DUBLIN, Dec. 18, 2014 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/c4cggw/apple_iphone_5s) has announced the addition of the "Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony - Technology Analysis" report to their offering.
http://photos.prnewswire.com/prnh/20130307/600769
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
Please note:
The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis report is also available. For more information please click on the link below.
Key Topics Covered:
CAMERA MODULE SUPPLY CHAIN & COMPANIES PROFILE
Physical Analysis
Camera Module
- Camera Module View & Dimensions
- Camera Module X-Ray
- Camera Module Disassembly
CMOS Image Sensor
- View & Dimensions
- Pads, Tungsten Grid
- TSV Connections
- CIS Pixels
- Logic Circuit (Transistors, SRAM)
Cross-Section: Camera Module
- Overview
- Driver (Assembly & Process) & MLCC
- Ceramic Substrate, IR Filter & FPC
- Lenses, Housing, VCM
Cross-Section: CMOS Image Sensor
- Overview
- Pad Trenches
- Pixel Array Circuit
- Logic Circuit
- TSVs
Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony
CIS MANUFACTURING PROCESS FLOW
- Global Overview
- Logic Circuit Front-End Process
- Pixel Array Circuit Front-End Process
- BSI + TSV + Microlenses Process
- CIS Wafer Fabrication Unit
For more information visit http://www.researchandmarkets.com/research/c4cggw/apple_iphone_5s
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
