The research team developed a plasma interface engineering method to improve indium tin oxide layers, solving adhesion, contact resistance, and stability issues for copper electroplating. The optimized process enabled uniform copper metallization and boosted device efficiency to 25.2%, significantly outperforming untreated reference cells.Researchers from Nankai University in China have fabricated a copper (Cu)-metallized heterojunction (HJT) solar cell using a new interface engineering strategy aimed at addressing poor interfacial adhesion and high contact resistivity in the transparent conductive ...Den vollständigen Artikel lesen ...
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