| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Do | Edge AI shifts onto MCUs at EWNA 2026 | ||
| Do | IBM study finds AI workforce skills gap | ||
| Do | Imec and TSMC expand advanced-node chip design access | ||
| Do | AMD $1 trillion market cap follows AI data centre surge | ||
| Do | Qualcomm Snapdragon Sound Gen 2 targets AI wearables | ||
| Do | Cognex launches AI-powered wafer reader for chip fabs | ||
| Mi | Embedded AI takes centre stage at EWNA 2026 | ||
| Mi | Semtech brings 50G fronthaul to 5G-Advanced | ||
| Mi | ABB launches Infinitus DC portfolio for AI data centers | ||
| Mi | EU Commission launches data centre energy rating scheme | ||
| Mi | Nexperia and Tata Electronics partner on semiconductor manufacturing in India | ||
| Mi | Ceer Exobot debuts as Saudi Arabia's first national EVs | ||
| Di | Marvell unveils 2nm optical interconnects for AI data centers | ||
| Di | WISeKey and SEALSQ plan post-quantum semiconductor center in Jura | ||
| Di | IonQ speeds engineering simulation with quantum computing | ||
| Di | Semtech backs XPO with 200G/lane optical ICs | ||
| Di | Arteris extends NoC IP across multi-die chiplet designs | ||
| Di | ACDSee adds privacy-first AI for photographers | ||
| Di | Acer sees PC prices falling in late 2027 | ||
| Mo | The Fundamentals of Electromagnetic Compliance | ||
| Mo | Direct Liquid-Cooled Power Modules for Commercial EV Drivetrains | ||
| Mo | Selecting Current Sense Transformers for Switched-mode Power Supplies | ||
| Mo | Common Mode Chokes: Simulation, Design, and Unconventional Applications | ||
| Mo | Forward or Flyback? Which is Better? Both! | ||
| Mo | Crusoe modular data centres target AI inference bottleneck |