DUBLIN, Mar. 23, 2015 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/v8qg2r/global_rapid) has announced the addition of the "Global Rapid Thermal Processing Equipment Market 2015-2019" report to their offering.
The analysts forecast the Global Rapid Thermal Processing Equipment market to grow at a CAGR of 3.56% over the period 2014-2019
The Global Rapid Thermal Processing Equipment market can be segmented into three based on type: Lamp-based, Laser-based, and Susceptor-based rapid thermal processing equipment. The major end-users of rapid thermal processing equipment are specialist semiconductor manufacturers.
Rapid thermal processing equipment offers advantages such as lower power consumption and cost savings. Rapid thermal annealing equipment is used to activate dopants in the wafer and for interfacial reaction of metal contacts. Rapid thermal processing has been gaining popularity among semiconductor manufacturers because of its use in circuit processing, CMOS production, and in the Microelectronics industry.
Manufacture of semiconductors involves semiconductor silicon wafer production, wafer processing, assembly, and testing. Rapid thermal processing refers to the heating of silicon wafers to temperatures above 2,192 degree Fahrenheit within seconds to attain nitridation, dopant activation, metal reflow, thermal oxidation, and chemical vapor deposition within the silicon wafers of a semiconductor. Silicon wafers are heated using either lamps or lasers.
One of the key trends emerging in the market is the growing popularity of flash-assist rapid thermal processing, which is used for ultra-shallow junctions. These systems give accurate, emissivity-independent temperature measurement that can be used for feedback control.
According to the report, one of the key factors driving the market is the surge in sales of semiconductors for use in smartphones and other smart devices. The growth of the Global Mobile Computing Devices market is also expected to increase demand for semiconductors and contribute to the growth of the market for rapid thermal processing equipment.
Further, the report states that one of the key challenges in the market is the unreliable nature of radiometric temperature measurement and control in wafers in these systems. Radiometric methods of temperature control require knowledge of the radiative and optical properties of the wafer, effects of surface roughness, and reflected irradiation from lamp banks. Methods for reducing emissivity and stray radiation are employed to ascertain accuracy in measurement.
Key Vendors
- Applied Materials
- Hitachi Kokusai Electric
- Mattson Technology
- Screen Holdings
- Ultratech
Other Prominent Vendors
- AG Associates
- AnnealSys
- Jilepec
- Modular Process Technology
- SemiTEq
For more information visit http://www.researchandmarkets.com/research/v8qg2r/global_rapid
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
