DUBLIN, February 6, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/8sj9jg/yamaha_yas532b) has announced the addition of the "Yamaha YAS532B 3-Axis Geomagnetic Compass Reverse Costing" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
More than 6 years after the release of its first electronic Compass for consumer applications, Yamaha has released its third 3-Axis geomagnetic sensor.
In a market largely dominated by AKM, Yamaha has launched its new very small eCompass, 1.46mm x 1.46mm, based on a GMR principle, in order to gain market shares. The manufacturing process combines GMR deposition and surface micromachining , allowing to measure the 3-axis with one die. The YAS532B has the same performances that the new AKM device with an area 17% smaller.
Manufactured in a old foundry amortized, the YAS532B is very cheap.
The YAS532B integrates an ingenious magnetic concentrator.
This report provides a complete teardown of the 3-axis Geomagnetic Compass with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Selling price estimation
Key Topics Covered:
Glossary
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
- Yamaha
- YAS532B Characteristics
3. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package
- Package Views & Dimensions
- Package Pin Out
- Package Opening
- Package Cross-Section
- Protection Layer
- Sensor
- View & Dimensions
- Marking
- Sensing Area
- X-axis GMR Elements
- GMR Principle
- Y and Z-axis Elements
- Sensor Bond Pad Cross-Section
- Sensor Layers Cross-Section
- Process Characteristics
- ASIC Die
- View & Dimensions
- Marking
- Delayering
- Cross-Section
- Process Characteristics
4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
5. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- Probe Test Cost
- Wafer Level Packaging Wafer Cost
- Final Test & Calibration Cost
- Component Die Cost
6. Estimated Price Analysis
- Definition of Prices
- Manufacturer Financial Ratios
- Estimated Manufacturer Price
- Estimated Selling Price
Contact
For more information visit http://www.researchandmarkets.com/research/8sj9jg/yamaha_yas532b
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
