Scientists in South Korea combined two processes to etch a nanostructure of tiny pyramids onto the surface of a silicon wafer. As well as trapping more light and increasing the cell efficiency, the group claims that its nanostructure improves the mechanical flexibility of the cells. This could potentially allow for the use of much thinner silicon wafers than is currently possible in production.Wafers used in cell production today are typically 180-200 microns thick. Going thinner than this is widely thought to bring about problems with the wafer being too fragile to withstand the stresses it is ...Den vollständigen Artikel lesen ...