| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 19.03. | DigiKey, ST and Ultra Librarian expand eDesignSuite integration | ||
| 19.03. | Renesas adds 28nm automotive MCU for zonal vehicle control | ||
| 19.03. | TI 800 VDC architecture targets AI data centres | ||
| 19.03. | MSEC 2026 to spotlight next-gen MEMS and sensor innovation | ||
| 19.03. | European Commission targets energy independence and lower costs | ||
| 19.03. | Mixed-signal IC targets aerospace actuation systems | ||
| 19.03. | Ferrocene 26.02.0 adds automotive core certification | ||
| 19.03. | Samtec expands AcceleRate Slim cables with new signaling options | ||
| 18.03. | IAR expands DRIVECORE support for software-defined vehicles | ||
| 18.03. | AI startup funding hits $220 billion in two months | ||
| 18.03. | Quantum Machines unveils open stack for hybrid quantum acceleration | ||
| 18.03. | NVIDIA teams with industrial software giants to advance AI engineering | ||
| 17.03. | ROHM unveils SiC reference designs for high-power, three-phase inverters | ||
| 17.03. | New SEMI Europe partnership targets semiconductor expansion in Poland | ||
| 17.03. | Keeping automated production lines moving, without OEM delays | ||
| 17.03. | NVIDIA pushes Physical AI into real-world robotics deployments | ||
| 17.03. | Embedded award 2026 winners point to edge AI shift | ||
| 17.03. | Vector adds VDV 261 support to simplify electric bus preconditioning | ||
| 17.03. | GPT-5.4 knowledge work push targets enterprise users | ||
| 16.03. | NVIDIA and Thinking Machines partner on AI infrastructure | ||
| 16.03. | HONOR explores embodied AI with robot phone concept at MWC 2026 | ||
| 16.03. | Embedded World 2026 headlines Elektor Lab Talk #44 | ||
| 16.03. | IBM half-Möbius molecule shows quantum chemistry edge | ||
| 16.03. | Brilliant Labs and Alif Semiconductor partner on AI silicon for smart glasses | ||
| 16.03. | Efficiency and Reliability with Silicon Carbide JFETs: A Practical Guide for Power Engineers |