DUBLIN, Feb .18, 2015 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/lmznkw/seek_thermal) has announced the addition of the "Seek Thermal Infrared Camera & Raytheon IR Microbolometer - Reverse Costing Analysis" report to their offering.
Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, Raytheon enters in the consumer market.
The Seek Thermal camera has a very compact size and is compatible with Android smartphones via its micro-USB connector. The camera performs its calibration automatically thanks to an electromechanical shutter assembled on the electronic board. The device also includes a chalcogenide lens inserted in a zinc lens housing.
The thermal camera uses a new 12µm pixel design from Raytheon. The EXC001 microbolometer, is featuring a 206Ö156 pixels resolution, 6 times the resolution of the FLIR One. The sensor technology in the Raytheon component is an uncooled VOx microbolometer and a 2 levels structure. Thanks to its strong integration at the die level with a wafer-level packaging (WLP), this is the world's smallest microbolometer-based thermal imaging camera die.
Based on a complete teardown analyses of the Seek Thermal Camera and the Raytheon microbolometer, the report provides the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
Key Topics Covered:
1. SEEK THERMAL Camera
Overview/Introduction, Main Features
Teardown
- Packaging
- Views and Dimensions of the Housing
- Seek Thermal Camera Disassembly
- Chopper Module
- Lens Module
- Electronic Board
- High Definition Photos & PCB Markings
- Components Markings & Identification
Cost Analysis
Accessing the BOM
- Estimation of the cost of the PCB
- BOM Cost - Electronic Board, Housing and Packagin
- Material Cost Breakdown
Accessing the Added Value (AV) Cost
- Electronic Board Manufacturing Flow & AV Cost
- Housing & Packaging Assembly AV Cos
- Added Value Cost Breakdown
- Estimation of the Manufacturing Price
2. EXC001 Infrared Camera Module
Overview/Introduction, Company Profiles, Main Features
Physical Analysis
EXC001 Microbolometer
- View & Dimension
- Disassembly & Cross-Section
Infrared Sensor
- Microbolometer & ROIC Views & Dimensions
- Pixel Details, Delayering
- Cross-Section & Process Characteristics
Manufacturing Process Flow
- ROIC Process & Microbolometer Process Flow
- Wafer Fabrication Unit
Cost Analysis
- Yield Hypotheses
- ROIC & Microbolometer Wafer & Die Cost
- ASIC Wafer & Die Cost
- EXC001 die Cost & Price
For more information visit http://www.researchandmarkets.com/research/lmznkw/seek_thermal
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