| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| Sa | Daimler Truck outlines hydrogen truck pilot production in Germany | ||
| Fr | Micron launches $24bn advanced wafer fab project in Singapore | ||
| Fr | ASML reports €32.7bn sales, €9.6bn net income for 2025 | ||
| Fr | Fibocom launches LTE Cat.1 bis module | ||
| Fr | Samtec ships 0.80 mm pitch high-speed edge card sockets from stock | ||
| Do | Upwind raises $250m to scale runtime-first cloud security | ||
| Do | TouchNetix expands with AX24A touch and force controller | ||
| Do | Analysis of trialkyl phosphates as markers for lithium battery aging | ||
| Do | Debugging the future: Rolf Segger on J-Link, open source, and embedded longevity | ||
| Mi | Precision picoammeter webinar: picoamp I-V measurements - webinar with Johannes Sturz | ||
| Mi | SEALSQ shows post-quantum robotics concept at Davos | ||
| Mi | SEALSQ introduces Quantum Highway platform | ||
| Mi | OpenEvidence lands $250M to scale medical AI platform | ||
| Mi | Intel outlines thick-core glass substrate concept for AI data centre packaging | ||
| Di | NXP unveils eIQ Agentic AI framework for secure edge autonomy | ||
| Di | Keysight targets megawatt charging test challenges in e-mobility | ||
| Di | IonQ to acquire SkyWater Technology | ||
| Di | Tageos-Wiliot partnership targets scalable ambient IoT with battery-free BLE | ||
| 26.01. | BEN lands $2.05M AI licensing deal to expand into Africa | ||
| 26.01. | Cisco launches 360 Partner Program for the AI era | ||
| 25.01. | Corvex deploys NVIDIA H200 GPUs to support production AI | ||
| 24.01. | LF Networking brings AI-native networking summits to India and Europe | ||
| 23.01. | Edge Impulse's Jan Jongboom on scaling AI to the smallest devices | ||
| 23.01. | Inside Apple's Macintosh: systems that shaped computing | ||
| 23.01. | Linux Foundation pushes open source AI with expanded 2026 events program |