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| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 17:49 | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| 17:19 | Semiconductor technologies for sub-1nm chips | ||
| 13:19 | EU approves €659m for German semiconductor projects | ||
| 12:49 | NVIDIA expands Agent Toolkit with Omniverse libraries for physical AI | ||
| 12:49 | Microsoft adopts AMD Helios AI platform for Azure expansion | ||
| 10:19 | Terra Innovatum plans SOLO microreactors for broadcasters | ||
| 10:19 | SEMI forecasts global semiconductor equipment sales to reach record $229.5bn in 2028 | ||
| Mo | NVIDIA and Japan launch national AI infrastructure for robotics | ||
| Mo | Skullcandy Crusher 720 Brings THX Spatial Audio | ||
| Sa | The Fundamentals of Electromagnetic Compliance | ||
| Sa | Selecting Current Sense Transformers for Switched-mode Power Supplies | ||
| Sa | Common Mode Chokes: Simulation, Design, and Unconventional Applications | ||
| Sa | Forward or Flyback? Which is Better? Both! | ||
| Fr | Europe unveils electrification plan to drive competitiveness | ||
| Fr | Adtran expands rural fiber network in Illinois | ||
| Do | PLACITECH maker projects return for EEI #61 | ||
| Do | 3M and Microsoft partner on AI data center optics and enterprise AI | ||
| Mi | Arm expands Arteris security tools across CPU designs | ||
| Mi | Distribution and supply chain under pressure: how the channel is rewriting the rules | ||
| Mi | Fourth-generation ultrasonic frontend brings an architectural shift to high-precision smart metering | ||
| Mi | Qorvo signs lifecycle deal for RF components | ||
| Mi | NVIDIA Ising decoder cuts quantum error rates 347x | ||
| Mi | ASML posts €9.3bn Q2 sales, raises 2026 outlook | ||
| 14.07. | NextGO Epi raises €2m for gallium oxide wafers | ||
| 14.07. | Intel invests €5bn to expand Ireland chip manufacturing |
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