| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Fr | SiC raw materials rise as 6-inch substrates face price war | ||
| Fr | EU digital package promises €155B in savings with streamlined AI and data rules | ||
| Fr | Emnify joins EU-funded 6G research to advance IoT connectivity | ||
| Fr | Infineon's new PSOC 4 integrates local processing for advanced EV battery management | ||
| Do | Toshiba outlines gate driver IC for BLDC motors | ||
| Do | Bosch begins Hybrion PEM electrolysis operations in Bamberg | ||
| Do | Renesas breaks 9600 MT/s barrier with Gen6 DDR5 RCD | ||
| Mi | Tesla advances in-house AI5 chip as AI6 enters development | ||
| Mi | Interview: Post-Quantum Cryptography and the Future of Embedded Security | ||
| Mi | 'Daft' US semiconductor patent proposal is another front in the China trade war | ||
| Mi | FIREFLY IRED upgrade boosts AR/VR eye-tracking performance | ||
| Di | Post-quantum cryptography in vehicles: Why now is the right time | ||
| Di | SuperQ MOSFETs set new safety benchmark for high-voltage battery packs | ||
| Mo | GSMA Warns 6G Will Require up to Triple Today's Mid-band Spectrum | ||
| Mo | EU approves €450M boost for Onsemi's SiC power chip plant | ||
| Mo | IAR and Quintauris partner on functional safety software for RISC-V automotive systems | ||
| Mo | Infineon CoolGaN technology boosts next-gen Enphase microinverters | ||
| So | ECSA releases 2025 skills strategy report | ||
| So | OpenAI-Foxconn team-up targets next-gen AI hardware manufacturing | ||
| 22.11. | China advances wafer-scale 2D semiconductor FPGA research | ||
| 22.11. | SEMI Europe issues recommendations for the next European Chips Act | ||
| 22.11. | STM32V8 pushes 18nm microcontroller tech into new performance territory | ||
| 21.11. | Ethernet drives into the software defined vehicle | ||
| 21.11. | EV battery cooling for faster charging with Hydrohertz's Dectravalve | ||
| 21.11. | Nokia and NestAI advance physical AI with €100M partnership |