DUBLIN, Dec. 15, 2014 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/rls2j8/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21100 - 6-Axis MEMS IMU Technology Analysis" report to their offering.
http://photos.prnewswire.com/prnh/20130307/600769
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0Ö3.0Ö0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Discover all the details in the report!
The Technology Analysis report provides information on Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis is also available, for more information please click on the link below.
Key Topics Covered:
1. Glossary
2. Overview/Introduction , Maxim Company Profile
3. Physical Analysis
Package
- Package Views & Dimensions
- Package Opening
- Wire Bonding Process
- Package Cross-Section
ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks Identification
- Cross-Section
- Process Characteristics
MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening
- Cap Removed & Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap & Sealing)
- Process Characteristics
Consumer 6-Axis IMU Comparison
4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow & Assembly Unit
For more information visit http://www.researchandmarkets.com/research/rls2j8/maxim_integrated
About Research and Markets
Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
