| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 08:49 | IBM and Siemens team up to advance 3D nanostack chip technology | ||
| 08:19 | DigiKey Invests $100 Million in Distribution Expansion | ||
| 08:19 | ASML hits record €11.7 billion sales as AI chip demand surges | ||
| 07:49 | Siemens invests in Skeleton to tackle AI data center power spikes | ||
| Mi | The Fundamentals of Electromagnetic Compliance | ||
| Mi | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| Mi | Selecting Current Sense Transformers for Switched-mode Power Supplies | ||
| Mi | Common Mode Chokes: Simulation, Design, and Unconventional Applications | ||
| Mi | Forward or Flyback? Which is Better? Both! | ||
| Mi | Fortastra spacecraft programme gains $30m in Series A | ||
| Mi | Practical MOSFET Electronics: From Theory to Working Circuits | ||
| Mi | Global 300mm fab equipment spending to hit $227 billion by 2029 | ||
| Mi | Siemens to digitalize one of Europe's largest green hydrogen plants | ||
| Mi | Infineon hot-swap controller protects 800 VDC AI server power systems | ||
| Mi | Hi rel connectivity for EVs and rail | ||
| Mi | Nvidia commits $250m to UK agentic AI safety research | ||
| Mi | Conta-Clip introduces IP66 cable entry system for rail applications | ||
| Di | DeepGate, Synthara, VAEngineering, HCP Sense: Fast Forward Startups #2 | ||
| Di | Higher data rates and electrification are reshaping harsh-environment connectors in modern transportation | ||
| Di | HARTING boosts high-current connectors with double-contact design | ||
| Di | ODU AGV charging connectors deliver up to 600 A | ||
| Di | Belden M12 push-pull connectors cut installation time by 80% | ||
| Di | pSemi Adds Two RF Modules for 2.4 GHz IoT | ||
| Di | ams OSRAM joins Credo-led OCP optical interconnect standardization effort | ||
| Di | Infineon and ZuriQ scale trapped-ion quantum chips |