DUBLIN, Nov 30, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "Delphi Rear and Side Detection System (RSDS): Teardown Analysis" report to their offering.
Delphi Rear and Side Detection System is a 76Ghz Single-beam mono-pulse Radar. Its compact design enables a simplified integration in the vehicle. The RSDS offers a broad array of active safety features, as Blind Spot Detection, Lane Change Merge Assit, Rear Cross Traffic Alert and Rear Pre-crash Sensing.
Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals. Processing is realized by a Renesas 32-bit MCU and a Texas Instrument Jacinto Processor.
Based on a complete teardown analysis of the Delphi RSDS, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
Key Topics Covered:
1. Overview / Introduction
2. Company Profile
3. Physical Analysis
- Views of the Radar
- Radar Opening
- Electronic Boards
MCU Board
RF Board
Transceiver/Receiver Board
- MCU Board
- RF Board
- Transceiver/Receiver Board
- Antenna Substrate
- Cross Section
- IR Sensor Assembly, Wire bonding Process
4. Cost Analysis
- Estimation of the cost of the PCBs
- Estimation of the cost of the MCUs
- BOM Cost - MCU Board
- BOM Cost - RF Board
- BOM Cost - Housing
- Material Cost Breakdown
- Accessing the Added Value (AV) Cost
- Electronic Boards AV Costs
- Housing Assembly AV Costs
- Manufacturing Cost Breakdown
5. Estimated Price Analysis
- Manufacturer Financial Ratios
- Estimated Selling Price
For more information about this report visit http://www.researchandmarkets.com/research/nrl577/delphi_rear_and
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