| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 11:19 | HPE and NVIDIA boost security for agentic AI | ||
| 10:49 | Wolfspeed Adds Premium 200 mm SiC Substrate | ||
| 09:49 | Infineon SiC powers Eaton solid-state transformer for 800V AI data centers | ||
| Di | The Fundamentals of Electromagnetic Compliance | ||
| Di | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| Di | Selecting Current Sense Transformers for Switched-mode Power Supplies | ||
| Di | Common Mode Chokes: Simulation, Design, and Unconventional Applications | ||
| Di | Forward or Flyback? Which is Better? Both! | ||
| Di | Anthropic IPO reveals $518bn in infrastructure commitments | ||
| Di | Wise Integration and Navitas team on AI power conversion | ||
| Di | PEI-Genesis expands harsh-environment connector operations | ||
| Di | Built to Survive: Harsh-Environment Military and Aerospace Connector Trends | ||
| Di | Hi-rel connectors for drones, electric aircraft and eVTOL | ||
| Di | DOCOMO AI Cold Start Model Improves Predictions | ||
| Mo | OpenAI pauses frontier AI training after agent security breach | ||
| Mo | NineDot Adds 20 MW Battery Energy Storage Site | ||
| Fr | DF150 Power Supply for Extreme Environments | ||
| Fr | AdaCore GNAT Foundry puts AI code through formal proof | ||
| Do | Edge AI shifts onto MCUs at EWNA 2026 | ||
| Do | IBM study finds AI workforce skills gap | ||
| Do | Imec and TSMC expand advanced-node chip design access | ||
| Do | AMD $1 trillion market cap follows AI data centre surge | ||
| Do | Qualcomm Snapdragon Sound Gen 2 targets AI wearables | ||
| Do | Cognex launches AI-powered wafer reader for chip fabs | ||
| 23.09. | Embedded AI takes centre stage at EWNA 2026 |