| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 25.09. | AdaCore GNAT Foundry puts AI code through formal proof | ||
| 24.09. | Edge AI shifts onto MCUs at EWNA 2026 | ||
| 24.09. | IBM study finds AI workforce skills gap | ||
| 24.09. | Imec and TSMC expand advanced-node chip design access | ||
| 24.09. | AMD $1 trillion market cap follows AI data centre surge | ||
| 24.09. | Qualcomm Snapdragon Sound Gen 2 targets AI wearables | ||
| 24.09. | Cognex launches AI-powered wafer reader for chip fabs | ||
| 23.09. | Embedded AI takes centre stage at EWNA 2026 | ||
| 23.09. | Semtech brings 50G fronthaul to 5G-Advanced | ||
| 23.09. | ABB launches Infinitus DC portfolio for AI data centers | ||
| 23.09. | EU Commission launches data centre energy rating scheme | ||
| 23.09. | Nexperia and Tata Electronics partner on semiconductor manufacturing in India | ||
| 23.09. | Ceer Exobot debuts as Saudi Arabia's first national EVs | ||
| 22.09. | Marvell unveils 2nm optical interconnects for AI data centers | ||
| 22.09. | WISeKey and SEALSQ plan post-quantum semiconductor center in Jura | ||
| 22.09. | IonQ speeds engineering simulation with quantum computing | ||
| 22.09. | Semtech backs XPO with 200G/lane optical ICs | ||
| 22.09. | Arteris extends NoC IP across multi-die chiplet designs | ||
| 22.09. | ACDSee adds privacy-first AI for photographers | ||
| 22.09. | Acer sees PC prices falling in late 2027 | ||
| 21.09. | The Fundamentals of Electromagnetic Compliance | ||
| 21.09. | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| 21.09. | Selecting Current Sense Transformers for Switched-mode Power Supplies | ||
| 21.09. | Common Mode Chokes: Simulation, Design, and Unconventional Applications | ||
| 21.09. | Forward or Flyback? Which is Better? Both! |