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Senvion S.A. (IRSH) Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders and main bond holders 17-Apr-2019 / 18:46 CET/CEST Dissemination of a Regulatory Announcement that contains inside information according to REGULATION (EU) No 596/2014 (MAR), transmitted by EQS Group. The issuer is solely responsible for the content of this announcement. *Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders and main bond holders* *Luxembourg, 17April 2019**:* Senvion GmbH - the main operative business entity of the Senvion Group - and its lenders and main bond holders have signed a binding loan agreement, setting forth terms for a EUR 100m so-called 'Massekredit'. The debtor-in-possession (DIP) facility enables Senvion Group to continue its business operations following last week's self-administration filing for certain entities of Senvion Group. The loan facility has received all Board approvals and allows substantial drawings already this week, thus enabling the company to stabilize its business operations and provide funds to its non-insolvent subsidiaries. The Management Board Senvion Investor Relations contact (Notifying Person): Anja Siehler Senior Manager - Capital Markets phone: +352 26 00 - 5285 email: anja.siehler@senvion.com Contact: Anja Siehler Tel: +352 26 00 5285 Mobil: +4915221817093 E-mail: anja.siehler@senvion.com ISIN: LU1377527517, XS1223808749, XS1223809390 Category Code: MSCU TIDM: IRSH LEI Code: 549300WUKZSK5CX6SM09 OAM Categories: 2.2. Inside information Sequence No.: 8247 EQS News ID: 801439 End of Announcement EQS News Service
(END) Dow Jones Newswires
April 17, 2019 12:47 ET (16:47 GMT)
