Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
Fr | Tiling process mounts InP optical devices on 300mm substrate | ||
Fr | Nvidia taps Cadence power analysis tool as it respins Rubin chip | ||
Do | Spirent and Telescent partner on optical switching for test lab automation | ||
Do | NTT DATA taps Google to drive agentic AI and cloud technology | ||
Do | Hybrid photonic-terahertz chip for communications and sensing | ||
Do | Wireless Projects and Engineering Insights: Elektor Lab Talk #37 | ||
Do | Elektor Engineering Insights to Spotlight the Software-Defined Vehicle | ||
Do | Best practice for automotive AI sensor setup | ||
Mi | QSMP-25 module integrates STM32 MPU for edge AI | ||
Mi | Partnership streamlines IoT connectivity and rapid prototyping | ||
Mi | First wireless OLED contact lens for wearable diagostics | ||
Mi | Blaming drought on old emails is madness | ||
Di | Elektor presents a post-quantum cryptography online conference | ||
Di | Alif ships first Ethos U85 AI microcontroller | ||
Di | EnSilica adds mixed-signal design centre in Budapest | ||
Di | Magnachip up for sale as boss steps down, capex slashed | ||
Di | ISG report finds German firms embrace AI cybersecurity | ||
Di | Geespace launches 11 satellites with a single rocket | ||
Mo | Nexperia ESD protection diodes for USB4 and Thunderbolt | ||
Mo | Ultrasonic wireless charging for implantable sensors | ||
08.08. | SECO adds edge AI applications to hub | ||
08.08. | Lyten to buy NorthVolt assets out of bankruptcy | ||
07.08. | First MIPI SWI3S manager and peripheral controller IP | ||
07.08. | Sandisk, sk Hynix team for HBF High Bandwidth Flash | ||
07.08. | First AI-enabled battery test system for thermal runaway |