Evonik unveils new wafer-cutting solutions

German chemicals producer Evonik claims that its wetting and defoaming solutions improve the speed and quality of wafer cutting, despite the industry's shift toward harder, more brittle materials.Evonik has announced the launch of new wetting agents and defoamers for PV wafer-cutting equipment. Its Tego Surten E products are advanced cutting fluids designed for high-speed diamond and multi-wire sawing processes. These fluids are specifically formulated to work effectively with thinner wires in cutting systems. Evonik's wetting and defoaming solutions facilitate faster and improved wafer cutting, ...

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