- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 05:14 | Amazon Reportedly Cutting Jobs at AWS Greater China, Up to 30% of Staff Affected | ||
| 04:14 | China Opens Analog Chip Dumping Probe Against TI, Broadcom and Others Over 300% Margin | ||
| 03:15 | Infineon Reportedly Set to Build RISC-V Auto MCUs at TSMC Dresden Fab, Mass Production in 2028 | ||
| 02:14 | What Comes After HBM? NAND-Stacked HBF May Power AI's Future | ||
| Fr | Micron Freezes Prices as Inference AI Fuels Surge in SSD Demand and Supply Shortages | ||
| Fr | Intel Double Hit: Xeon CPU Chief Architect Exits, Ohio Lobbyist Out as Project Stalls | ||
| Fr | HiSilicon Taps Tech Veteran Gao Ji as Chairman After Eric Xu's Exit Amid Huawei's Chip Push | ||
| Fr | SK hynix Finalizes World's First HBM4, Mass Production Ready, Eyes NVIDIA Approval | ||
| Fr | FOPLP Trial Yields Reportedly Reach 90% at Powertech as TSMC Advances CoPoS Development | ||
| Fr | Samsung Reportedly Expands 1c DRAM Capacity for HBM4, Targeting 60K Wafers Monthly in 2025 | ||
| Fr | Micron Reportedly Reveals Detailed Site Plan for New York Fab, November Land Clearing Expected | ||
| Do | Kioxia Reportedly Eyes 2027 Launch for NVIDIA-Partnered AI SSDs with 100x Speed Boost | ||
| Do | Amazon Reportedly Plans Late-2026 Debut of First AR Glasses, Taking On Meta | ||
| Do | China's Naura Posts 8x SEMES Profit in 1H25, Shaking Korea's Chip Equipment Sector | ||
| Do | Taiwan DRAM Makers Reportedly Eye 20-50% Q4 Contract Price Hikes amid DDR4 Supply Squeeze | ||
| Do | SK hynix Partners with Naver Cloud to Test CXL, PIM Memory Tech, Reportedly Eyes Major CSPs | ||
| Do | South Korea to Double SiC Self-Sufficiency to 20% by 2030 Amid Chip Independence Push | ||
| Mi | Intel Reportedly Reaffirms Glass Substrate Roadmap, Pilot Line Rumored in 2025 | ||
| Mi | [Insights] Memory Spot Price Update: SanDisk's 10% Price Hike Meets Demand-Side Resistance | ||
| Mi | Synopsys Reportedly to Cut 10% Staff by FY26; China, Foundry Woes Expected Through 4Q | ||
| Mi | TSMC Reportedly Speeds Advanced Packaging Ramp to Three Quarters, Stresses Local Equipment | ||
| Mi | Decoding Apple's Latest Silicon: How A19, A19 Pro, C1X, and N1 Power the iPhone 17 Lineup | ||
| Mi | Samsung Reportedly to Build Panels for Apple's First OLED MacBook, Debut Expected 4Q26 | ||
| Mi | Ant Group Accelerates Semiconductor Investment Push | ||
| Di | Samsung Reportedly Prepping Notebooks with Intel's Panther Lake, Shipment Logs Reveal |
Sie erhalten auf FinanzNachrichten.de kostenlose Realtime-Aktienkurse von und .