DUBLIN, Feb .18, 2015 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/rhfr7v/gan_systems) has announced the addition of the "GaN Systems GS66508P 650V HEMT - Reverse Costing Analysis" report to their offering.
The GS66508P from GaN Systems is a GaN on Silicon HEMT transistor 650V high-voltage in a new GaNpx Embedded Die package. With a breakdown voltage of 650V for a current of 30A, (25°C), with lower switching losses and higher frequency operating. The transistor is optimized for AC-DC converters and high frequency, high efficiency power conversion.
The GS66508P is packaged is an innovative embedded die package developed by AT&S. The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layers structure is used to reduce the stress and the dislocation. This is completed by a thick superlattice structure clearly visible in the TEM analysis.
Key Topics Covered:
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
2. Companies Profile
- Gan Systems Profile
- Plessey Semiconductors Profile
- AT&S Profile
3. GS66508P Characteristics
- GS66508P Characteristics
4. GS66508P Physical Analysis
- Physical Analysis Methodology
- Package Views & Dimensions
- X-Ray
- Package Cross-Section
- GaNpx
- ECP technology
Redistribution
GaN transistor
- Die View, Dimensions & Marking
- Guard Ring- Metal Layers
- Source and Gate
- Source Cross-Section
- Substrate and Epitaxy Layers
- TEM Cross-Section
- GaN Transistor Characteristics
5. Manufacturing Process Flow
- Global Overview
- GaN Transistor Front end Unit
- Transistor Process Flow
- Package Front end Unit
- Package Process Flow
6. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
GaN Transistor
- Yields Hypotheses
- GaN Transistor Epitaxy Cost
- GaN Transistor Front-End Cost
- GaN Transistor Wafer Cost
- GaN Transistor Cost per process steps
- GaN Transistor: Equipment Cost per Family
- GaN Transistor: Material Cost per Family
- GaN Transistor: Back-End: Probe and Dicind
Redistribution
GaNpx package
- Yields Hypotheses
- GaNpx package Cost per process steps
GS66508P
- GS66508P - Final Test
7. Price Estimation
For more information visit http://www.researchandmarkets.com/research/rhfr7v/gan_systems
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
