| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 09:19 | RTI Connext adopted in Voyis autonomous subsea platforms | ||
| 07:19 | Ambiq expands R&D in Singapore to accelerate edge AI | ||
| Mi | Samsung and Keysight push 6G forward with 7GHz X-MIMO test | ||
| Mi | Industrial eMMC targets long-term supply for embedded designs | ||
| Mi | New report: AI leadership gap threatens European competitiveness | ||
| Di | Capgemini partners with OpenAI to scale enterprise AI agents | ||
| Di | Pentera wins GM Sectec partner award on LATAM momentum | ||
| Di | SEMI expands North America board | ||
| Di | Toshiba adds 40V eFuse ICs in TSOP6F for compact power protection | ||
| Mo | SEALSQ boosts quantum strategy with new EeroQ investment | ||
| Mo | Meta scales AI data centers with NVIDIA | ||
| Mo | World's first humanoid robot combat league debuts in China | ||
| Mo | Europe's stealth leading-edge process technology | ||
| So | Space-grade LVDS driver targets 600 Mbps satellite data links | ||
| Fr | Practical MCU crypto: turning security theory into firmware you can run | ||
| 19.02. | Automotive MOSFET lineup expands with ROHM HPLF5060 package | ||
| 19.02. | Determination of essential metals and trace elements in black mass | ||
| 19.02. | AI sensor boom to drive $85.6B MEMS packaging market by 2030 | ||
| 18.02. | Phison: NAND shortage could hit consumer electronics in 2026 | ||
| 18.02. | Microchip and Hyundai explore 10BASE-T1S for in-vehicle networks | ||
| 17.02. | Volkswagen starts production of China Electronic Architecture for ICVs | ||
| 17.02. | GlobalFoundries and Renesas expand partnership for U.S. chip manufacturing | ||
| 17.02. | Wireless EV charging market forecast to hit $12.4 billion by 2033 | ||
| 17.02. | OpenClaw Scanner targets AI agent exposure with endpoint detection | ||
| 16.02. | Echodyne expands radar production with $40m facility |