ALBUQUERQUE, N.M., Nov. 29 /PRNewswire-FirstCall/ -- Surfect Holdings, Inc. (BULLETIN BOARD: SUFH) , announced today that its subsidiary, Surfect Technologies, Inc., a design and manufacturing company offering an innovative single-cell electroplating tool and process for the semiconductor industry, has completed a single chamber electroless machine sale with a major customer in Japan. Surfect Technologies, Inc. is taking an aggressive position in the marketplace with the introduction of their new product offerings.
Electroless technology is becoming an important element of wafer scale packaging growth particularly as DRAM, Flash, and other memory technologies adopt stacked die and other wafer based packaging configurations. The use of electroless metal plating is key for producing cost-effective RFID components. Use as metallization on the backside of wafers enables a low thermal metal path for attachment of heat sinks and thermal devices critical for processor and graphic IC performance. The use of electroless bump metallization in wafer scale packaging is expected to increase 40% per year from 1.8M wafers in 2005 to over 5.1M wafers by 2008 according to Techsearch International's latest study. Electroless technology is expected to play a key role in recently announced wafer packaging technology being developed by major semiconductor companies.
Surfect Technologies' innovative single-cell electro-deposition process and tool capabilities enable low-cost manufacturing of bumps and metal interconnect on wafers (200mm or 300mm) with improved repeatability at high speeds. The Surfect machine Models; Rio E-Less and Leapfrog 300mm, provide customers with the high utilization rates needed to meet the demanding production needs of wafer bumping and through-hole via plating. Commenting on the Rio E-Less sale, Surfect CEO, Mr. Steve Anderson, stated, "We are very excited to have this opportunity to place our first electroless tool in the Japanese market. Japan is a very important market for Surfect and we will work diligently with our customer to make certain that our Rio E-Less tool is an asset to their development center program."
About Surfect Holdings, Inc.
Surfect Holdings, through its operating subsidiary Surfect Technologies, Inc., is a design and manufacturing company offering an innovative single-cell electroplating tool and process that utilizes the industry's first, programmable Plating Computer(TM) to fabricate high performance, low-cost interconnects, providing immediate solutions to the back end of the semiconductor manufacturing process. Additional information is available on the Surfect Technologies website at http://www.surfect.com/ .
Safe Harbor
Certain statements contained in this press release are "forward-looking statements" within the meaning of applicable federal securities laws, including, without limitation, anything relating or referring to future financial results and plans for future business development activities, and are thus prospective. Forward-looking statements are inherently subject to risks and uncertainties some of which cannot be predicted or quantified based on current expectations. Such risks and uncertainties include, without limitation, the risks and uncertainties set forth from time to time in reports filed by the company with the Securities and Exchange Commission. Although the company believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Consequently, future events and actual results could differ materially from those set forth in, contemplated by, or underlying the forward-looking statements contained herein. The company undertakes no obligation to publicly release statements made to reflect events or circumstances after the date hereof.
Contacts
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Mark Eichhorn, Surfect Technologies, Inc.
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