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PR Newswire
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Flip-Chip Technologies and Global Markets - Increasing at a CAGR of 8.8% by 2021 - Research and Markets

DUBLIN, August 2, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "Flip-Chip Technologies and Global Markets" report to their offering.

The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

This report provides an overview of the global markets for flip-chip technologies, a process to interconnect IC's and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads. It includes analysis of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.

There is a discussion of the evolution, architecture, and value chain of flip-chip technologies, as well as an examination of market dynamics, including drivers, restraints, and opportunities.

Analysis of the flip-chip assembly market is provided by geography, including North America, Europe, Asia-Pacific, and others.

Companies Mentioned:

  • Amkor Technology Inc.
  • Ase Group
  • Faraday Technology Corp.
  • Flipchip International Llc
  • Gigpeak Inc.
  • Globalfoundries Inc.
  • Ibm Corp.
  • Intel Corp.
  • Kyocera America Inc.
  • Nanium Sa
  • Nichia Corp.
  • Ntk Technologies Inc.
  • Philips Lumileds Lighting Co.
  • Powertech Technology Inc.
  • Renesas Electronics America Inc.
  • Samsung Electronics Co. Ltd.
  • Signetics Corp.
  • Siliconware Precision Industries Co. Ltd.
  • Sk Hynix Inc.
  • Stats Chippac Pte. Ltd.
  • Stmicroelectronics Nv
  • Suss Microtec Ag
  • Taiwan Semiconductor Manufacturing Co.
  • Tektronix Component Solutions Inc.
  • Tessera Technologies Inc.
  • Texas Instruments Inc.
  • Tokyo Electron Ltd.
  • Toshiba Electronics Europe Gmbh
  • Unisem (M) Berhad
  • Utac Holdings Ltd.

Key Topics Covered:

1: Introduction

2: Summary

3: Overview

4: Flip-Chip Technology Market By Wafer Bumping Process

5: Flip-Chip Technology Market By Application

6: Flip-Chip Technology Market By End Use

7: Flip-Chip Technology Market By Region

8: Industry Structure And Competitive Analysis

9: Company Profiles

For more information visit http://www.researchandmarkets.com/research/qnfmrf/flipchip

Media Contact:

Research and Markets

Laura Wood, Senior Manager

press@researchandmarkets.com

For E.S.T Office Hours Call +1-917-300-0470

For U.S./CAN Toll Free Call +1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907

Fax (outside U.S.): +353-1-481-1716

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© 2016 PR Newswire
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