UNSW researchers identified a new damp-heat degradation mechanism in TOPCon modules with laser-fired contacts, driven primarily by rear-side recombination and open-circuit voltage loss rather than series-resistance increase. The study highlights that magnesium in white EVA encapsulants accelerates degradation, guiding improved encapsulant and backsheet selection for more reliable modules in humid environments.A research team from the University of New South Wales (UNSW) has identifed a new damp heat-induced degradation pathway in TOPCon modules fabricated with laser-assisted fired contacts. "Unlike ...Den vollständigen Artikel lesen ...
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