The thermomechanical impact of plated copper contacts on heterojunction solar cells

UNSW researchers have found that annealing copper-plated contacts in heterojunction solar cells creates only localized stress. Their analysis also showed that, at typical annealing temperatures around 200 C, the probability of silicon fracture is very low.A research team from the University of New South Wales (UNSW) and Sydney-based solar technology company SunDrive investigated the impact of annealing plated copper (Cu) contacts in heterojunction (HJT) solar cells and found that this process is unlikely to cause low-level fractures. "We assessed the thermomechanical stress induced by annealing ...

Den vollständigen Artikel lesen ...