DUBLIN, February 5, 2014 /PRNewswire/ --
Research and Markets(http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems) has announced the addition of the "Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm"report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4, 4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus achieving a 45% footprint reduction.
The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale Packaging) allowing a package efficiency of 75% (silicon area/package area). This packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the production cost of their latest gyro.
This report provides a complete teardown of the MEMS gyro with:
- Detailed photos
- Material analysis
- Comparison with iPhone 4/4S/5 gyro
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation
Key Topics Covered:
Glossary
Overview/Introduction
STMicroelectronics Company Profile
Physical Analysis
- Physical Analysis Methodology
- Package
- Package Characteristics & Markings
- Package Opening
- Wire bonding process
- Package Cross-Section
- ASIC
- ASIC Dimensions & Markings
- ASIC Delayering
- ASIC Cross-Section
- ASIC Process Characteristics
- MEMS
- MEMS Dimensions & Markings
- MEMS bonding pads
- MEMS Cap Opening
- MEMS Cap
- MEMS Sensing Area
- MEMS Cross-section
Comparison with iPhone 4/4S/5 Gyroscope
Manufacturing Process Flow
- ASIC Process Flow
- Description of the ASIC Wafer Fabrication Unit
- MEMS Sensor Process Flow
- MEMS Cap Process Flow
- MEMS Wafer Bonding Process Flow
- Description of the MEMS Wafer Fabrication Unit
- Packaging Process Flow
Cost Analysis
- Main Steps of Economic Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
- ASIC Die Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End : Packaging Cost
- Back-End : Final test & Calibration Cost
- Component Cost (FE + BE 0 + BE 1)
- Comparison with iPhone 4/4S/5 Gyro Component Cost
Estimated Price Analysis
For more information visithttp://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems
Media Contact:Laura Wood, +353-1-481-1716, press@researchandmarkets.net
