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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 14:49 | Calix Subscriber Agent Simplifies Home Network Management | ||
| 08:49 | The Fundamentals of Electromagnetic Compliance | ||
| 08:49 | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| 08:49 | Selecting Current Sense Transformers for Switched-mode Power Supplies | ||
| 08:49 | Common Mode Chokes: Simulation, Design, and Unconventional Applications | ||
| Mi | CoolIT and Stäubli bring liquid cooling to pluggable optics | ||
| Mi | NVIDIA and Cisco unveil USFP optics for AI factories | ||
| Mi | Molex unveils VersaBeam Mini for high-density AI connectivity | ||
| Mi | Wyze Adds Full-Body Analysis to Smart Scale | ||
| Di | Learn STM32 Programming with MicroPython or Arduino | ||
| Di | Building a More Resilient Component Supply Chain: How Electronics Procurement Is Evolving at electronica 2026 | ||
| Mo | Embedd, Adesio, Understand Tech, weeteq, MYVOX: Fast Forward Startups #3 | ||
| Mo | TokenCore Card Adds Biometric Security to AI Agent Actions | ||
| Mo | Infineon expands PSOC Control C3 family with secure MCUs for motor and power control | ||
| Sa | Samsara Tracking Label Wins TIME Innovation Award | ||
| Fr | Siemens and NVIDIA speed up AI chip lithography by 12x | ||
| Fr | Infineon secures 200mm SiC wafer supply deal with Wolfspeed | ||
| Fr | The Bug That Vanishes When You Look | ||
| Fr | The changing shape of industrial interfaces | ||
| 15.10. | IBM and Siemens team up to advance 3D nanostack chip technology | ||
| 15.10. | DigiKey Invests $100 Million in Distribution Expansion | ||
| 15.10. | ASML hits record €11.7 billion sales as AI chip demand surges | ||
| 15.10. | Siemens invests in Skeleton to tackle AI data center power spikes | ||
| 14.10. | The Fundamentals of Electromagnetic Compliance | ||
| 14.10. | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains |
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