- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 22.08. | Infineon AIROC CYW20829 joins Intel Evo accessory program | ||
| 21.08. | Molex innovates 3U VPX power supply for space-constrained applications | ||
| 21.08. | An OpenLane successor for open source chip design | ||
| 21.08. | Buck controller for USB-C power boosts performance, cuts size | ||
| 21.08. | Czinger adopts VI-grade real-time simulation environment | ||
| 20.08. | IonQ expands quantum computing patents portfolio towards commercialisation | ||
| 20.08. | UK needs 7000 AI chip designers over the next five years says report | ||
| 20.08. | Neurophos to test out optical AI chip in Norway | ||
| 20.08. | Nvidia ships longawaited Jetson Thor AI chips | ||
| 19.08. | Amphenol settles Credo patent case, leaves Molex and TE | ||
| 19.08. | Softbank backs Intel in $2bn deal | ||
| 19.08. | 150mm fab closures are a structural industry risk | ||
| 18.08. | TMR boost for VR and medical magnetic sensors | ||
| 18.08. | 4D LiDAR targets smart infrastructure, traffic control, and security | ||
| 18.08. | NeoLogic raises funds for energy-efficient server CPUs | ||
| 15.08. | Tiling process mounts InP optical devices on 300mm substrate | ||
| 15.08. | Nvidia taps Cadence power analysis tool as it respins Rubin chip | ||
| 14.08. | Spirent and Telescent partner on optical switching for test lab automation | ||
| 14.08. | NTT DATA taps Google to drive agentic AI and cloud technology | ||
| 14.08. | Hybrid photonic-terahertz chip for communications and sensing | ||
| 14.08. | Wireless Projects and Engineering Insights: Elektor Lab Talk #37 | ||
| 14.08. | Elektor Engineering Insights to Spotlight the Software-Defined Vehicle | ||
| 14.08. | Best practice for automotive AI sensor setup | ||
| 13.08. | QSMP-25 module integrates STM32 MPU for edge AI | ||
| 13.08. | Partnership streamlines IoT connectivity and rapid prototyping |
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