DUBLIN, February 25, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/wtn63t/infineon_sp37) has announced the addition of the "Concise Analysis of the International Infineon SP37 Tire Pressure Monitoring Sensor Market" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.
The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.
The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.
This report will provide a complete teardown of the TPMS with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation
Key Topics Covered:
Glossary
Overview/Introduction
Infineon Company Profile
Physical Analysis
Physical Analysis Methodology
Package
- Package Views, Dimensions & Marking
- Package X-Ray
- Package Opening
- Package Cross-Section
ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks
- Cross-Section
- Process Characteristics
MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed
- Sensing Area
Cross-Section:
- Accelerometer Cross-Section
- Pressure Sensor Cross-Section
Manufacturing Process Flow
Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow & Assembly Unit
Cost Analysis
Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Wafer & Die Cost
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Front-End Cost per process steps
- MEMS Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- Component Cost
Estimated Price Analysis
Infineon Financial Ratios
- SP37 Estimated Price
For more information visit http://www.researchandmarkets.com/research/wtn63t/infineon_sp37
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
