DALLAS, November 25, 2014 /PRNewswire/ --
According to a new market research report of "Radiation Hardened Electronics & Semiconductors Market by Component (Processors & Controllers, Logic, Memory, Power Management, ASICs & FPGAs), Manufacturing Technique (RHBP, RHBD), Application (Aerospace & Defense, Space), & Geography - Global Forecasts to 2013 - 2020", published by MarketsandMarkets, the market is expected to grow at a CAGR of 3.01% between 2014 and 2020, and reach $1450 Million by 2020.
Browse 55 market data Tables and 57 Figures spread through 193 Pages and in-depth TOC on "Radiation Hardened Electronics & Semiconductors Market".
http://www.marketsandmarkets.com/Market-Reports/radiation-hardened-electronics-market-44047967.html
Early buyers will receive 10% customization on this report.
The Radiation Hardened Electronics and Semiconductors Market comprise the sophisticated rad-hard electronics systems used for various commercial and military space applications. Rad-hard electronics components play an important role in sustaining harmful space radiations thus, preventing physical damage and failure. The global Radiation Hardened Electronics and Semiconductors Market is expected to grow, owing to the increasing number of commercial satellites and other aerospace & defense applications, which constitute the key factors driving the overall rad-hard market. The report covers the "Global Radiation Hardened Electronics and Semiconductors Market" and it's various aspects such as future opportunities, drivers, restraints, and others in detail.
The geographic split for the Radiation Hardened Electronics and Semiconductors Market is included in the report. North America accounted for more than 50% of the overall radiation hardened electronics and semiconductor market. The overall market is divided into four major geographic segments- North America, Europe, Asia-Pacific, and Rest of the World.
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The major players in the Radiation Hardened Electronics and Semiconductors Market, Honeywell Aerospace (U.S.), BAE Systems (U.K.), Microsemi Corporation (U.S.), Xilinx Incorporation (U.S.), and Texas Instruments (U.S.).
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