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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11:15 | Xiaomi's Next Foldable Reportedly to Feature Self-Developed XRING O3 Chip, May Use 3nm Process | ||
| 09:15 | CXL May Emerge as Post-HBM Battleground; Samsung Reportedly Presents System with 10× Performance Gain | ||
| 05:14 | TSMC CoWoS Wafer ASP Reportedly Nears 7nm Levels; Advanced Packaging to Become a Key Profit Driver | ||
| 05:14 | Macronix NAND Sales Jump 382% YoY on Samsung's MLC Exit, Shifts to Monthly Pricing Amid Deepening Crunch | ||
| 03:15 | China Inference GPU Firm Sunrise Secures Over RMB 1B in Funding, Valuation Reportedly Exceeds RMB 10B | ||
| 02:14 | Moore Threads Reportedly Turns Profitable in 1Q26 but Remains Loss-Making in 2025 as R&D Hits RMB 1.3B | ||
| Mo | Intel Reportedly Sells Chips Typically Scrapped as CPU Demand Surges; 1Q26 Server CPU ASPs Up 27% | ||
| Mo | TEL Fined $5M in TSMC Trade Secrets Case; Former China Executive Left Over Links to Chinese Chip Tool Startups | ||
| Mo | TSMC 3nm Monthly Capacity May Hit 180K Wafers by 2026, Up Over 40% YoY on AI Demand | ||
| Mo | Samsung's May Strike Seen Disrupting Up to 4% of DRAM Output, With Weeks-Long Recovery Risk | ||
| Mo | OpenClaw's Popularity Ignites the AI Agent Trend: Advantech and D8AI Join Forces to Lower Barriers and Accelerate Enterprise Adoption | ||
| Mo | New Thermal Management Breakthrough: GaN-on-Sapphire Substrate Thinned to 50µm | ||
| Mo | MicroLED Gains Focus as Seoul Semiconductor Plans $180M AR Investment, Aledia Reports Breakthrough | ||
| Fr | Japan Photoresist Suppliers Flag Shortage Amid >40% Middle East Naphtha Reliance, Risks for Chipmakers | ||
| Fr | Samsung Reportedly Produces Sub-10nm 10a DRAM Working Die Using 4F Square, VCT, Targets 2028 Production | ||
| Fr | ASML's 1,700 Job Cuts Reportedly Target Management Roles; Summer Hiring Freeze Planned | ||
| Fr | Samsung, Kingston Reportedly Lift SSD Prices by Over 10%, More Hikes Likely in Coming Weeks | ||
| Fr | Intel Says AI Inference Pushes CPU Ratio From 1:8 Toward 1:1; 18A Yield Target Advanced to Mid-Year | ||
| Fr | Huawei Launches AI Glasses as Meta Leads the Market; Samsung, Apple Reportedly Eye 2026-2027 Entry | ||
| Fr | JEDEC Previews LPDDR6 Enhancements, Develops SOCAMM2 Standard for AI Memory | ||
| Do | Micron Reportedly Urges Tighter U.S. Chip Equipment Curbs on China; Toolmakers Seek Relief | ||
| Do | TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027 | ||
| Do | Intel Tapped as Tesla Wins First 14A Customer Spot in Terafab Push | ||
| Do | AI Ignites Global VC and Startup Boom: Energy and AI Emerge as Dual Engines for Propelling Taiwan's Innovations | ||
| Do | SK hynix Reports 5x 1Q26 Profit Surge; Operating Margin Hits 72%, Outpacing TSMC and Micron |
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