DALLAS (dpa-AFX) - Texas Instruments Inc (TXN), the world's largest analog chip maker, late Wednesday announced that it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility.
According to the firm, the addition of this manufacturing process in Chengdu further increases its 300mm analog capacity and its ability to support customer demand.
Texas Instruments announced the new operation today in concert with an event celebrating the grand opening of its seventh assembly/test facility. The 358,000 square-foot A/T facility was purchased from UTAC Chengdu Ltd. in December 2013 and is now qualified and in production using advanced quad-flat no-leads packaging technology.
Wafer bumping is a manufacturing process for advanced packaging technologies, which is completed prior to assembly. The process replaces wire bonding as the interconnection by applying solder, in the form of bumps, or balls, to a device at the wafer level.
It was in 2010 that the company began its manufacturing investment in China with the opening of the company's first wafer fabrication plant in Chengdu.
The company said it will now further extend its operations in Chengdu with a 300mm wafer bumping facility on its Chengdu High-tech Zone (CDHT) campus.
This investment plan does not change the firm's capital spending forecast. The company continues to expect its capital spending levels to remain about 4 percent of revenue.
Copyright RTT News/dpa-AFX