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Analysten-Kursziel über dem Dreifachen: Knackt die Aktie jetzt den Trend?
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Aktuelle News von TrendForce

  • 24 h
  • letzte 200 News
ZeitAktuelle Nachrichten
09:15Apple iPhone Duo Faces Reported Hinge Defects; Shipment Target Seen Up 44% on Strong Demand
08:14NVIDIA's Memory Shake-Up: Rubin Ultra Rethinks 12-Hi HBM4E for 8-Hi HBM4, Rubin GPU Bandwidth Cut 13%
03:15TSMC Reportedly Eyes 20% CoWoS Price Hike, Skips Equipment Price Renegotiations Amid AI Demand Surge
02:15Vuzix Enters Optical Interconnect, San'an Backs Micro LED Startup, Hint at AI Transmission Market
01:15World's First Ampere-Level Vertical Gallium Oxide MOSFET Developed
MoSICC Reports 2,330.24% Surge in Net Profit for First Three Quarters
MoSK hynix 3Q Earnings Preview: Record Profit at 78% Operating Margin; HBM4, LTAs, Solidigm in Focus
FrInfineon and NVIDIA Expand GaN Power Collaboration for AI Data Centers
FrSouth Korea's LX Semicon Sells More Than 60 Patents, Marking its Exits from SiC Market
DoTesla Reportedly to Invest KRW 1.1T to Secure Samsung Electro-Mechanics Substrate Capacity; NVIDIA Also Commits
DoMicron Reportedly Rules Out 4F² DRAM Scaling, Backs 6F² and 3D DRAM in Next-Gen Memory Roadmap
DoPSMC Q3 Gross Margin Hits 48% on Memory Price Gains; Eyes 10-20% Mature-Node Price Hikes in 2027
DoIntel Begins Equipment Installation at Arizona Fab 62, Targeting 2028 Operations; Ohio One Advances
Do[Breaking] Google Reportedly Sticks With Intel EMIB-T Despite 35% Substrate Yields as HumuFish Schedule Tightens
DoNVIDIA-Linked Groq Reportedly Eyes Shift From SRAM to 3D-Stacked DRAM for Next-Gen AI Chips
DoNVIDIA Unveils Next-Gen CPO Prototype With Optics on Silicon Interposer, Targets Higher Bandwidth Density
MiSamsung, SK hynix Reportedly Push China NAND Upgrades Beyond 200 Layers as YMTC Competition Heats Up
MiApple Signs Up to US$100M Titanium Deal for Products Including iPhone Duo; TSMC Arizona to Supply 100M+ Chips
Mi[Insights] Memory Spot Price Update: DDR5 Supply Tight, DDR4 Trading Weak Despite 0.84% Gain in Mainstream Prices
MiMusk Targets Terafab Chip Volume Production in 3Q28, First SRAM Test Chip by Mid-2027
MiNVIDIA RTX PRO 5500 Reportedly Draws $35B in China Orders, with Supply Seen at Just 5-10%
MiFudan University Spin-Off Nexilumen Advances Micro LED Optical Interconnect, Achieving 37 Gbps Bandwidth
MiSamsung Reportedly Eyes Over 10% Output Increase for 2nm Exynos 2700 to Revive Non-Memory Business
20.10.Unimicron Warns of IC Substrate Crunch: Up to 30-Month Equipment Lead Times, 20% Material Gap in 2027
20.10.DRAM Prices Seen Rising 20% QoQ in 4Q26 Despite Slower Gains; AI Demand, Tight Supply Support Outlook