DUBLIN, May 16, 2017 /PRNewswire/ --
Research and Markets has announced the addition of the "CMP Technology: Competition, Products, Markets" report to their offering.
Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The combination of mechanical abrasion and chemical etching enable polishing and flattening of wafers before the photolithography stage. This helps in avoiding the depth of field issues during illumination.
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
2.1 Introduction
2.2 Market Opportunities
Chapter 3 Planarization Methods
3.1 Need for Planarity
3.2 Applications
3.3 Planarization Techniques
3.4 CMP
Chapter 4 CMP Consumables
4.1 Slurries
4.2 Post-CMP Clean
4.3 Polishing Pads
Chapter 5 CMP Equipment
5.1 Single-Head Approach
5.2 Multi-Head Approach
5.3 Equipment Profiles
5.4 Clustered Tools
5.5 Competitive Non-CMP Tools
Chapter 6User Issues
6.1 Cost of Ownership
6.2 User Requirements
6.3 Benchmarking a Vendor
6.4 User-Supplier Synergy
6.5 Reliability
6.6 Equipment Maintainability
Chapter 7 Market Forecast
7.1 Introduction
7.2 Market Forecast Assumptions
7.3 Equipment Market
7.4 Consumable Market
For more information about this report visit http://www.researchandmarkets.com/research/brjwp7/cmp_technology
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