DUBLIN, Dec. 09, 2014 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/jbpkgx/design_analysis) has announced the addition of EJL Wireless Research's new report "Design Analysis Nokia Solutions Networks FSME LTE Baseband Unit" to their offering.
http://photos.prnewswire.com/prnh/20130307/600769
This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010.
Key Findings:
- Separate sector cards for baseband processing
- Standard DSPs for high capacity LTE user support and throughput
- Advanced power management for ASICs, DSPs, and FPGAs
Component and semiconductor suppliers mentioned in this report include: Amphenol, AVX, Epson Toyocomm, Fairchild Semiconductor, Infineon Technologies, Molex, NXP Semiconductors, Pulse Electronics, Samsung Semiconductors, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.
Features:
- Complete Part Number/Marking
- Component Manufacturer Identification
- Function Component Description
Key Topics Covered:
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:
CHAPTER 1: NOKIA FLEXI MULTIRADIO BTS SYSTEM
Overview of Nokia Flexi Product Offering
CHAPTER 2: FSME MECHANICAL ANALYSIS
Mechanical Analysis
CHAPTER 3: FLEXI POWER DISTRIBUTION AND FUSES MODULE (FPFB)
CHAPTER 4: FCM SUB SYSTEM
CHAPTER 5: FSP SUB SYSTEM
CHAPTER 6: FAN UNIT
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS
TABLES
Table 1: FPFB Bill of Materials
Table 2: FCM PCB Top Bill of Materials
Table 3: FCM PCB Top Missing Component Bill of Materials
Table 4: FCM PCB Bottom Bill of Materials
Table 5: FCM PCB Bottom Missing Component Bill of Materials
Table 6: FCM PCB Bottom Missing Connector Bill of Materials
Table 7: FSP Top Bill of Materials
Table 8: FSP Top View Missing Component Bill of Material
Table 9: FSP Bottom Bill of Materials
Table 10: FSP Bottom Missing Component Bill of Materials
Table 11: FSP Bottom Missing Component, Area A Bill of Materials
Table 12: FSP Bottom Missing Connector Bill of Materials
Table 13: Passive Component Case Size Distribution by System Subsection
Table 14: Identified Passive Component Supplier Distribution by System Subsection
Table 15: Active/Passive Component Distribution by System Subsection
Table 16: Active Semiconductor/Component Vendor Distribution by System Subsection
Companies Mentioned:
- Amphenol
- AVX
- Epson Toyocomm
- Fairchild Semiconductor
- Infineon Technologies
- Molex
- NXP Semiconductors
- Pulse Electronics
- Samsung Semiconductors
- STMicroelectronics
- Texas Instruments
- Vishay Semiconductors
For more information visit http://www.researchandmarkets.com/research/jbpkgx/design_analysis
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
