Anzeige
Mehr »
Login
Donnerstag, 25.04.2024 Börsentäglich über 12.000 News von 687 internationalen Medien
Wie die Revolution der sauberen Energie eine solide Investitionsmöglichkeit bieten könnte
Anzeige

Indizes

Kurs

%
News
24 h / 7 T
Aufrufe
7 Tage

Aktien

Kurs

%
News
24 h / 7 T
Aufrufe
7 Tage

Xetra-Orderbuch

Fonds

Kurs

%

Devisen

Kurs

%

Rohstoffe

Kurs

%

Themen

Kurs

%

Erweiterte Suche
GlobeNewswire (Europe)
44 Leser
Artikel bewerten:
(0)

STMicroelectronics: ICT-STREAMS EU Project Sets to Develop Technologies for Multi-Terabit On-Board Chip-to-Chip Communications

Thessaloniki, Greece, June 23, 2016 -- ICT-STREAMS, a part of the European Union Horizon 2020 program, is a new ambitious project that was launched on 1st February 2016 with the goal to develop the necessary set of transceiver and routing technologies to enable multi-terabit on-board chip-to-chip communications.

The ever-growing demands of mega data centers and high-performance computers for increased bandwidth at a fraction of real-estate and power consumption are pushing current pluggable optics interconnection solutions to their limits. ICT-STREAMS research efforts are aligned with the next generation embedded optical transceivers, placed on-board and in close proximity to the electronic modules, as a way to drastically reduce the required physical space and power budget. To this end, the three year research project aims to develop a set of innovative technologies for the optical engines and board platform and combine them in a radically new approach of Wavelength Division Multiplexing (WDM) routing architecture in order to increase the state of the art server-board density by >400% and throughput by 1600%, with a 10 fold reduced energy consumption.

ICT-STREAMS will exploit silicon photonics technology in order develop ultra-powerful, compact, Dense Wavelength Division Multipling (DWDM), high channel count and dense embedded optical engines with the ability to exhibit aggregate throughputs beyond 1Tb/s. ICT-STREAMS will also develop a thermal drift compensation system employing a non-invasive wavelength monitoring and control technology to guarantee real-life applicability of the proposed multi-channel Si-Pho technology. On the board level, a single mode polymer-based electro-optical PCB (EOPCB) will be developed to serve as the host platform that will efficiently route both optical and high frequency electrical data across the board. As a way to relax manufacturing time and cost requirements associated with complex optical assembly processes, optical engines will rely on novel III/V-on-Si in-plane lasers for optical sourcing while adiabatic coupling will be employed for I/O interfacing with the electro-optical PCB host platform. Finally, ICT-STREAMS will assemble the new optical engines on the polymer EOPCB together with a 16x16 AWGR-based routing component to leverage WDM technology from just a parallel transmission tool to a massive any-to-any, collision-less and low latency routing platform with 25.6Tb/s aggregate throughput capability. Photonic crystal based III/V-on-Si nano-amplifiers will be introduced as a new amplification paradigm to enable optical power balanced links with advanced features and smart routing functionalities.

The project is scheduled to run for three years bringing together 3 leading industrial partners, 1 small-medium enterprise and 5 top-ranked academic and research institutes in the optical interconnects value chain. Project partners are Aristotle University of Thessaloniki (Greece) that is also coordinating the project, Centre National de la Recherche Nationale (CNRS) - Laboratoire de photonique et de nanostructures (LPN) (France), IBM Research Zurich GmbH (Switzerland), Interuniversitair Micro-Elektronica Centrum - IMEC (Belgium), Politecnico di Milano (Italy), STMicroelectronics (Italy), iMinds (Belgium), Vario Optics AG (Switzerland), FCI Connectivity (Germany). The project will share open information through its newly launched website: www.ict-streams.eu.




This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: STMicroelectronics via Globenewswire

HUG#2022761
Großer Insider-Report 2024 von Dr. Dennis Riedl
Wenn Insider handeln, sollten Sie aufmerksam werden. In diesem kostenlosen Report erfahren Sie, welche Aktien Sie im Moment im Blick behalten und von welchen Sie lieber die Finger lassen sollten.
Hier klicken
© 2016 GlobeNewswire (Europe)
Werbehinweise: Die Billigung des Basisprospekts durch die BaFin ist nicht als ihre Befürwortung der angebotenen Wertpapiere zu verstehen. Wir empfehlen Interessenten und potenziellen Anlegern den Basisprospekt und die Endgültigen Bedingungen zu lesen, bevor sie eine Anlageentscheidung treffen, um sich möglichst umfassend zu informieren, insbesondere über die potenziellen Risiken und Chancen des Wertpapiers. Sie sind im Begriff, ein Produkt zu erwerben, das nicht einfach ist und schwer zu verstehen sein kann.