SUSS MicroTec (FWB:SMH)(GER:SMH), the world leading
supplier of full-field exposure systems, today announced that it has
already received eight orders for a total of thirteen machines for its
brand-new MA200Compact. Seven machines have been installed last year,
the rest will be shipped in 2006. The MA200Compact is a production
full-field exposure system featuring a new concept, that enables the
use of cost effective mask aligner technology in areas where 1x
steppers used to dominate. All customers chose the MA200Compact over
alternative systems due to its high precision, low cost of ownership
and flexibility for processing wafers of different sizes and photo
resist thickness.
"With the MA200Compact SUSS MicroTec has developed a fab-friendly mask aligner featuring the most compact footprint and the highest precision available for a production aligner today", comments Lorenz Ziegltrum, Business Manager for Mask Aligners at SUSS. "The system combines proven technology from our mask-alignment and coat/develop clusters with innovative features such as the patent pending DirectAlign(R) option. With a guaranteed alignment accuracy of 0.5 microns at 3 sigma DirectAlign increases the mask aligner process window for a variety of applications such as thick resist MEMS, and wafer level packaging. The new capabilities of the SUSS MA200Compact also enable it to overcome existing resolution limitations for ultra fine-pitch gold bumping."
Thick resist photolithography is an indispensable element of MEMS processing, wafer bumping and advanced wafer level packaging in general. The MA200Compact can be equipped with high resolution exposure optics enabling near vertical sidewalls at highest aspect ratios in resist films up to 100 microns and thicker. In addition, the MA200Compact supports SUSS SupraYield, a patented package of technology enhancements, which increases resolution, improves overlay accuracy and boosts wafer yield. SupraYield enables cost effective mask aligner technology to meet even the most demanding performance criteria.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com
"With the MA200Compact SUSS MicroTec has developed a fab-friendly mask aligner featuring the most compact footprint and the highest precision available for a production aligner today", comments Lorenz Ziegltrum, Business Manager for Mask Aligners at SUSS. "The system combines proven technology from our mask-alignment and coat/develop clusters with innovative features such as the patent pending DirectAlign(R) option. With a guaranteed alignment accuracy of 0.5 microns at 3 sigma DirectAlign increases the mask aligner process window for a variety of applications such as thick resist MEMS, and wafer level packaging. The new capabilities of the SUSS MA200Compact also enable it to overcome existing resolution limitations for ultra fine-pitch gold bumping."
Thick resist photolithography is an indispensable element of MEMS processing, wafer bumping and advanced wafer level packaging in general. The MA200Compact can be equipped with high resolution exposure optics enabling near vertical sidewalls at highest aspect ratios in resist films up to 100 microns and thicker. In addition, the MA200Compact supports SUSS SupraYield, a patented package of technology enhancements, which increases resolution, improves overlay accuracy and boosts wafer yield. SupraYield enables cost effective mask aligner technology to meet even the most demanding performance criteria.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com