August Panel Prices: TV Price Declines Moderate; MNT and NB Stay Flat as Cost Pressures Persist | ||
| Mi | TSMC Reportedly Expands Outsourcing of Key CoWoS Front-End Step to OSATs Amid Rising NVIDIA, ASIC Demand | ||
| Mi | [Insights] Memory Spot Price Update: DRAM Spot Price Gains Slow, While DDR4 and DDR3 Continue Uptrend | ||
| Mi | U.S. Export Curbs Backfire? Samsung, SK hynix Reportedly Mull AMEC's Tools as China Fab Backup | ||
| Mi | Samsung Unveils Industry-First 400+ Layer V10 BV-NAND; Memory Density Up 58% vs. V9 | ||
| Mi | Qualcomm's Sep. Chip Price Hikes Revealed, Premium Flagships Face Steepest 10-15% Increase | ||
| Mi | "Compute Metals" Skyrocket in Price | ||
| Mi | Samsung Expected to Showcase zHBM at FMS 2026, a Next-Gen 3D Memory Architecture with 4X Bandwidth | ||
| Di | NVIDIA RTX 50 Prices in Korea May Rise Up to 30% From Aug. on Higher TSMC Wafer and GDDR7 Memory Costs | ||
| Di | CXMT Reportedly Eyes Second Beijing 12-inch DRAM Fab; HP, Asus, and Acer Said to Begin Limited Use | ||
| Di | PSMC Reportedly Becomes Intel's Exclusive EMIB Silicon Capacitor Supplier; UMC May See Order Boost |
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