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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Do | TSMC announces A14 chip manufacturing process | ||
| Do | 500Wh battery pack for asteroid mining | ||
| Do | High density power module for edge AI | ||
| Do | ETH Zurich develops algorithm to make AI responses more reliable | ||
| Do | TSMC plans A14 process for 2028 with Synopsys support | ||
| Do | Mitsubishi and Nanofiber to develop quantum computer interconnections | ||
| Do | Graphene to create the fastest Flash Memory | ||
| Do | Thin film pyroelectric boosts themral sensors | ||
| Do | First quantum computer for Poland | ||
| Mi | Marelli to adopt Infineon laser scanning display tech | ||
| Mi | This Ray of Light can stream 1.9 Million HD movies simultaneously | ||
| Mi | Avicena, TSMC optimise photodetector arrays for I/O interconnects | ||
| Mi | Microchip MCUs simplify analogue sensor design | ||
| Mi | Fujitsu, Riken show 256qubit quantum computer | ||
| Mi | Andes teams on FPGA prototyping for RISC-V development | ||
| Mi | Intel moves to chiplets for automotive AI | ||
| Di | Intel makes management changes, CTO to be AI boss, says report | ||
| Di | Lace Lithography uses atoms to go beyond EUVL | ||
| Di | CheckUp tool measures the health of bus batteries | ||
| Di | Open architecture quantum computing specification and testbed | ||
| Di | PICMG releases CompactPCI Serial R3 specification | ||
| Di | Sandisk proposes HBF to replace HBM, enable AI at the edge | ||
| Di | PCB tool aims to protect IP | ||
| Di | Nextchip picks Ceva NPU IP for next-generation ADAS | ||
| Di | EIC to boost defence startups |
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