Research and Markets -Technology and Cost Comparison of InvenSense's ICM-30630 - 6-axis Device (3-axis gyroscope + 3-axis accelerometer)

DUBLIN, May 19, 2016 /PRNewswire/ --

Research and Marketshas announced the addition of the"InvenSense ICM-30630: Technology and Cost Comparison" report to their offering.

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With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM-30630 a competitive, complete motion-tracking solution.

The ICM-30630 is the latest version of InvenSense's 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone, with a MCU included in the package. Compared with the stand-alone sensor hub, this approach eliminates a package and reduces system-level power.

In competition with Bosch Sensortec and STMicroelectronics, InvenSense provides a low-power, highly programmable device for consumer electronics.

ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU.

Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform.

This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense's incredibly smart design.

Key Topics Covered:

Overview / Introduction

InvenSense Company Profile

Physical analysis

- Package
-- Package characteristics: view, dimensions, and opening
-- Package cross-section

- MEMS Die
-- View, dimensions, and markings
-- MEMS sensing area: technical description
-- MEMS cap removed
-- ASIC delayering and process
-- Die cross-section: ASIC
-- Die cross-section: MEMS cap and sensor

- MCU Die
-- View, dimensions, and markings
-- Delayering and main block ID
-- Process and die cross-section
-- Die process characteristics

Manufacturing Process Flow

- Global overview
- ASIC & MCU front-end process
- MEMS process flow
- ASIC & MCU wafer fabrication unit
- Packaging process flow and assembly unit

Cost Analysis

- Main steps of economic analysis
- Yields hypotheses
- ASIC front-end cost
- MEMS front-end cost
- ASIC/MEMS assembly cost
- MEMS front-end cost per process steps
- Total front-end cost
- Back-end 0: probe test and dicing
- Wafer and die cost
- MCU front-end and back-end 0 cost
- MCU die cost
- Back-end: packaging cost
- Back-end: packaging cost per process steps
- Back-end: final test cost
- Component cost and price

Cost & price comparison with Bosch Sensortec 9-Axis Sensor Hub BMF055

Companies Mentioned

- Bosch Sensortec
- InvenSense
- STMicroelectronics

For more information visithttp://www.researchandmarkets.com/research/fd666w/invensense

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