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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | Ethernet drives into the software defined vehicle | ||
| Fr | EV battery cooling for faster charging with Hydrohertz's Dectravalve | ||
| Fr | Nokia and NestAI advance physical AI with €100M partnership | ||
| Fr | Webinar: The Future of Physical AI with Edge Impulse | ||
| Fr | TriC3-equipped motor gate driver for reduced FET heat and EMI | ||
| Fr | Megawatt charging test system targets next-gen EV development | ||
| Do | Acoustic Drone Detection | ||
| Do | Last call: Register now for the Elektor conference on post-quantum cryptography | ||
| Do | Microchip expands 10BASE-T1S portfolio to accelerate zonal architecture adoption | ||
| Do | NVLink Fusion joins Arm Neoverse for next-gen AI data centers | ||
| Mi | Molex eHV60 high-voltage connector targets auxiliary EV systems | ||
| Mi | €1.4bn boost for European company innovation | ||
| Mi | Arduino unveils Nesso N1 pocket IoT kit with multi-protocol connectivity | ||
| Mi | 3D DRAM breakthrough promises major AI inference performance gains | ||
| Di | ST's VNF1248F automotive e-fuse controller targets 48 V power distribution | ||
| Di | AMD maps out strategy for leadership in future compute and AI | ||
| Di | Electronic warfare market accelerates | ||
| Di | Board-to-board connector market moves toward $16B by 2030 | ||
| 14.11. | Global electronic sensor market set to surpass $41 billion by 2032 | ||
| 13.11. | Smart Eye's DMS software named CES 2026 honoree | ||
| 13.11. | Global FPGA market on track for $19.34 billion by 2030 | ||
| 12.11. | Advancements in anti-jamming GNSS antennas | ||
| 12.11. | Connext Drive 4.0 adds AI to SDV communication | ||
| 12.11. | Analog Devices atreamlines wmbedded AI with CodeFusion Studio 2.0 | ||
| 11.11. | NXP adds EIS to EV battery management |
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