DUBLIN, February 5, 2014 /PRNewswire/ --
Research and Markets(http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec) has announced the addition of the "Reverse Costing Analysis for the Bosch Sensortec BMG160 3-Axis MEMS Gyroscope"report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
The first MEMS gyroscope of Bosch for Consumer Applications Employing a New Wafer Bonding Process
More than 10 years after the release of its MEMS gyroscopes for automotive, Bosch Sensortec release its first 3-Axis gyroscope for consumer applications.
In a market largely dominated by STMicroelectronics and InvenSense, Bosch Sensortec was the first to release a 3-axis MEMS gyroscope in a 3x3mm² package in order to gain market shares. Although the manufacturing process (Epi-poly surface micromachining) is similar to the one of automotive gyro, new processes for the capping and the wafer bonding has been adopted. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic bonding.
This report provides a complete teardown of the MEMS gyro with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Selling price estimation
Key Topics Covered:
Glossary
Overview/Introduction
Bosch Company Profile
Physical Analysis
- Physical Analysis Methodology
- Package
- Package Characteristics & Markings
- Package Opening
- Wire bonding process
- Package CrossSection
- ASIC
- ASIC Dimensions & Markings
- ASIC Delayering
- ASIC CrossSection
- ASIC Process Characteristics
- MEMS
- MEMS Dimensions & Markings
- MEMS bonding pads
- MEMS Cap Opening
- MEMS Cap
- MEMS Sensing Area
- MEMS Crosssection
Manufacturing Process Flow
- ASIC Process Flow
- Description of the ASIC Wafer Fabrication Unit
- MEMS Sensor Process Flow
- MEMS Cap Process Flow
- MEMS Wafer Bonding Process Flow
- Description of the MEMS Wafer Fabrication Unit
- Packaging Process Flow
Cost Analysis
- Main Steps of Economic Analysis
- Yields Hypotheses
- ASIC FrontEnd Cost
- ASIC BackEnd 0 : Probe Test, Thinning & Dicing
- ASIC Die Cost
- MEMS FrontEnd Cost
- MEMS FrontEnd Cost per Process Steps
- MEMS FrontEnd : Equipment Cost per Family
- MEMS FrontEnd : Material Cost per Family
- MEMS BackEnd 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- BackEnd : Packaging Cost
- BackEnd : Final test & Calibration Cost
- Component Cost (FE + BE 0 + BE 1)
Estimated Price Analysis
For more information visithttp://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec
Media Contact:Laura Wood, +353-1-481-1716, press@researchandmarkets.net
