DALLAS, October 12, 2014 /PRNewswire/ --
The Global and China Optoelectronic Device Industry Report, 2014-2016 is a July 2014 market research of 114 pages profiling 11 companies and the market analysis is supported with 130+ charts. Available with ChinaMarketResearchReports.com at http://www.chinamarketresearchreports.com/114877.html, this research can be purchased for US$ 2450 (single user PDF) and US$ 3800 (corporate user PDF). Optoelectronic device refers to various functional devices made through the electricity-photon conversion effect, widely used in communications, solar energy, industrial laser, LED and other fields.
The optoelectronic devices market report mainly focuses on optoelectronic devices for communication applications. In 2013, the worldwide communication optoelectronic device industry registered revenue of USD7.2 billion, up 7.5% on year-on-year basis (an increase of 6 percentage points compared to last year).
Global communication optoelectronic device industry manufacturers are concentrated in a handful of countries or regions such as the United States, Japan,Taiwan and China. In 2013, the world's top five manufacturers occupied an around 48.2% market share. And preponderant enterprises are constantly improving the industrial chain through mergers and acquisitions to sharpen their competitiveness. On June 28, 2013, for example, Avago completed the acquisition of the indium phosphide (InP) optical chip and component technology supplier - CyOptics with USD377 million; later, it announced on December 17, 2013 the takeover of LSI, a storage-on-chip giant, at a price of USD6.6 billion.
Companies profiled in Global and China Optoelectronic Device Industry Report, 2014-2016 include Finisar, Avago, JDSU, Oclaro, Sumitomo Osaka Cement, Fujitsu, Accelink, NeoPhotonics, Oplink, Browave and Broadex. Order a copy of this report at http://www.chinamarketresearchreports.com/contacts/purchase.php?name=114877 .
Given the advantage of labor cost as well as the huge demand potential, China has become a worldwide leading production base of optoelectronic devices for Finisar, Avago and other foreign tycoons. In 2013, Finisar earned USD229.2 million in revenue from the Chinese market, surging 34% year on year; Avago also reported 19% revenue growth in China.
China's production of optoelectronic devices presented explosive growth during the years 2008-2013, at a CAGR of 40.3%. In 2013, the output saw a slowdown in the growth rate but still sustained high-speed upward migration, up 31.5% year on year, which even hit 50.9% in the first half of 2014. From the regional perspective, optoelectronic device production bases are primarily located in Guangdong and Jiangsu provinces, which have contributed a combined 65.1% to China's total output in the first half of 2014.
The Global and China Optoelectronic Device Industry Report, 2014-2016 mainly focuses on providing following data and information:
- Supply and demand, downstream market, major countries/regions (USA, Japan and Taiwan), etc. of global optoelectronic device industry;
- Policy environment, supply and demand, competition pattern, trends, etc. of China optoelectronic device industry;
- Operation, optoelectronic device business, development in China, etc. of 11 key optoelectronic device manufacturers worldwide (involving USA, Japan, China and Taiwan).
Comprehensive Table of Contents along with List of Charts provided in this research can be explored at http://www.chinamarketresearchreports.com/114877-toc.html .
Another research titled Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014 says semiconductor devices, in 2014 will witness an explosive growth, with the estimated market size of die packaging level equipment rising significantly by 20% to USD4.1 billion. And this figure is projected to climb to USD4.3 billion in 2015 and then begin to fall in 2016. The major growth engine would be Die Bonder, Flip-chip Bonder, and Test Handler. Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging is primarily used in the following 5 fields, namely, Analog & Mixed Signal (including IPD, PA, PMU, Local Power, IC Driver, and Audio & Video), Wireless Connectivity (including Bluetooth+FM+WLAN Combo and GPS Single Chip), Optoelectronic (including CIS, AL Sensor), MEMS & Sensor (including Accelerometers, Gyroscope, RF-MEMS, Pressure Sensor, and Fingerprint Sensor), as well as Misc Logic and Memory (covering Logic gate and EEPROMs). And these applications mostly adopt the Fan-in design, with the number of Pin usually less than 20. Companies like SM PACIFIC, KULICKE & SOFFA, BESI, ADVANTEST, HITACHI HIGH-TECHNOLOGIES, TERADYNE, DISCO, TOWA, HANMI, PFSA, SUSS MICROTEC, GROUP, SHINKAWA, TOKYO SEIMITSU and ULTRATECH are discussed in this research at http://www.chinamarketresearchreports.com/114888.html .
The promising prospect of Chinese optical fiber sensor market has attracted many domestic enterprises such as Wuhan WUTOS Co., Ltd, Beiyang Optic-electronic Information Technology Co., Ltd, Pegasus (Qingdao) Optoelectronics, Inc., Bandweaver Technologies Co., Ltd and Jiangsu Tongding Optic-Electronic Co., Ltd. Moreover, some foreign companies e.g. OMRON, Panasonic, Corning also have started their layout in China. In November 2013, Corning established the first R&D center in Shanghai, committed to the localized development of optical fiber sensor and other products in China. The research Global and China Fiber Optic Sensor Industry Report, 2013-2018 is spread across on 64 pages and says in 2013, global optical fiber sensor sales reached USD1.89 billion, up 19.6% year on year, of which, the United States registered USD1.22 billion, making up 64.6% of world's total, which is expected to reach USD4.33 billion in 2018.
Explore more reports on the IT & Telecommunication markets and their related sectors at http://www.chinamarketresearchreports.com/cat/information-technology-telecommunication.html .
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