- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 15:49 | Cadence tries again with £2.5m design centre in Wales | ||
| 15:19 | Siemens to cut a third of jobs in EV charging business | ||
| 13:19 | BlueHalo advances long-haul laser communication capability | ||
| 12:49 | High-power LTE-M/NB-IoT module targets private LTE and utilities | ||
| 11:49 | VIAVI adds 800G module to field tester | ||
| 09:49 | Nvidia looks to silicon photonics to cut datacentre AI power | ||
| 09:49 | POET samples 800G optical engine for datacentre interconnect | ||
| Do | Consortium to develop open AI models for the power grid | ||
| Do | Backdoor in Espressif Bluetooth microcontroller - update | ||
| Do | SEEQC builds first quantum GPU interface | ||
| Do | Infineon adds six protocols to XMC7000 microcontroller | ||
| Do | Security digital twin for RISC-V space chip | ||
| Do | SoftBank confirms Ampere Computing deal for $6.5bn | ||
| Do | D-Wave quantum blockchain boosts security and efficiency | ||
| Do | First 48V integrated hot-swap eFuse with power-path protection | ||
| Do | Clarinox and Insight SIP partner on embedded wireless | ||
| Do | Cost-effective EMI test receivers offer expandable features | ||
| Do | Industry groups boost call for EU Chips Act 2.0 | ||
| Do | Nvidia accelerates Feynman chip design, manufacture on Blackwell GPU | ||
| Do | Integrated electronics can assemble complex, functional devices | ||
| Do | Raspberry Pi adds 2MB stacked flash to RP2354 microcontroller | ||
| Mi | World's first 12 layer HBM4 DRAM chip for AI | ||
| Mi | Lithium-Ion battery gauge chips add pre-validated management firmware | ||
| Mi | Entry-level safety-critical MCUs cut cost and complexity? | ||
| Mi | NVIDIA unveils open-source foundation model for humanoid robots |
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