- 24 h
- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | Tower Semiconductor & Nvidia team up on 1.6T silicon photonics for AI data centers | ||
| Fr | Infineon completes Thailand backend fab sale to MPI | ||
| Fr | ROHM expands nano cap LDO portfolio with 500 mA devices | ||
| Fr | TI Silicon Labs acquisition: TI to buy Silicon Labs for $7.5bn | ||
| Do | Dassault Systèmes and NVIDIA build industrial AI platform around virtual twins | ||
| Do | Biodegradable PCB targets short-lifetime electronics | ||
| Do | Analysis of volatile compounds in recycled lithium-ion battery material using HS-GCMS | ||
| Mi | Intel unveils Intel Xeon 600 for high-end workstations | ||
| Mi | Siemens acquires Canopus AI to boost AI-driven semiconductor metrology | ||
| Mi | Mercedes-Benz and NVIDIA launch autonomous S-Class | ||
| Mi | Hyundai and Kia outline UWB-based Vision Pulse driver safety system | ||
| Mi | Eurocircuits targets growth with Avedon partnership in PCB prototyping | ||
| Mi | Balcony solar storage: batteries and safety (watch the Elektor livestream) | ||
| Di | India outlines incentives for lithium and nickel processing | ||
| Di | Variscite launches SMARC SoM series with i.MX 8M Plus module | ||
| Mo | TSMC AI capacity: Huang says Nvidia demand could force a doubling | ||
| Mo | Quantum supremacy moves to the foundry | ||
| Mo | BMW Group cuts EU fleet CO2 emissions to 90 g/km in 2025 | ||
| Mo | EU Policy Shift Puts REEVs on Fast Track to Double Sales by 2030 | ||
| 31.01. | Daimler Truck outlines hydrogen truck pilot production in Germany | ||
| 30.01. | Micron launches $24bn advanced wafer fab project in Singapore | ||
| 30.01. | ASML reports €32.7bn sales, €9.6bn net income for 2025 | ||
| 30.01. | Fibocom launches LTE Cat.1 bis module | ||
| 30.01. | Samtec ships 0.80 mm pitch high-speed edge card sockets from stock | ||
| 29.01. | Upwind raises $250m to scale runtime-first cloud security |
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