Continuous-wave infrared laser technology enables damage-free backsheet removal in end-of-life solar modules

U.S. researchers have developed an IR-CW laser-based method to remove backsheets from end-of-life silicon solar modules without damaging the glass or wafers, using controlled heating of the silicon-EVA interface through the front glass. The process enables clean mechanical delamination with preserved device performance and offers a lower-energy, lower-cost alternative to conventional thermal or chemical recycling methods.Researchers from the University of Virginia in the United States have developed a laser-based technology that enables the removal of backsheets from end-of-life solar modules ...

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