Improving diamond wire sawing to reduce kerf loss in solar wafer production

Researches in China have sought to assess how lateral vibration in diamond wire sawing can increase kerf losses in solar wafer manufacturing and have developed a predictive model than can reportedly help reduce them. Their analysis showed that, with constant sawing parameters, smaller wafers suffer from greater excess kerf loss.Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar wafer production. Kerf is the crystalline material that is wasted when a ...

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