InvenSense MPU-9150 Motion Processing Unit Report - Reverse Costing Analysis

DUBLIN, November 21, 2013 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/t2sxcf/invensense) has announced the addition of the "InvenSense MPU-9150 Motion Processing Unit Reverse Costing Analysis" report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The MPU-9150 is a motion tracking MEMS that combines a 3D accelerometer, a 3D gyroscope from Invensense and a 3D digital compass from AKM in the same package, a 4x4x1mm LGA package.

The MPU-9150 is targeted for mobile phones, tablets, gaming devices, Portable Navigation Devices and remote controllers.

This report provides complete teardown of the inertial MEMS with:

- Detailed photos
- Material analysis
- Cost of Manufacturing
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:

1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Company Profile

3. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis methodology
- Package characteristics & markings
- Package opening
- Package Opening: Dies Bonding
- Package Cross Section
- Invensense ASIC Marking
- Invensense ASIC Dimensions
- Invensense ASIC minimal dimensions
- Invensense ASIC Cross section
- Invensense ASIC Process Characteristics
- Invensense MEMS marking
- Invensense MEMS Opening
- Invensense MEMS Sensing Area
- Invensense MEMS Cap
- Invensense MEMS Process Characteristics
- Magnetometer marking
- Magnetometer Dimensions
- Magnetometer Cross Section
- Magnetometer Process Characteristics

4. Manufacturing Process Flow
- Global view
- Process Flow Accelerometer ASIC
- Process Flow MEMS Accelerometer
- Process Flow Magnetometer
- Process Flow Packaging
- Description of the Wafer Fabrication Unit

5. Cost Analysis
- Synthesis of the cost analysis
- Methodology
- Hypothesis
- Yield Synthesis
- Invensense ASIC Wafer Cost
- Invensense ASIC Die Cost Data
- MEMS Accelerometer Wafer Cost
- MEMS Accelerometer cost per Steps
- MEMS Accelerometer Equipment cost
- MEMS Accelerometer Material cost
- MEMS Accelerometer Die Cost
- Magnetometer Wafer Cost
- Magnetometer cost per Steps
- Magnetometer Material cost
- Magnetometer Die Cost
- Back-End : Package Cost
- Back-End : Package Cost Per Steps
- Back-End : Package Material cost
- Back-End : Final Test
- MPU9150 Manufacturing Cost
- Cost Analysis Evolution over yield

6. Estimated Selling Price Analysis
- Supply Chain Analysis
- Estimated Selling Price
- Price Evolution according to the yield

For more information visit http://www.researchandmarkets.com/research/t2sxcf/invensense

Research and Markets
Laura Wood, Senior Manager.
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Sector: Telecommunications and Networks