| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 12:49 | SDR with HackRF One & HackRF Pro using GNU Radio | ||
| 10:19 | Toshiba Introduces 80 V Power MOSFET for AI Data Centers | ||
| 10:19 | Crédit Agricole and Pasqal expand strategic quantum partnership | ||
| 09:49 | D-Wave secures $1.5m NSF grant for fault-tolerant quantum research | ||
| 07:19 | ServiceNow and Accenture launch AI cybersecurity migration services | ||
| 07:19 | SEMI expects 300mm memory equipment investment to surpass $50bn in 2026 | ||
| Mo | Palantir NVIDIA AI targets secure US agencies | ||
| Mo | South Korea chip hub gets Samsung and SK Hynix backing | ||
| Mo | Rocket Lab Iridium deal creates space services group | ||
| Mo | Roche launches AXELIOS 1 sequencing platform powered by SBX technology | ||
| Mo | KAYTUS Introduces AI Infrastructure Management Platform | ||
| Mo | EU approves German €76m aid for quantum semiconductor test facility | ||
| Mo | Westermo wins Deutsche Bahn rail data transfer challenge with mmWave technology | ||
| So | Infineon CoolGaN selected for BRC Solar power optimizer | ||
| Fr | STMicroelectronics ST54M secure mobile chip adds PQC | ||
| Fr | TE expands 1.27 mm connector portfolio with AMP SMC series | ||
| Fr | Code Metal Acquires Signal Processing Technologies | ||
| Fr | CoreWeave and Conapto expand AI infrastructure in Sweden | ||
| Fr | Powering the AI boom | ||
| Do | The Fundamentals of Electromagnetic Compliance | ||
| Do | Nvidia A100 servers triple in China black market | ||
| Do | EU simplifies energy labels to cut costs and boost digital product information | ||
| Do | Infineon starts production of imaging radar MMIC for centralized ADAS | ||
| Do | SEMI Strategic Materials Conference Targets AI Chip Innovation | ||
| 24.06. | Vertical power delivery platform aims to ease AI infrastructure constraints |