DUBLIN, Dec. 12, 2014 PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/w8qm3v/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Reverse Costing Analysis" report to their offering.
http://photos.prnewswire.com/prnh/20130307/600769
Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.
The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.
Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35% reduction in silicon area for the MEMS die, enabling a significant cost advantage.
Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.
Key Topics Covered:
Glossary
Overview/Introduction , Maxim Company Profile
Physical Analysis
Package
Package Views & Dimensions
Package Pin Out
Package Opening
Wire Bonding Process
Package Cross-Section
ASIC Die
View, Dimensions & Marking
Delayering
Main Blocks Identification
Cross-Section
Process Characteristics
MEMS Die
View, Dimensions & Marking
Bond Pad Opening
Cap Removed & Cap Details
Sensing Area Details
Cross-Section (Sensor, Cap & Sealing)
Process Characteristics
Manufacturing Process Flow
Global Overview
ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow
Package Assembly Unit
Cost Analysis
Main steps of economic analysis
Yields Hypotheses
ASIC Front-End Cost
ASIC Back-End 0: Probe Test & Dicing
ASIC Wafer & Die Cost
MEMS Front-End Cost
MEMS Back-End 0: Probe Test & Dicing
MEMS Front-End Cost per process steps
MEMS Wafer & Die Cost
Back-End: Packaging Cost
Back-End: Packaging Cost per Process Steps
Back-End: Final Test Cost
MAX21000 Component Cost
Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/w8qm3v/maxim_integrated
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