| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 27.07. | AI Network Optimization Helped T-Mobile Manage Major Soccer Tournament | ||
| 27.07. | Samsung and Broadcom deepen AI semiconductor partnership with $200bn collaboration | ||
| 27.07. | SK Group and NVIDIA expand AI factory and HBM partnership | ||
| 27.07. | Intel and Lens Technology collaborate on advanced AI chip packaging | ||
| 24.07. | Elektor Lab Talk #49 examines USB-C and mobile power | ||
| 24.07. | conga-HPC/cRX1 module brings Ryzen AI X100 to the edge | ||
| 24.07. | NVIDIA backs Amkor with $1.5bn to expand AI packaging in the US | ||
| 24.07. | PsiQuantum lands $125m DARPA quantum deal | ||
| 24.07. | The Ton Giesberts Collection: Practical Analog and Audio Projects | ||
| 24.07. | Shaping the Future of IoT: The Things Conference 2026 in Amsterdam | ||
| 23.07. | Cyber Resilience Act, Part 1: The first deadlines are approaching | ||
| 23.07. | Webinar: From Supplier Request to ECO in Minutes | ||
| 23.07. | AMD and Anthropic partner on 2GW AI GPU deployment | ||
| 23.07. | STMicroelectronics reports Q2 revenue growth | ||
| 23.07. | Intel and Fortinet team up on SP6 cybersecurity chip | ||
| 22.07. | Battery EV prices fall 18% as model choice quadruples | ||
| 22.07. | OptiTrack Unveils ActiveIO Motion Tracking Platform | ||
| 21.07. | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| 21.07. | Semiconductor technologies for sub-1nm chips | ||
| 21.07. | EU approves €659m for German semiconductor projects | ||
| 21.07. | NVIDIA expands Agent Toolkit with Omniverse libraries for physical AI | ||
| 21.07. | Microsoft adopts AMD Helios AI platform for Azure expansion | ||
| 21.07. | Terra Innovatum plans SOLO microreactors for broadcasters | ||
| 21.07. | SEMI forecasts global semiconductor equipment sales to reach record $229.5bn in 2028 | ||
| 20.07. | NVIDIA and Japan launch national AI infrastructure for robotics |