Tessera Technologies, Inc. (Nasdaq: TSRA), a leading provider of miniaturization technologies for the electronics industry, today announced that Electronic Products Magazine has named its OptiMLâ„¢ Wafer Level Camera (WLC) technology as a Product of the Year. The Product of the Year Awards honors products the publication's editors deem as the "most outstanding. The editors of Electronic Products, a leading trade publication for electronic design engineers, evaluated thousands of products launched in 2007 on the basis of innovative design, significant advancement in technology or application and substantial achievement in price and performance.
The 2007 Product of the Year Awards were announced in the January 2008 issue of Electronic Products. This marks the 32nd anniversary of Electronic Products' Product of the Year Awards, which began recognizing the best products in the industry in 1977. The complete article, featuring all winners, can be found at: www.electronicproducts.com/ShowPage1.asp?FileName=poy.jan2008.html.
"We are extremely grateful to the editors of Electronic Products, an established and well-respected publication, for recognizing our OptiML WLC technology as outstanding and worthy for inclusion in their 32nd Annual Product of the Year Awards, said Michael Bereziuk, COO, Tessera. "Tessera has a reputation for bringing innovative, miniaturized packaging solutions to both the semiconductor and micro-optics markets, so we're extremely pleased by the market and technology validation represented with this award.
According to Gartner Dataquest, the market for cameras in electronic products such as cellular phones, laptops, PDAs and security electronics continues to show strength. The industry analyst group projects the camera phone market alone to reach more than one billion units in 2011.
The OptiML WLC technology is designed to significantly advance the integration of miniaturized cameras in mobile phones, personal computers, security cameras and other electronics. By enabling cameras to be manufactured at the wafer level, it drastically reduces the size and total bill of material cost of camera modules. Using OptiML WLC technology, thousands of lenses can be manufactured simultaneously on a wafer and then bonded at the wafer level to create the optical element of the camera. By using reflow-compatible materials to build the lenses, the camera assembly is simplified, enabling reduced costs. OptiML WLC technology also reduces the size of the camera to a minimum, delivering up to 50 percent of size reduction over conventional modules in today's camera phones.
"OptiML technology makes Tessera the first company to take full advantage of semiconductor fabrication techniques to create a complete camera module with optics, said Richard Comerford, optoelectronics editor, Electronic Products Magazine. "Not only is it the smallest, most economical device of its kind, but it's a perfect match for the automated high-speed board fab processes used to create today's consumer electronics.
About Tessera
Tessera Technologies, Inc. (Nasdaq:TSRA) is a leading provider of miniaturization technologies for the electronics industry. The company provides a broad range of advanced packaging, interconnect, and consumer optics solutions which are widely adopted in high-growth markets including consumer, computing, communications, medical and defense electronics. Tessera's customers include the world's top semiconductor companies such as Intel, Samsung, Texas Instruments, Toshiba, Micron and Infineon. The company's stock is traded on the Nasdaq National Market under the symbol TSRA. Tessera is headquartered in San Jose, California. For information call 1.408.894.0700 or go to. www.tessera.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2006 and its Quarterly Report on Form 10-Q for the quarter ended March 31, 2007 include more information about factors that could affect the company's financial results.
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