| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 27.02. | HP Q1 2026 earnings: revenue beats, but HP flags cost headwinds | ||
| 26.02. | AMD and Meta deepen AI partnership with 6GW GPU roadmap | ||
| 26.02. | RTI Connext adopted in Voyis autonomous subsea platforms | ||
| 26.02. | Ambiq expands R&D in Singapore to accelerate edge AI | ||
| 25.02. | Samsung and Keysight push 6G forward with 7GHz X-MIMO test | ||
| 25.02. | Industrial eMMC targets long-term supply for embedded designs | ||
| 25.02. | New report: AI leadership gap threatens European competitiveness | ||
| 24.02. | Capgemini partners with OpenAI to scale enterprise AI agents | ||
| 24.02. | Pentera wins GM Sectec partner award on LATAM momentum | ||
| 24.02. | SEMI expands North America board | ||
| 24.02. | Toshiba adds 40V eFuse ICs in TSOP6F for compact power protection | ||
| 23.02. | SEALSQ boosts quantum strategy with new EeroQ investment | ||
| 23.02. | Meta scales AI data centers with NVIDIA | ||
| 23.02. | World's first humanoid robot combat league debuts in China | ||
| 23.02. | Europe's stealth leading-edge process technology | ||
| 22.02. | Space-grade LVDS driver targets 600 Mbps satellite data links | ||
| 20.02. | Practical MCU crypto: turning security theory into firmware you can run | ||
| 19.02. | Automotive MOSFET lineup expands with ROHM HPLF5060 package | ||
| 19.02. | Determination of essential metals and trace elements in black mass | ||
| 19.02. | AI sensor boom to drive $85.6B MEMS packaging market by 2030 | ||
| 18.02. | Phison: NAND shortage could hit consumer electronics in 2026 | ||
| 18.02. | Microchip and Hyundai explore 10BASE-T1S for in-vehicle networks | ||
| 17.02. | Volkswagen starts production of China Electronic Architecture for ICVs | ||
| 17.02. | GlobalFoundries and Renesas expand partnership for U.S. chip manufacturing | ||
| 17.02. | Wireless EV charging market forecast to hit $12.4 billion by 2033 |