SAN FRANCISCO, Sep 9, 2013 /PRNewswire/ -- Intel Developer Forum --Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced the availability of an SFF-8639 interposer card for analysis of dual ported Solid State Drives (SSDs) based on PCI Express® protocol. The SFF-8639 dual port Interposer Card, used with Summit Protocol Analyzers, enables PCIe® bus traffic between a host backplane and dual port SSD device to be monitored, captured, and recorded for protocol analysis. The SFF-8639 dual port interposer supports PCIe host interfaces such as NVM Express (NMVe) and SCSI Express (SOP/PQI), protocols at data rates from 2.5 GT/s up to 8 GT/s and lane widths of x2 per port.
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"Earlier this year, Teledyne LeCroy introduced the SFF-8639 Single Port Interposer for early adopters who were using this new type connector on PCIe based SSDs and systems. Dual port SSD system developers needed the same ease of connectivity and reliable probing for their test set ups," said John Wiedemeier, Product Marketing Manager in the Protocol Solutions Group, Teledyne LeCroy. "The new SFF-8639 dual port interposer will support SSD monitoring for each individual A or B port or when both ports are active simultaneously as in a dual port mode configuration test set up."
"Storage developers who are designing high reliability and performance systems are looking to employ the features of NVM Express in mission critical server systems," said Jim Pappas, Director of Technology Initiatives, Intel Corporation. "The NVM Express community requires robust protocol analysis tools, and Intel is delighted to see Teledyne LeCroy developing products to support NVMe enterprise storage systems."
The SFF-8639 dual port interposer provides connectivity and monitoring capability for dual ported SSDs targeted at enterprise storage equipment that use the SFF-8639 connector. Dual ported SSDs provide two separate data paths providing higher performance and greater data redundancy for enterprise storage environments. The SFF-8639 dual port interposer can be used with 2-1/2" or 3" sized drives. To use this interposer, the drive is inserted into a drive tray on the interposer that supports a mechanical and electrical connection to a SFF-8639 connector. The interposer taps all PCIe protocol traffic between the host backplane and the storage device and records it on two PCIe protocol analyzers with each port data time synchronized, where protocol issues and performance metrics can be further analyzed and debugged.
"The storage industry looks to SCSI Express technology to address the needs of higher performance, data availability and solid reliability required by its customers in building its next generation of storage systems," said Martin Czekalski, President of the SCSI Trade Association and Interface Architecture Initiatives Manager, Seagate Technology. "Companies like Teledyne LeCroy have supported the SCSI Express community with both protocol analysis and test tools. The new SFF-8639 dual port interposer will make it possible to accurately monitor both data port paths simultaneously during system development and interoperability test."
Three years ago, Teledyne LeCroy was the first company to introduce a PCI Express protocol analyzer with NVM Express (NVMe) decoding functionality. Since that time Teledyne LeCroy has added decoding for SCSI Express (SOP/PQI) and SATA Express (AHCI/PCIe). Integrating all three PCIe® SSD technologies into a single protocol analyzer gives developers versatile tools that can show essential details regarding proper data transmission and bus performance. These tools have been at the center of much of the PCIe SSD interoperability testing that has occurred over the last few years.
Availability
The SFF-8639 Dual Port Interposer is available to order now. For additional information, contact Teledyne LeCroy at 1-800-5LeCroy (1-800-553-2769) or visit Teledyne LeCroy's web site at teledynelecroy.com.
About Teledyne LeCroy
Teledyne LeCroy is a worldwide leader in serial data test solutions, creating advanced instruments that drive product innovation by quickly measuring, analyzing and verifying complex electronic signals. The Company offers high-performance oscilloscopes, signal integrity test solutions and global communications protocol analyzers used by design engineers in the computer, semiconductor and consumer electronics, data storage, automotive and industrial, telecommunications, and military and aerospace markets. Teledyne LeCroy's 49-year heritage of technical innovation is the foundation for its recognized leadership in "WaveShape Analysis" - capturing, viewing and measuring the high-speed signals that drive today's information and communications technologies. Teledyne LeCroy is headquartered in Chestnut Ridge, New York. Company information is available at teledynelecroy.com.
© 2013 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice.
Media contact: | Peter Fletcher, TechniPubs, | (408) 373-5601 |
LeCroy Contact: | John Wiedemeier, Product Marketing Manager, | (408) 486-7211 |
Customer contact: | Teledyne LeCroy, PSG Customer Care Center, | (800) 553-2769 |
Website: | teledynelecroy.com | |
SOURCE Teledyne LeCroy
